セミコンポータル

半導体・FPD・液晶・製造装置・材料・設計のポータルサイト

Global SemiConsortium

Global SemiConsortium
Holst Centre:
オランダのTNO(応用科学研究機構)とベルギーのIMECが共同で設立した研究所。フィリップス社の研究センターの跡地に設置。
IME(Institute of Microelectronics):
シンガポールの半導体研究所。LSIプロセスから実装(3D IC)に至るまで、SiだけではなくGaNやSiCについても研究している。
IMEC(Interuniversity Microelectronics Centre):
ベルギーにある半導体技術の研究所。世界中から人材が集まり、半導体の設計、製造、応用などについて研究する。
LETI(Laboratoire d'Electronique des Technologies de I'information):
フランスの科学技術庁CEAの中にある電子情報技術研究所。STMicroelectronicsなどと密に活動している。MEMS技術は定評がある。
NMI(National Microelectronics Institute):
英国の半導体企業が集まる非営利の業界団体。
UAlbany:
米ニューヨーク州立大学アルバニー校。半導体製造に力を入れ、世界の半導体研究の拠点の一つになっている。ニューヨーク州が熱心に資金提供。
SRC(Semiconductor Research Corp):
米国の半導体研究を推進する大学のコンソーシアム。
SEMATECH(Semiconductor Manufacturing Technology):
半導体プロセスの研究開発を行う米国のコンソーシアム。

2021/2/16
Imec Showcases World’s First Sub-5mW, IEEE 802.15.4z Ultra-Wideband Transmitter Chip
2021/2/11
Leti: Legrand and CEA combine their expertise to develop a new generation wireless and batteryless switch
2021/2/9
Imec Demonstrates 20nm Pitch Line/Space Resist Imaging with High-NA EUV Interference Lithography
2021/2/9
CEA-Leti Announces EU Project to Create Dynamically Programmable Wireless 6G Environments
2021/2/4
Leti: New EU Quantum Flagship consortium launches a project on silicon spin qubits as a platform for large-scale quantum computing
2021/2/4
Leti: French Team on Route Towards an Interposer Prototype for Quantum And Control Chips Integration at Very Low Temperature
2021/2/3
Leti: CEA Is the First Research Center to Acquire A Cryogenic Prober for Testing Quantum Bits
2021/2/2
Leti: New EU Quantum Flagship consortium launches a project on silicon spin qubits as a platform for large-scale quantum computing
2021/2/2
Leti: French Team on Route Towards an Interposer Prototype for Quantum And Control Chips Integration at Very Low Temperature
2021/2/2
CEA-Leti Team Paves the Way for Massive Integration of Qubits, Critical for Achieving Quantum Supremacy
2021/2/1
SRC Newsletter: January Issue
2021/2/1
SRC Connections at 2021 ISSCC

2021/1/28
The NMI Member Product Catalogue is an opportunity for our members to promote their products and services to the TechWorks communities.
2021/1/26
Imec: How working with imec’s hyperspectral experts helped fast-track success for the French startup, Tridimeo
2021/1/26
CEA-Leti Reports Breakthrough High-Performance Gyroscope For Automotive, Aeronautic and Industrial Applications
2021/1/21
Holst Centre: Discover our new Executive Report
2021/1/19
CEA-Leti Reports Machine-Learning Breakthrough That Opens Way to Edge Learning
2021/1/12
Looking back on imec’s highlights from 2020

2020/12/18
CEA-Leti Scientists Present In-Memory Computing Pathways for Edge-AI & Neural Networks with 3D Architectures & Resistive-RAM
2020/12/17
Imec presents smallest finFET-based biosensor for high-sensitivity molecule detection
2020/12/16
Leti: Aledia Announces it Has Produced its First Nanowire Chips on 300mm Silicon Wafers Using CEA-Leti Pilot Lines
2020/12/15
Imec Demonstrates Capacitor-less IGZO-Based DRAM Cell With >400s Retention Time
2020/12/15
CEA to Enable High-Performance Processors That Will Power Exascale Computing
2020/12/9
Imec Presents a Thin-Film Short-Wave-InfraRed Image Sensor with Sub-2µm Pixel Pitch
2020/12/3
Imec Applies Photolithography To Push Functionality and Reliability Barriers In OLED Display Manufacturing

2020/11/26
Imec and XIMEA launch industrial grade hyperspectral camera solution addressing the high-quality standards for machine vision applications
2020/11/18
Imec: New imec research program pursues the development of scalable and energy-efficient 6G device technology

2020/10/29
CEA-Leti to Build Quantum-Photonics Platform to Ensure Ultra-Secure Data for Finance, Energy, Defense and Other Industries
2020/10/28
Holst Centre: Advanced interactive surfaces by TNO at Holst Centre: consoles and control panels re-invented
2020/10/27
CEA-Leti Announces Collaboration with Intel to Advance Chip Design Through Cutting-Edge 3D Packaging Technologies
2020/10/23
Imec begins developing SARS-CoV-2 test to identify positive cases and confirm whether someone is contagious in less than five minutes
2020/10/20
Holst Centre: TNO at Holst Centre part of Madras project, a new European consortium
2020/10/13
CEA Achieves Mass-Spectrometry Breakthrough that Paves the Way to Detecting Viruses
2020/10/9
Imec presents alternative metals in advanced interconnect and contact schemes as a path to 2nm technology nodes
2020/10/3
Leti: Light Communications Alliance formed by Global Industry Leaders
2020/10/3
Leti and Partners in PiezoMAT Project Develop New Fingerprint Technology For Highly Reliable Security and ID Applications
2020/10/2
NMI: The NMI Directory 20/21 is now available to download

2020/9/25
IME: AI Tool to Enhance COVID-19 Screening

2020/8/28
Holst Centre: InSCOPE project boosts printed electronics past the research phase
2020/8/4
Imec presents low-power 60 GHz radar chip for contactless health tracking in battery-powered devices

2020/7/22
Imec: Five trends that will shape the future semiconductor technology landscape
2020/7/21
Leti: HORIBA Medical and CEA-Leti to develop tomorrow’s diagnostics at the point of care.
2020/7/15
Holst Centre’s near infrared vein detection sensor takes biometric security to a new level
2020/7/14
Imec: University of Antwerp and imec launch Crowdscan, a new spin-off to measure crowds without compromising personal privacy
2020/7/8
Imec and GLOBALFOUNDRIES Announce Breakthrough in AI Chip, Bringing Deep Neural Network Calculations to IoT Edge Devices
2020/7/1
Leti: New consortium to develop a 5G and beyond strategic roadmap for future European connectivity systems and components

2020/6/24
Holst Centre: The Province of Noord-Brabant, Economic Affairs & Climate Policy and TNO invest in Holst Centre’s new generation battery technology
2020/6/24
IME: SingHealth and A*STAR co-developed smart chatbot to enhance care for COVID-19 patients at community care facilities
2020/6/23
Imec: Deltaray enables zero-defect product manufacturing
2020/6/23
Leti: EU Team Demonstrates Full Data-Transfer Silicon Photonics Module Delivering 100 Gb/s and Develops Building Blocks for Tb/s
2020/6/22
CEA-Leti Scientists Demonstrate CMOS Device Fabrication at 500°C, Paving the Way to High-Performance 3D Monolithic CMOS Integration
2020/6/19
Holst Centre creates method for effective production of electrolytes for solid-state batteries
2020/6/16
Imec Overcomes Fundamental Operation Challenge for Voltage-Controlled Magnetic Random-Access Memories (RAM)
2020/6/15
Imec Demonstrates Excellent Performance of Si FinFET CMOS devices with Integrated Tungsten Buried Power Rails
2020/6/15
CEA-Leti Demonstrates Breakthrough Architecture for HPC Devices Using Gate-All-Around Nanosheet Fabrication Process
2020/6/11
CEA-Leti Researchers Breakthrough put Record for LiFi Communications Using Single GaN Blue Micro-Light-Emitting Diode
2020/6/10
NMI: Moortec Launches New In-Chip Technology
2020/6/9
Holst Centre: Nederlandse uitvinding spatial Atomic Layer Deposition (sALD) van groot belang voor mondiale hightech industrie

2020/5/19
Imec combines advanced machine learning algorithms and innovations in chip design to achieve cm accuracy and low-power ultra wideband localization
2020/5/13
Imec: Lopos, a spin-off of imec and the Ghent University, presents the SafeDistance wearable that helps employees follow social distancing guidelines
2020/5/8
Ualbany: SUNY Poly's Dr. Spyridon Galis' 'Engineered telecom emission and controlled positioning of Er3+ enabled by SiC nanophotonic structures' research published in Nanophotonics
2020/5/7
CEA-Leti Explores Technology Roadmap For Sixth-Generation Wireless Networks in mmWave Bands
2020/5/5
Imec: Roswell Biotechnologies and Imec to Develop First Molecular Electronics Biosensor Chips for Infectious Disease Surveillance, Precision Medicine and DNA Storage
2020/5/5
Leti: A wireless detonation system designed to increase productivity and safety at open pit mines

2020/4/28
Imec Builds World’s First Spiking Neural Network-Based Chip for Radar Signal Processing
2020/4/21
Imec: European research institutes and industry partners join forces to develop high-performance solar panels with improved environmental profiles
2020/4/14
SRC: Call for Research in Hardware Security
2020/4/3
IME: SINGAPORE MARSHALLS R&D EFFORTS TO COMBAT COVID-19
2020/4/2
Leti: Compact Model Developed at CEA-Leti for FD-SOI Technologies Designated as a Chip-Industry Standard
2020/4/2
Ualbany: SUNY Poly Faculty and Staff Begin Manufacturing Personal Protective Equipment to Assist Front-Line Medical Workers

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