Global SemiConsortium
- Holst Centre：
- オランダのTNO (応用科学研究機構)とベルギーのIMECが共同で設立した研究所。フィリップス社の研究センターの跡地に設置。
- IME (Institute of Microelectronics)- A*STAR：
- シンガポールの科学技術研究庁 (A*STAR)傘下にある半導体研究所。LSIプロセスから実装 (3D IC)に至るまで、SiだけではなくGaNやSiCについても研究している。
- IMEC (Interuniversity Microelectronics Centre)：
- ベルギーにある半導体技術の研究所。世界中から人材が集まり、半導体の設計、製造、応用などについて研究する。
- ITRI (Industrial Technology Research Institute )：
- 1973年に台湾で設立された研究開発機構。科学技術の研究開発により、産業発展と経済価値を創造し、社会福祉を促進することをミッションとする。
- LETI (Laboratoire d'Electronique des Technologies de I'information)：
- フランスの科学技術庁CEAの中にある電子情報技術研究所。STMicroelectronicsなどと密に活動している。MEMS技術は定評がある。
- NMI (National Microelectronics Institute)：
- 英国の半導体企業が集まる非営利の業界団体。
- SRC (Semiconductor Research Corp)：
- 米国の半導体研究を推進する大学のコンソーシアム。
- 2026/2/25
- Imec unlocks lever for EUV dose reduction: oxygen injection during metal-oxide resist post-exposure bake emerges as game-changer for throughput
- 2026/2/20
- Holst Centre: Next-gen wireless innovation boosts in-car monitoring and data speed
- 2026/2/18
- LETI: CEA Demonstrates First Dynamically Routed Electro-Optical Router for Photonic Interposers
- 2026/2/17
- Imec unveils 7‑bit, 175GS/s massively time-interleaved slope-ADC – pairing record-small footprint and low conversion energy with top sampling speed
- 2026/2/14
- ITRI Breaks Ground on Advanced Semiconductor R&D Center Featuring a 12-Inch Pilot Line
- 2026/2/9
- Imec inaugurates NanoIC pilot line, accelerating innovation in sub-2nm systems-on-chip
- 2026/2/6
- IME: A*STAR and Halliburton Launch NEX Lab to Advance Well Completion Innovation
- 2026/2/3
- IMEC: Spatial Dynamics, a new imec spin-off, launches VR platform for objective and inclusive recruitment
- 2026/2/2
- IMEC: NanoIC extends its PDK portfolio with first A14 logic and eDRAM memory PDK
- 2026/2/2
- LETI: Lam Research and CEA-Leti Expand Research and Development Collaboration to Advance Fabrication of Specialty Technologies
- 2026/1/27
- IMEC: Veeco and imec develop 300mm-compatible process to enable integration of barium titanate on silicon photonics
- 2026/1/20
- CEA-Leti Demonstrates Combined MicroLED and Organic Photodetector Architecture For Display-Integrated Optical Sensing
- 2026/1/5
- LETI: R&D Advances for the FAMES Pilot Line: 400 °C CMOS Breakthrough Opens Critical Doors to 3D Integration Goals
- 2025/12/19
- LETI: Sweat Patch’ Delivers Reliable Monitoring for Hydration, Fatigue And Exertion Directly from the Skin
- 2025/12/16
- IMEC: Strategic alignment between imec and Japan’s ASRA aims to harmonize standardization of automotive chiplet architectures
- 2025/12/11
- Imec successfully integrates colloidal quantum dot photodiodes (QDPDs) on metasurfaces developed on 300mm CMOS wafers
- 2025/12/10
- Holst Centre: TNO at Holst Centre and ZSW accelerate Next-Generation Electrolysis Technologies
- 2025/12/10
- Imec advances 2D-material based device technology beyond state of the art in support of the future logic technology roadmap
- 2025/12/10
- LETI: R&D Advances for the FAMES Pilot Line: 400 °C CMOS Breakthrough Opens Critical Doors to 3D Integration Goals
- 2025/12/9
- Imec demonstrates first wafer-scale fabrication of solid-state nanopores using EUV lithography
- 2025/12/8
- Imec mitigates thermal bottleneck in 3D HBM-on-GPU architectures using a system-technology co-optimization approach
- 2025/11/25
- Imec strengthens its global presence with new regional research & development hub in Qatar
- 2025/11/18
- IME: A*STAR And Globalfoundries Collaborate To Further Research In Silicon Photonics For AI Era
- 2025/11/18
- IMEC: NanoIC adds advanced SRAM memory macros to its N2 pathfinding PDK
- 2025/11/18
- CEA-Leti to Launch Multilateral Program to Accelerate AI with MicroLED Data Links
- 2025/11/17
- Imec unveils imec.kelis: a breakthrough tool for AI datacenter design and optimization
- 2025/10/23
- Imec sets electro-optic performance record in thin-film strontium titanate at cryogenic temperatures
- 2025/10/20
- LETI: Soitec and CEA partner to develop automotive cybersecurity with advanced FD-SOI technology
- 2025/10/15
- IMEC: GlobalFoundries, Infineon, Silicon Box, STATS ChipPAC, TIER IV Join imec Automotive Chiplet Program
- 2025/10/6
- Imec launches 300mm GaN program to develop advanced power devices and reduce manufacturing costs
- 2025/10/3
- IME: A*STAR, Rolls-royce, And SAESL Deepen Strategic Partnership For Aerospace Manufacturing And MRO Technologies
- 2025/10/2
- Imec debuts a beyond-110GHz C-band GeSi electro-absorption modulator (EAM) on its 300mm silicon photonics platform
- 2025/10/1
- ITRI and EU Collaborate to Deploy 6G-SANDBOX Toolkit in Taiwan
- 2025/9/29
- SRC: SMART USA Summit Highlight Reel Now Available
- 2025/9/25
- LETI: French Team Led by CEA-Leti Develops First Hybrid Memory Technology Enabling On-Chip AI Learning and Inference
- 2025/9/24
- Imec technology lights the path to utility scale for Diraq’s quantum chips
- 2025/9/22
- Imec achieves new milestones in single patterning High NA EUV lithography for both damascene and direct metal etch metallization processes
- 2025/9/22
- ITRI and the UK’s National Physical Laboratory Partner on Semiconductor Standards
- 2025/9/16
- CEA-Leti to Present Breakthrough Toward Ultra-Compact, High-Resolution AR/VR Displays at MicroLED Connect Conference
- 2025/9/9
- ITRI: Semicon Network Summit Draws Industry Leaders From 28 Countries With a Call for Trusted Global Cooperation
- 2025/9/2
- Holst Centre: TNO at Holst Centre welcomes R&D team Dai Nippon Printing
- 2025/7/4
- IME: A*STAR And Siemens Collaborate To Advance Smart And Sustainable Manufacturing Solutions
- 2025/7/4
- ITRI Advances Taiwan’s 6G Global Partnerships in the EU and the UK
- 2025/7/1
- IME: NSTIC (GaN) Launched to Lead Singapore in Advanced GaN Semiconductor Innovation
- 2025/6/20
- LETI: EU Project ELENA Pioneers LNOI Platform for Next-Gen Photonic Circuits & Europe’s 1st Commercial Supplier of LNOI Wafers
- 2025/6/19
- NMI: TechWorks and Canadian Semiconductor Council Sign Memorandum of Understanding to Strengthen UK – Canadian Semiconductor Innovation and Collaboration
- 2025/6/18
- CEA-Leti and Soitec Announce Strategic Partnership to Leverage FD-SOI for Enhanced Security of Integrated Circuits
- 2025/6/16
- Imec and Tokyo Electron extend partnership to accelerate the development of beyond-2nm nodes
- 2025/6/16
- LETI: Applied Materials and CEA-Leti Expand Joint Lab To Drive Innovation in Specialty Chips
- 2025/6/12
- Imec achieves record-breaking RF GaN-on-Si transistor performance for high-efficiency 6G power amplifiers
- 2025/6/11
- Imec presents 150 GSa/s Digital-to-Analog Converter (DAC) achieving 300 Gb/s data transmission
- 2025/6/5
- Imec and Ghent University present a fully-integrated, single-chip microwave photonics system for compact and versatile signal processing
- 2025/6/6
- LETI: FAMES Pilot Line Launches FAMES Academy To Train Europe’s Chip Engineers with Skills to Leverage FD-SOI Technology and Design Circuits Using Advanced Setups
- 2025/6/3
- Imec demonstrates 16nm pitch Ru lines with record-low resistance obtained using a semi-damascene integration approach
- 2025/5/29
- ITRI, MediaTek, and Chunghwa Telecom Advance Satellite-Ready B5G Infrastructure
- 2025/5/28
- ITRI Opens UK Office and Launches Collaboration With Catapult Network
- 2025/5/27
- IMEC: 300mm RF silicon interposer platform for chiplet-based heterogeneous integration demonstrates record-low insertion loss at frequencies up to 325GHz
- 2025/5/27
- LETI: Towards next-generation edge-AI technologies: EU consortium opens services to external customers
- 2025/5/22
- IME: A*STAR's Inaugural "Innovate Together" Showcases Singapore's Semiconductor Ambitions On Global Stage
- 2025/5/21
- Imec Joins Forces with MIT’s RLE, MTL and IMES to Accelerate Personalized Healthcare
- 2025/5/13
- NMI: centrotherm clean solutions Becomes Pfeiffer Vacuum+Fab Solutions
- 2025/5/7
- Holst Centre launches photonics lab boosting research and development for integrated photonics in the Netherlands
- 2025/5/7
- Imec and TNO launch Holst Centre Photonics Lab
