セミコンポータル

半導体・FPD・液晶・製造装置・材料・設計のポータルサイト

Global SemiConsortium

Global SemiConsortium
Holst Centre:
オランダのTNO(応用科学研究機構)とベルギーのIMECが共同で設立した研究所。フィリップス社の研究センターの跡地に設置。
IME(Institute of Microelectronics):
シンガポールの半導体研究所。LSIプロセスから実装(3D IC)に至るまで、SiだけではなくGaNやSiCについても研究している。
IMEC(Interuniversity Microelectronics Centre):
ベルギーにある半導体技術の研究所。世界中から人材が集まり、半導体の設計、製造、応用などについて研究する。
LETI(Laboratoire d'Electronique des Technologies de I'information):
フランスの科学技術庁CEAの中にある電子情報技術研究所。STMicroelectronicsなどと密に活動している。MEMS技術は定評がある。
NMI(National Microelectronics Institute):
英国の半導体企業が集まる非営利の業界団体。
UAlbany:
米ニューヨーク州立大学アルバニー校。半導体製造に力を入れ、世界の半導体研究の拠点の一つになっている。ニューヨーク州が熱心に資金提供。
SRC(Semiconductor Research Corp):
米国の半導体研究を推進する大学のコンソーシアム。
SEMATECH(Semiconductor Manufacturing Technology):
半導体プロセスの研究開発を行う米国のコンソーシアム。

2017/3/23
Leti presented advances in propagation modeling and antenna design at EuCAP in Paris
2017/3/21
Imec demonstrates 896Gb/s silicon photonics transceiver
2017/3/14
Leti to release versatile SensiNact Internet of Things platform for open-source development
2017/3/10
SRC: C-SPIN Researchers Flip Magnetic Memory Cell with Light Pulse at Record Speed
2017/3/9
Holst Centre: Solliance and Holst Centre set world record for roll-to-roll produced perovskite-based solar cells with a stabilized efficiency of 12,6%
2017/3/8
Holst Centre: Imec and Holst Centre Present a Digital Receiver Excelling in Energy Efficiency and Small Size for Bluetooth 5 and Beyond
2017/3/8
Imec and Holst Centre Present a Digital Receiver Excelling in Energy Efficiency and Small Size for Bluetooth 5 and Beyond
2017/3/8
Leti announces backside shield that protects microchip from physical attacks
2017/3/7
Imec’s 200mm GaN-on-Si e-mode power devices withstand heavy ion and neutron irradiation
2017/3/6
Imec Presents InGaAs TFET with sub-60 mV/decade sub-threshold swing
2017/3/1
Imec and Besi Demonstrate Long-Term Reliability of Ni-Cu-Ag Plated Solar Modules

2017/2/28
SRC: TSMC Joins Semiconductor Research Corporation
2017/2/23
Holst Centre: DuPont Electronics and Communications and Holst Centre Extend Collaboration On Printed Electronics Research and Application Development
2017/2/22
LETI TO PRESENT LATEST R&D RESULTS ON THREE ALTERNATIVES TO EUV AND 193NM LITHOGRAPHY AT SPIE MEETING IN US
2017/2/9
Ualbany: New York Power Electronics Manufacturing Consortium Headquartered at SUNY Poly Announces Successful First Production of Silicon Carbide-Based Patterned Wafers
2017/2/8
Imec, Holst Centre and ROHM Present Breakthrough Solution for Ultra Low Power Internet of Things radios
2017/2/7
Holst Centre, imec and Cartamundi Introduce Plastic Near Field Communication Tag Communicating with Smartphones
2017/2/7
Imec, Holst Centre and Cartamundi Introduce Plastic Near Field Communication Tag Communicating with Smartphones

2017/1/30
Imec Introduces Snapscan: the First Hyperspectral Imaging Camera that Fuses the Benefits of Snapshot and Linescan technologies
2017/1/30
Imec demonstrates world's first multispectral time-delay-integration image sensor based on CCD-in-CMOS technology
2017/1/25
Imec: ENGIE and EnergyVille collaborate on future smart energy systems
2017/1/23
Imec Introduces New Snapshot Multispectral Image Sensor that Combines Color and Near-Infrared Imaging
2017/1/10
LETI TO DEMONSTRATE NEW MULTICARRIER WAVEFORM FOR 5G NETWORKS ON MINATEC CAMPUS
2017/1/3
Imec and Besi Demonstrate Long-Term Reliability of Ni-Cu-Ag Plated Solar Modules

2016/12/22
Imec Collaborates with Google to Offer Cloud Access to Flemish Startups
2016/12/15
Ualbany: Office of Governor Andrew M. Cuomo News Release: Governor Cuomo Announces Aim Photonics Manufacturing Facility to be Located in Rochester's Eastman Business Park at ON Semiconductor
2016/12/13
Holst Centre and imec Introduce World\'s First Solid-State Multi-Ion Sensor for Internet-of-Things Applications
2016/12/13
Imec and Holst Centre Introduce World’s First Solid-State Multi-Ion Sensor for Internet-of-Things Applications
2016/12/13
LETI TO DEMONSTRATE UNIVERSAL AFFORDABLE BIKE-PEDAL POWER METER AT CES
2016/12/13
AT CES 2017, LETI TO UNVEIL MOST ACCURATE WEARABLE DEVICE FOR CONSUMERS TO MEASURE RELAXATION
2016/12/13
LETI WILL DEMONSTRATE FUSION OF AUTONOMOUS CAR’S SENSES AT CES 2017
2016/12/9
Ualbany: U.S. Photovoltaic Manufacturing Consortium (PVMC) Announces Innovative Solar Energy Optimization Testkit to Provide Partners with Critical Data for Enabling Cost-Effective PV Technology Development and Deployment
2016/12/7
Imec Develops 3D-Compatible Germanium nMOS Gate stack with High Mobility and Superior Reliability
2016/12/6
Imec demonstrates record tunneling magnetoresistance for one of the world's smallest perpendicular magnetic tunnel junctions
2016/12/6
Imec Demonstrates World’s First Vertically Stacked Gate-all-Around Si Nanowire CMOS Transistors
2016/12/1
Leti: SCREEN SEMICONDUCTOR SOLUTIONS AND LETI EXPAND COLLABORATION TO COVER LASER ANNEAL TECHNOLOGY

2016/11/28
Leti: GRENOBLE TEAM DEMONSTRATES WORLD’S FIRST QUBIT DEVICE FABRICATED IN STANDARD CMOS PROCESS
2016/11/24
Holst Centre: Novel high-speed deposition process outperforms current techniques for making displays
2016/11/21
Leti Announces H2020 Project to Develop Si-photonics-based Transceivers for Low-cost, High-speed Data Communications
2016/11/15
Leti: KEEPING IT CLEAN: LETI JOINS FOUR FRENCH PARTNERS TO TEST ‘SMART’ ANTIBACTERIAL SURFACES IN SPACE
2016/11/9
Holst Centre: The first wearable daylight, sunlight and vitamin D coach in the world
2016/11/8
Holst Centre: Small, Energy-Efficient Health Patch from imec and Holst Centre Lays the Foundation for Better Mobile Health Solutions
2016/11/8
Imec: Small, Energy-Efficient Health Patch from imec and Holst Centre Lays the Foundation for Better Mobile Health Solutions
2016/11/3
Leti: ‘OWLY-EYED’: NEXT-GEN LOW-NOISE IMAGING TECHNOLOGY DEVELOPED BY LETI FOR FRENCH SME PYXALIS
2016/11/3
Leti: More computations for less energy - the European way

2016/10/31
Imec Reports Breakthrough Work that Advances Path for Nanoscale Spin-Wave Majority Gates
2016/10/13
Ualbany: Power Electronics Industry Collaborative News Release: SUNY Polytechnic Institute-Led NY Power Electronics Manufacturing Consortium and PEIC Announce Partnership to Strengthen U.S.-Based Power Electronics Industry
2016/10/10
Ualbany: SUNY Poly Receives $400,000 Worth of Cutting Edge Lab and Testing Equipment and Software from National Instruments
2016/10/4
Holst Centre: Imec and Holst Centre Present the World's Most Energy-Efficient Biomedical Sensor Hub for Wearable Health Applications
2016/10/4
Imecとホルストセンターが、ウェアラブル健康アプリケーションのための世界で最もエネルギー効率が高いバイオメディカルセンサーハブを発表
2016/10/4
LETI AND INSTITUTE FOR INFORMATION INDUSTRY OF TAIWAN PARTNER ON TECHNOLOGIES FOR INTERNET OF THINGS, 5G

2016/9/29
NMI: Innovative development hub to advance UK engineering
2016/9/27
Imec: Stacked Perovskite/CIGS Solar Module Achieves Unprecedented Efficiency at 17.8 Percent
2016/9/23
NMI’s AESIN Capability Directory 2016/17 is now online
2016/9/22
Holst Centre: OLED on ceramic heralds new possibilities for durable, flexible lighting and displays
2016/9/22
Imec: Merger between centers imec and iMinds completed
2016/9/21
LETI ORDERS HERCULES NIL SYSTEM FROM EV GROUP
2016/9/19
IME: Applied Materials and A*STAR's Institute of Microelectronics to Advance R&D in Fan-Out Wafer Level Packaging
2016/9/16
NMI: Evince secures £0.75 million of new investment for breakthrough diamond-based electronics
2016/9/13
Imec: ERC Starting Grant to revolutionize the efficiency, cost and stability of thin-film solar cells
2016/9/6
Leti: EU PROJECT TO PRESENT LATEST ON TECHNOLOGY AND ARCHITECTURE DEVELOPMENT FOR BRAIN-INSPIRED ICs
2016/9/1
Ualbany: AIM Photonics Welcomes PhoeniX Software as Newest Member of National Manufacturing Institute
2016/9/1
NMI: Moortec Announce Embedded Process Monitor on TSMC 16FF+

2016/8/31
SRC: NXP Semiconductors Joins SRC
2016/8/25
Ualbany: AIM Photonics Announces Release of Process Design Kit (PDK) for Integrated Silicon Photonics Design
2016/8/17
NMI: A tie up between Reliability Solutions, UK and Reliability Centre India
2016/8/16
SRC: Tokyo Electron Limited Joins SRC

2016/7/26
A*STAR's IME Kicks Off Consortia to Develop Advanced Packaging Solutions for Next-Generation Internet of Things Applications and High-Performance Wireless Data Transfer Technologies
2016/7/26
Leti: EU AND JAPAN EXPAND COLLABORATION TARGETING NEWGENERATION
2016/7/19
Holst Centre: Imec and Holst Centre developed Wireless EEG Headset for Emergency Room and Intensive Care Unit Patients with Nihon Kohden
2016/7/19
Imec developed Wireless EEG Headset for Emergency Room and Intensive Care Unit Patients with Nihon Kohden
2016/7/14
NMI: Embedded Systems Engineering Degree Apprenticeship Approved
2016/7/13
LETI AND KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY TO COLLABORATE ON KEY AREAS FOR GROWING DIGITAL ERA
2016/7/12
LETI DEVELOPS 3D NETWORK-ON-CHIP TO IMPROVE HIGH-PERFORMANCE COMPUTING
2016/7/11
Imec and Synopsys Collaborate on Interconnect Resistivity Model to Enable Early Screening of Interconnect Technology Options at Advanced Nodes
2016/7/11
Imec Extends its Global R&D Innovation Footprint with Opening of imec Florida
2016/7/8
Imec Extends its Global R & Innovation Footprint with Opening of imec Florida
2016/7/8
Leti: Nova and Leti collaborate to enhance process control schemes for advanced lithography
2016/7/5
Imec: Fashion designer Jasna Rok showcases collection based on smart plastics and smart textiles

2016/6/30
IME: A*STAR's IME Launches Chip-on-Wafer Consortium II and Cost-Effective Interposer Consortium to Advance Chip Packaging Solutions for High-Volume Manufacturing
2016/6/22
Ualbany: Precision Optical Transceivers Acquires Membership with AIM Photonics to Advance Local Photonics Sector
2016/6/20
Imec Demonstrates Highly Efficient Bifacial Solar Cells with near 100% Bifaciality
2016/6/20
NMI: Available for Purchase: Texas Instruments 200mm / 150mm fab, Greenock, Scotland
2016/6/16
Imec Demonstrates Gate-All-Around MOSFETs with Lateral Silicon Nanowires at Scaled Dimensions
2016/6/16
Imec demonstrates Junction-less Gate-All-Around Lateral and Vertical Nanowire FET Devices
2016/6/16
SRC: Electronic Nose Using CMOS Integrated Circuits Analyzes Breath
2016/6/8
IME: A*STAR IME's Consortium to Deepen Capabilities in MEMS Technologies for Industrial Internet of Things, Automotive, and Indoor Navigation Applications
2016/6/6
Holst Centre: Imec, Holst Centre and Methods2Business Develop Complete Low-Power Wi-Fi HaLow Radio Solution for Internet of Things (IoT) Applications
2016/6/6
Imec, Holst Centre and Methods2Business Develop Complete Low-Power Wi-Fi HaLow Radio Solution for Internet of Things (IoT) Applications

2016/5/26
NMI: AESIN launch unique UK Automotive Electronics Capability Directory
2016/5/25
Imec and its Solliance Partners Present First Semi-Transparent Perovskite Modules
2016/5/25
Imec, Holst Centre and Barco Silex Collaborate on Data Security for Wearables and Internet of Things Networks
2016/5/24
Imec and Infineon Cooperate on 79 GHz CMOS Radar Sensor Chips for the Automotive Industry
2016/5/24
Imec and Holst Centre Present Multi-Standard Low-Power Wide-Area Radio Chip
2016/5/17
Imec Expands its Silicon Platform for Quantum Computing Applications
2016/5/16
Imec: IQE Joins imec’s Gallium Nitride-on-Silicon Industrial Affiliation Program
2016/5/16
「STARC RTL設計スタイルガイド」 に含まれる 弊社 技術のオープン化 について
2016/5/12
Leti: The CEA announces expanded collaboration with Intel to advance cutting-edge research and innovation in key digital areas
2016/5/11
NMI: Andrew Ashby appointed Vice Chairman of the Automotive Electronic Systems Innovation Network (AESIN)
2016/5/8
Imec: Solliance realizes first up-scaled Perovskite based PV modules with 10% efficiency.
2016/5/3
Imec Honors Dr. Gordon Moore with “Lifetime of Innovation Award”

2016/4/29
Imec Reports 14 Percent Growth in 2015
2016/4/27
Imec: Cartamundi, imec and Holst Centre win “Best Product” award at Printed Electronics Europe
2016/4/22
Ualbany: Governor Cuomo Announces Groundbreaking of SUNY Polytechnic Institute's State-of-the-Art Chip Fab for ams AG at Marcy NanoCenter
2016/4/14
Imec and Crystal Solar Demonstrate 22.5 Percent nPERT Si Solar Cells on Kerfless Epitaxial Wafers
2016/4/14
NMI: Open innovation, Japan and the UK
2016/4/12
LETI EXTENDS COLLABORATION WITH QUALCOMM ON COOLCUBE 3D INTEGRATION TECHNOLOGY FOR HIGH-DENSITY, HIGH-PERFORMANCE ICs

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