Global SemiConsortium
- Holst Centre：
- オランダのTNO (応用科学研究機構)とベルギーのIMECが共同で設立した研究所。フィリップス社の研究センターの跡地に設置。
- IME (Institute of Microelectronics)- A*STAR：
- シンガポールの科学技術研究庁 (A*STAR)傘下にある半導体研究所。LSIプロセスから実装 (3D IC)に至るまで、SiだけではなくGaNやSiCについても研究している。
- IMEC (Interuniversity Microelectronics Centre)：
- ベルギーにある半導体技術の研究所。世界中から人材が集まり、半導体の設計、製造、応用などについて研究する。
- ITRI (Industrial Technology Research Institute )：
- 1973年に台湾で設立された研究開発機構。科学技術の研究開発により、産業発展と経済価値を創造し、社会福祉を促進することをミッションとする。
- LETI (Laboratoire d'Electronique des Technologies de I'information)：
- フランスの科学技術庁CEAの中にある電子情報技術研究所。STMicroelectronicsなどと密に活動している。MEMS技術は定評がある。
- NMI (National Microelectronics Institute)：
- 英国の半導体企業が集まる非営利の業界団体。
- SRC (Semiconductor Research Corp)：
- 米国の半導体研究を推進する大学のコンソーシアム。
- 2022/9/28
- Holst Centre: TNO and imec launch photonics collaboration
- 2022/9/23
- ITRI and Oxford Instruments Announce Breakthrough Development in GaN HEMT Device Performance
- 2022/9/22
- Imec researchers at Ghent University and Nokia Bell Labs work to debut key building block for the deployment of 100G PON networks
- 2022/9/20
- Leti: CEA RF Chip Enables Ultralow-Power IoT Connectivity For Remote Devices Via Astrocast’s Nanosatellite Network
- 2022/9/16
- Holst Centre to host launch of ECOTRON project
- 2022/9/13
- LETI: Valeo and the CEA to collaborate on advanced research in power electronic to prepare for tomorrow’s electric mobility
- 2022/9/2
- IME: Finland And Singapore’s National Quantum Office Ink Mou
- 2022/8/31
- NMI: Alter Technology: Start of mass production for plastic encapsulated semiconductor chips
- 2022/8/16
- NMI: New funding competition from Driving the Electric Revolution: Scale-up for PEMD
- 2022/8/2
- IMEC: 20 Year Roadmap: Tearing Down The Walls
- 2022/8/2
- ITRI Hosts 2022 International Workshop on Trustworthy AI to Discuss Trust and Ethics in AI
- 2022/7/26
- IME: TCOMS opens Ocean Basin facility to strengthen Research and Development capabilities
- 2022/7/22
- Imec joins euROBIN, a new unified European platform for R&D on AI-driven Robotics
- 2022/7/14
- NMI: Busch: Avoiding Unscheduled Downtime in Semicon Fabs with Preventive Vacuum Service
- 2022/7/12
- IME: A*STAR and Johnson & Johnson Vision ink MoU for eye health digital innovation consortium
- 2022/7/7
- ITRI and Pegatron’s 5G O-RAN Energy-Saving System Wins SCF Small Cell Award 2022
- 2022/7/7
- CEA-Leti Barn-Owl Inspired, Object-Localization System Uses Up to ‘5 Orders of Magnitude’ Less Energy than Existing Technology
- 2022/7/5
- NMI: Ilika Commences Economic Assessment on Placing a 100 MWh Solid State Battery Manufacturing Line at the UK Battery Industrialisation Centre
- 2022/6/30
- Imec Shows Path to Line Resistance Halving using Semi-Damascene with High-Aspect-Ratio Processing
- 2022/6/28
- IMEC: Swave, a new Imec and VUB, Spin-off, Raises €7M to Deliver Truly Realistic AR/VR Experiences to Applications Like the Metaverse
- 2022/6/27
- ITRI Partners with Industry and Academia in Joint Announcement of Leading-Edge Magnetic Memory Technology
- 2022/6/23
- IMEC: DYAMAND, a new imec and Ghent University spin-off, launches ‘eSave’ – reducing building owners’ heating costs by up to 30%
- 2022/6/16
- Imec's new direct-digitization readout design enables small, low-noise, low-power neural interfaces
- 2022/6/16
- CEA & Partners Present ‘Powerful Step Towards Industrialization’ Of Linear Si Quantum Dot Arrays Using FDSOI Material at VLSI Symposium
- 2022/6/14
- Imec demonstrates backside power delivery with buried power rails for back- and frontside routing
- 2022/6/2
- CEA-Leti & Intel Report Die-to-Wafer Self-Assembly Breakthrough Targeting High Alignment Accuracy and Throughput
- 2022/4/26
- IME: Launch Of Smu-A*star Joint Lab In Social & Human-centred Computing
- 2022/4/25
- Imec Ramps Up the Development of the High-NA EUV Patterning Ecosystem
- 2022/4/8
- Leti: Leading Semiconductor Players to Advance Next Generation FD-SOI Roadmap for Automotive, IoT and Mobile Applications
- 2022/4/7
- IME: Innovating For Game-changing Green Technologies
- 2022/4/7
- SRC selected by NIST for critical roadmap work
- 2022/4/4
- Imec and Bühler Leybold enable high-throughput manufacturing of filter-on-chip CMOS sensors with unmatched precision
- 2022/3/24
- Leti: CEA and Startup C12 Join Forces to Develop Next-Generation Quantum Computers with Multi-Qubit Chips at Wafer Scale
- 2022/3/22
- Holst Centre: Bayflex Solutions Unveils First Continuous Testing Lab in Europe at Holst Centre
- 2022/3/22
- Imec.xpand II reaches an important milestone on its way to become one of world’s most impactful, early-stage funds dedicated to semiconductor innovation
- 2022/3/16
- IME: Developing Solutions with PSA to Manage AGV Fleets at Tuas Port
- 2022/3/8
- IME: A*STAR Sets Up New Research Institute To Support Singapore’s Sustainability Goals
- 2022/3/3
- ITRI and UCLA to Collaborate on World-Leading Memory Technology Development
- 2022/3/1
- ITRI and Pegatron Exhibit Taiwan’s First 5G O-RAN Energy-Saving Private Network Solution at MWC 2022
- 2022/3/1
- Leti: CEA and Spectronite Develop Software Radio For Spectrally Efficient Backhaul Solutions
- 2022/2/28
- Holst Centre: Imec Pioneers Ultra-Wideband Transmitter Chip That Pushes Data Rates up to 1.66Gb/s with Milliwatt Power.
- 2022/2/24
- Imec Pioneers Ultra-Wideband Transmitter Chip That Pushes Data Rates up to 1.66Gb/s with Milliwatt Power
- 2022/2/24
- ITRI, BizLink, and Japan Biotechno Pharma Launch iPMx Molecular Rapid Test System for COVID-19 in Japan
- 2022/2/22
- Imec, KU Leuven and PragmatIC Semiconductor demonstrate fastest 8-bit flexible microprocessor for low-power applications
- 2022/1/28
- ITRI and USC Launch Next-Generation Semiconductor Cooperation
- 2022/1/11
- SRC: Purdue-SRC partner in pursuit of advanced microelectronics, semiconductor workforce
- 2022/12/28
- ITRI: Heterogeneous Integration Chip-let System Package Alliance Established to Expand Market Opportunities
- 2021/12/23
- IME: Applied Materials and A*STAR’s Institute of Microelectronics Expand Research Collaboration to Accelerate Heterogeneous Chip Integration with Hybrid Bonding Technology
- 2021/12/22
- ITRI’s VLSI-TSA and VLSI-DAT Symposia Will Kick Off in April 2022
- 2021/12/15
- Leti: HfO2-Based FeRAM Arrays Designed & Fabricated at CEA-Leti Bring the Technology Closer to Manufacturability
- 2021/12/13
- Holst Centre: Thin and flexible scanner reads fingerprints from nail to nail
- 2021/12/13
- Imec demonstrates successful monolithic integration of Schottky diodes and depletion-mode HEMTs with 200 V GaN-IC
- 2021/12/2
- CEA-Leti Research Team Proposes New Approach for Next-Generation Memories with RRAM Energy-Storage Breakthrough
- 2021/11/26
- IME: A*STAR's IME & Stmicroelectronics Team Up On Silicon Carbide R&D For Ev Market, Industrial Applications
- 2021/11/18
- CEA-Leti Unveils Breakthrough for Mass-Market, High-Performance, Navigation-Grade Gyroscopes
- 2021/11/12
- ITRI-AIST Joint Symposium 2021 Held to Foster Technology Upgrades
- 2021/11/5
- NMI: Bosch to invest another $467 million to boost chipmaking capacity
- 2021/11/4
- ITRI and Oxford Instruments Foster Cooperation on Semiconductor Measurement Technology
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