Global SemiConsortium
- Holst Centre：
- オランダのTNO (応用科学研究機構)とベルギーのIMECが共同で設立した研究所。フィリップス社の研究センターの跡地に設置。
- IME (Institute of Microelectronics)- A*STAR：
- シンガポールの科学技術研究庁 (A*STAR)傘下にある半導体研究所。LSIプロセスから実装 (3D IC)に至るまで、SiだけではなくGaNやSiCについても研究している。
- IMEC (Interuniversity Microelectronics Centre)：
- ベルギーにある半導体技術の研究所。世界中から人材が集まり、半導体の設計、製造、応用などについて研究する。
- ITRI (Industrial Technology Research Institute )：
- 1973年に台湾で設立された研究開発機構。科学技術の研究開発により、産業発展と経済価値を創造し、社会福祉を促進することをミッションとする。
- LETI (Laboratoire d'Electronique des Technologies de I'information)：
- フランスの科学技術庁CEAの中にある電子情報技術研究所。STMicroelectronicsなどと密に活動している。MEMS技術は定評がある。
- NMI (National Microelectronics Institute)：
- 英国の半導体企業が集まる非営利の業界団体。
- SRC (Semiconductor Research Corp)：
- 米国の半導体研究を推進する大学のコンソーシアム。
- 2026/5/29
- CEA-Leti Presents Die-to-Wafer Hybrid Bonding At 1 μm Pitch, Removing Bottleneck for AI Hardware
- 2026/5/28
- Imec and EV Group demonstrate wafer-to-wafer hybrid bonding with 200nm interconnect pitch and record high overlay accuracy
- 2026/5/21
- IME: A*STAR and Commonwealth Fusion Systems Sign a Collaborative Research Agreement to Advance Fusion Supply Chain Capabilities in Singapore
- 2026/5/19
- IMEC: World first: imec presents quantum dot qubit device using High NA EUV lithography
- 2026/5/19
- ITRI Launches AI Robotics Innovation & Development Center to Strengthen Global Supply Chain
- 2026/5/18
- Imec expands global footprint of imec.ventures with dedicated US presence
- 2026/5/12
- IMEC: IC-Link by imec joins TSMC 3DFabric Alliance
- 2026/5/12
- Imec demonstrates first 3D implementation of a CCD for AI memory applications
- 2026/4/30
- LETI: LID World Summit 2026: Lab-to-Market Transition To Sustainable Chips Powers Next Wave of AI Factories
- 2026/4/14
- ITRI Launches 2026 VLSI TSA International Symposium, Spotlighting Quantum Architecture and AI-Driven Healthcare
- 2026/4/3
- IMEC: Semiconductor-based quantum pilot line ‘SPINS’ launched with EU support
- 2026/4/3
- CEA-Leti, CEA-List and PSMC Collaborate to Integrate RISC-V and MicroLED Silicon Photonics into 3D Stacking and Interposer for Next-Generation AI
- 2026/3/26
- NMI: National Physical Laboratory (NPL) publishes UK priorities for semiconductor metrology and standards
- 2026/3/26
- NMI: PMT (GB) Ltd is launching the A030 0.1μm portable particle counter: Setting a new standard for high-sensitivity cleanroom monitoring
- 2026/3/18
- Imec receives the world’s most advanced High NA EUV system
- 2026/3/12
- Imec launches university consortium around next generation of chips
- 2026/3/11
- LETI: CEA-Leti and NcodiN Partner to Industrialize 300 mm Silicon Photonics for Bandwidth-Hungry AI Interconnects
- 2026/3/5
- IMEC: Next-generation, permanent DNA-based data storage for the AI age
- 2026/3/4
- Holst Centre: Major milestone for the Dutch battery ecosystem
- 2026/3/3
- ITRI Builds Innovation Alliance With Universities and Research Institutes to Advance Technology Strategy and Roadmap
- 2026/3/2
- IMEC: NanoIC opens access to first-ever fine-pitch RDL and D2W hybrid bonding interconnect PDKs
- 2026/2/25
- Imec unlocks lever for EUV dose reduction: oxygen injection during metal-oxide resist post-exposure bake emerges as game-changer for throughput
- 2026/2/20
- Holst Centre: Next-gen wireless innovation boosts in-car monitoring and data speed
- 2026/2/18
- LETI: CEA Demonstrates First Dynamically Routed Electro-Optical Router for Photonic Interposers
- 2026/2/17
- Imec unveils 7‑bit, 175GS/s massively time-interleaved slope-ADC – pairing record-small footprint and low conversion energy with top sampling speed
- 2026/2/14
- ITRI Breaks Ground on Advanced Semiconductor R&D Center Featuring a 12-Inch Pilot Line
- 2026/2/9
- Imec inaugurates NanoIC pilot line, accelerating innovation in sub-2nm systems-on-chip
- 2026/2/6
- IME: A*STAR and Halliburton Launch NEX Lab to Advance Well Completion Innovation
- 2026/2/3
- IMEC: Spatial Dynamics, a new imec spin-off, launches VR platform for objective and inclusive recruitment
- 2026/2/2
- IMEC: NanoIC extends its PDK portfolio with first A14 logic and eDRAM memory PDK
- 2026/2/2
- LETI: Lam Research and CEA-Leti Expand Research and Development Collaboration to Advance Fabrication of Specialty Technologies
- 2026/1/27
- IMEC: Veeco and imec develop 300mm-compatible process to enable integration of barium titanate on silicon photonics
- 2026/1/20
- CEA-Leti Demonstrates Combined MicroLED and Organic Photodetector Architecture For Display-Integrated Optical Sensing
- 2026/1/5
- LETI: R&D Advances for the FAMES Pilot Line: 400 °C CMOS Breakthrough Opens Critical Doors to 3D Integration Goals
- 2025/12/19
- LETI: Sweat Patch’ Delivers Reliable Monitoring for Hydration, Fatigue And Exertion Directly from the Skin
- 2025/12/16
- IMEC: Strategic alignment between imec and Japan’s ASRA aims to harmonize standardization of automotive chiplet architectures
- 2025/12/11
- Imec successfully integrates colloidal quantum dot photodiodes (QDPDs) on metasurfaces developed on 300mm CMOS wafers
- 2025/12/10
- Holst Centre: TNO at Holst Centre and ZSW accelerate Next-Generation Electrolysis Technologies
- 2025/12/10
- Imec advances 2D-material based device technology beyond state of the art in support of the future logic technology roadmap
- 2025/12/10
- LETI: R&D Advances for the FAMES Pilot Line: 400 °C CMOS Breakthrough Opens Critical Doors to 3D Integration Goals
- 2025/12/9
- Imec demonstrates first wafer-scale fabrication of solid-state nanopores using EUV lithography
- 2025/12/8
- Imec mitigates thermal bottleneck in 3D HBM-on-GPU architectures using a system-technology co-optimization approach
- 2025/11/25
- Imec strengthens its global presence with new regional research & development hub in Qatar
- 2025/11/18
- IME: A*STAR And Globalfoundries Collaborate To Further Research In Silicon Photonics For AI Era
- 2025/11/18
- IMEC: NanoIC adds advanced SRAM memory macros to its N2 pathfinding PDK
- 2025/11/18
- CEA-Leti to Launch Multilateral Program to Accelerate AI with MicroLED Data Links
- 2025/11/17
- Imec unveils imec.kelis: a breakthrough tool for AI datacenter design and optimization
- 2025/10/23
- Imec sets electro-optic performance record in thin-film strontium titanate at cryogenic temperatures
- 2025/10/20
- LETI: Soitec and CEA partner to develop automotive cybersecurity with advanced FD-SOI technology
- 2025/10/15
- IMEC: GlobalFoundries, Infineon, Silicon Box, STATS ChipPAC, TIER IV Join imec Automotive Chiplet Program
- 2025/10/6
- Imec launches 300mm GaN program to develop advanced power devices and reduce manufacturing costs
- 2025/10/3
- IME: A*STAR, Rolls-royce, And SAESL Deepen Strategic Partnership For Aerospace Manufacturing And MRO Technologies
- 2025/10/2
- Imec debuts a beyond-110GHz C-band GeSi electro-absorption modulator (EAM) on its 300mm silicon photonics platform
- 2025/10/1
- ITRI and EU Collaborate to Deploy 6G-SANDBOX Toolkit in Taiwan
- 2025/9/29
- SRC: SMART USA Summit Highlight Reel Now Available
- 2025/9/25
- LETI: French Team Led by CEA-Leti Develops First Hybrid Memory Technology Enabling On-Chip AI Learning and Inference
- 2025/9/24
- Imec technology lights the path to utility scale for Diraq’s quantum chips
- 2025/9/22
- Imec achieves new milestones in single patterning High NA EUV lithography for both damascene and direct metal etch metallization processes
- 2025/9/22
- ITRI and the UK’s National Physical Laboratory Partner on Semiconductor Standards
- 2025/9/16
- CEA-Leti to Present Breakthrough Toward Ultra-Compact, High-Resolution AR/VR Displays at MicroLED Connect Conference
- 2025/9/9
- ITRI: Semicon Network Summit Draws Industry Leaders From 28 Countries With a Call for Trusted Global Cooperation
- 2025/9/2
- Holst Centre: TNO at Holst Centre welcomes R&D team Dai Nippon Printing
