Global SemiConsortium
- Holst Centre:
- オランダのTNO (応用科学研究機構)とベルギーのIMECが共同で設立した研究所。フィリップス社の研究センターの跡地に設置。
- IME (Institute of Microelectronics)- A*STAR:
- シンガポールの科学技術研究庁 (A*STAR)傘下にある半導体研究所。LSIプロセスから実装 (3D IC)に至るまで、SiだけではなくGaNやSiCについても研究している。
- IMEC (Interuniversity Microelectronics Centre):
- ベルギーにある半導体技術の研究所。世界中から人材が集まり、半導体の設計、製造、応用などについて研究する。
- ITRI (Industrial Technology Research Institute ):
- 1973年に台湾で設立された研究開発機構。科学技術の研究開発により、産業発展と経済価値を創造し、社会福祉を促進することをミッションとする。
- LETI (Laboratoire d'Electronique des Technologies de I'information):
- フランスの科学技術庁CEAの中にある電子情報技術研究所。STMicroelectronicsなどと密に活動している。MEMS技術は定評がある。
- NMI (National Microelectronics Institute):
- 英国の半導体企業が集まる非営利の業界団体。
- SRC (Semiconductor Research Corp):
- 米国の半導体研究を推進する大学のコンソーシアム。
- 2024/3/13
- IMEC: Spanish government, region of Andalusia and imec sign Memorandum of Understanding (MoU) with the intention to establish a new 300mm R&D process line for specialized chip technologies
- 2024/3/12
- SRC: A Strategic Blueprint for Innovation
- 2024/3/7
- ITRI Establishes Southeast Asia Office to Foster Taiwan-Thailand Collaboration
- 2024/3/5
- Holst Centre: TactoTek and TNO at Holst Centre Partner to Advance In-Mold Structural Electronics (IMSE) and IMSE Circularity
- 2024/3/1
- IME: The Role of R&D In Singapore's Shared Future
- 2024/2/27
- IMEC: EU Consortium Developing Next-Gen Edge-AI Technologies Is Accepting Design Proposals
- 2024/2/27
- Imec presents levers to reduce the CO2 equivalent footprint of lithography and etch for advanced technology nodes
- 2024/2/26
- Holst Centre: From pills to pulses: Electrifying medicine using the peripheral nervous system
- 2024/2/26
- Imec demonstrates readiness of the High-NA EUV patterning ecosystem
- 2024/2/21
- Imec Unveils Breakthrough ADC Architecture for Very High-Speed Wireline Applications, Excelling in Area & Power Efficiency
- 2024/2/21
- CEA-Leti Develops Novel Architecture for Keyword-Spotting (KWS) In Always-On, Voice-Activated Edge-AI Systems
- 2024/2/20
- Imec pioneers unique, low-power UWB receiver chip: 10x more resilient against Wi-Fi and (beyond) 5G interference
- 2024/2/19
- Imec introduces compact wireless powering technology featuring record low energy consumption
- 2024/2/16
- Imec launches the first design pathfinding process design kit for N2 node
- 2024/2/2
- ITRI Partners with Mexico’s Sonora to Foster Science Park Development
- 2024/1/26
- ITRI and Intel Taiwan Unveil Cutting-Edge Joint Lab for HPC Cooling Certification
- 2024/1/26
- CEA-Leti Papers at Photonics West Report Progress Towards MicroLED Bandwidth and Efficiency Improvement
- 2024/1/17
- ITRI and TSMC Collaborate on Advancing High-Speed Computing with SOT-MRAM
- 2024/1/17
- NMI: Infinitesima Limited Completes Investment Round Ramps production of Metron3D to address market for in-line sub-nanometer 3D process control of advanced semiconductors
- 2024/1/4
- IMEC: Perovskite LEDs, a thousand times brighter than OLEDs
- 2023/12/14
- Imec and Mitsui Chemicals sign strategic partnership agreement to commercialize CNT pellicle technology for EUV lithography
- 2023/12/12
- Imec demonstrates GaN-on-Si MISHEMTs with excellent performance for 5G-advanced base station and mobile device applications
- 2023/12/8
- Imec expands its presence in the USA
- 2023/12/5
- Applied Materials and CEA-Leti Unveil Joint Lab For Rapidly Growing Specialty Chip Markets
- 2023/11/21
- ITRI and 6G-SANDBOX Signs MoU to Propel 6G Innovations
- 2023/11/14
- Imec grants public access to virtual fab for quantifying environmental impact of IC manufacturing
- 2023/10/18
- IME: A*STAR launches EV Battery Testing and Disassembly Line, as part of wider efforts to build battery remanufacturing capabilities
- 2023/10/18
- IME: A*STAR launches Distributed Smart Value Chain programme which enables manufacturers to band together to swiftly respond to demand and supply changes
- 2023/10/17
- ITRI: 2023 ITRI ICT TechDay Focusing on LEO Satellites, IoV, Cyber Security, 5G Communications, and GAI
- 2023/10/17
- LETI: CEA-Leti Launches R&D Program to Improve ‘Cooperation’ Between Autonomous Vehicles Via V2X Communication
- 2023/10/3
- ITRI and University of Arts Linz Sign MOU to Combine Robotics R&D with Austria Artistic Energy
- 2023/10/2
- IMEC: 200 gigabits per second
- 2023/9/20
- ITRI Leads Global Semiconductor Collaboration for Heterogeneous Integration to Pioneer Pilot Production Solutions
- 2023/9/12
- ITRI Holds Envisioning a Better Future International Forum Featuring Global Industry Giants
- 2023/9/7
- Holst Centre: Next-gen Equipment for Batteries and Battery materials
- 2023/9/5
- IMEC: Axithra, a spin-off of imec and Ghent University, raises 10M Euro
- 2023/8/23
- ITRI Joins HARTU Project to Drive European Industries towards Collaborative Manufacturing
- 2023/8/14
- Imec integrates thin-film pinned photodiode into superior short-wave-infrared imaging sensors
- 2023/7/26
- IME: A*STAR Leads R&D Programme With 10 Industry Partners To Develop High-performance Ev Component, And Boost Local EV Supplier Ecosystem
- 2023/7/20
- IMEC: Enfoil, a new Hasselt University and imec spin-off, produces thin, flexible solar panels
- 2023/6/28
- Imec and ASML sign Memorandum of Understanding (MoU) to support semiconductor research and sustainable innovation in Europe
- 2023/6/20
- ITRI and EURECOM Sign an MoU on 6G Cooperation
- 2023/6/20
- LETI: Concentrated competence in battery management: Vitesco Technologies France cooperates with CEA
- 2023/6/19
- LETI: Extending Moore’s Law: CEA-Leti & Intel to Develop Atomically Thin 2D TMDs on 300mm Wafers Using Layer Transfer Technology for Future Transistor Scaling
- 2023/6/17
- ITRI Set to Strengthen Taiwan-UK Collaboration on Semiconductors
- 2023/6/15
- Holst Centre and Asahi Kasei demonstrate next-generation touchless user interface for displays
- 2023/6/12
- IMEC: Advanced semiconductor packaging approach from AT&S and imec lays the foundation for compact, cost-efficient, and high-performance 140 GHz radar & 6G mobile communications systems
- 2023/6/9
- Imec’s novel ultra-wideband transceiver combines best-ranging precision with record low power consumption
- 2023/6/2
- CEA-Leti Proof of Concept Demonstrates Electrons Move Faster in Germanium Tin Than in Silicon or Germanium
- 2023/6/1
- IME: Ross Digital and A*STAR Establish New Programme to Drive Innovation For the Food Services Industry
- 2023/5/24
- NMI: The Latest NMI Directory is NOW AVAILABLE
- 2023/5/23
- Imec first to demonstrate conductor films on 300mm wafers with lower resistivity than Cu and Ru
- 2023/5/19
- NMI: Techworks acknowledges the governments publication of its long-awaited semiconductor strategy
- 2023/5/16
- IMEC: GlobalFoundries, Samsung Electronics, and TSMC Join Imec’s “Sustainable Semiconductor Technologies & Systems” (SSTS) Program
- 2023/4/26
- IME: Launching Networked Virtual Watch Tower Project for Supply Chain Performance
- 2023/4/25
- IME: A*STAR Establishes Centre for Maritime Digitalisation With Flagship Research Programme to Deploy Ai Technologies in the Maritime Industry
- 2023/4/23
- IME: Another Giant Leap Into Space: Successful Launch of Lumelite-4 to Enhance Maritime Communications
- 2023/4/20
- NMI: BPC Electronics Invests in Wire Bonder to Better Serve e-Mobility and Energy Storage Sectors
- 2023/4/18
- ITRI: 2023 ITRI Net Zero Day Brings Industry Technological and Financing Solutions for Net Zero Emissions by 2050
- 2023/4/13
- Holst Centre: TNO at Holst Centre and ZSW announce Li-ion battery collaboration
- 2023/4/13
- IME: Transforming the Future of Healthcare: Singhealth and A*STAR Partner to Foster Healthcare Innovations
- 2023/4/13
- CEA-Leti to Report Progress on 3D Interconnects for Wafer-Level Platforms
- 2023/4/4
- Rapidus, Japan’s newly founded chip manufacturer, joins imec’s Core Partner Program
- 2023/4/3
- SRC Opens 2023 Call for Research