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Global SemiConsortium

Global SemiConsortium

Holst Centre：: オランダのTNO (応用科学研究機構)とベルギーのIMECが共同で設立した研究所。フィリップス社の研究センターの跡地に設置。
IME (Institute of Microelectronics)- A*STAR：: シンガポールの科学技術研究庁 (A*STAR)傘下にある半導体研究所。LSIプロセスから実装 (3D IC)に至るまで、SiだけではなくGaNやSiCについても研究している。
IMEC (Interuniversity Microelectronics Centre)：: ベルギーにある半導体技術の研究所。世界中から人材が集まり、半導体の設計、製造、応用などについて研究する。
ITRI (Industrial Technology Research Institute )：: 1973年に台湾で設立された研究開発機構。科学技術の研究開発により、産業発展と経済価値を創造し、社会福祉を促進することをミッションとする。
LETI (Laboratoire d'Electronique des Technologies de I'information)：: フランスの科学技術庁CEAの中にある電子情報技術研究所。STMicroelectronicsなどと密に活動している。MEMS技術は定評がある。
NMI (National Microelectronics Institute)：: 英国の半導体企業が集まる非営利の業界団体。
SRC (Semiconductor Research Corp)：: 米国の半導体研究を推進する大学のコンソーシアム。

2023/1/27: Imec hyperspectral camera paves the way for in-vivo detection of low-grade gliomas
2023/1/26: Imec demonstrates combined VIS & NIR spectral camera system, complemented with hi-res RGB imaging, for data acquisition at video rate
2023/1/24: IMEC: IoSA, a new spin-off of UAntwerp and imec, develops animal behavior monitoring tool for research, conservation, and agriculture purposes
2023/1/19: LETI: Electric vehicles: CEA and Renault Group develop a very high efficiency bidirectional on-board charger
2023/1/4: SRC Launches JUMP 2.0 Consortium Aimed at Leap-Ahead Microelectronics Revolution

2022/12/20: IMEC: 100-fold current density enhancement puts imec’s nanomesh electrodes in pole position for high-throughput electrochemical applications
2022/12/15: NMI: Download the Flexciton presentation from the Fab Management Forum 2022
2022/12/8: Imec enables tight standard cell boundary scaling using a two-level semi-damascene integration scheme
2022/12/8: Leti: Path Towards Full Fault-Tolerant Quantum Computing with Si-Based VLSI Technologies In Plenary Talk at IEDM 2022
2022/12/7: CEA-Leti Presents RRAM’s ‘Promising Advantages’ For Neuromorphic/In-Memory Computing at IEDM 2022
2022/12/6: Imec and Rapidus sign Memorandum of Cooperation to collaborate on advanced semiconductor technologies
2022/12/6: Imec introduces simulation framework to better predict thermal transport in RF devices for 5G and 6G.
2022/12/6: NMI: Zuken and CSA Catapult Present Results of an R&D Collaboration for the Optimization of Tools for the Design of Power Modules
2022/12/5: Imec improves ferroelectric response and endurance of HZO-based ferroelectric capacitors

2022/11/25: ITRI Announces Its Collaboration with K&S in Hi-CHIP Alliance
2022/11/17: ITRI Partners with LITEON to Strength IPR Strategic Position
2022/11/16: ITRI Introduces High Resolution Full-Color Micro LED Display for AR Glasses
2022/11/10: ITRI Introduces Point-of-Care AI-DR Software for Rapid Diagnosis of Diabetic Retinopathy and Diabetic Macular Edema

2022/10/27: ITRI and URE’s Easy-Dismantled Solar Panel Module Certified by TÜV Rheinland
2022/10/20: ITRI and Ganvix, Inc. Extend Their Joint Venture to Commercialize Innovative Laser Technology
2022/10/19: IME: Seven parties commit to help businesses navigate towards environmental sustainability with Green Compass
2022/10/14: LETI: CEA & Schneider Electric Extend R&D Collaboration
2022/10/13: Imec demonstrates flat-panel-display-compatible pMUT technology for emerging ultrasound applications
2022/10/10: IME: Fujitsu Asia and A*STAR sign master research collaboration agreement to advance AI and converging technologies
2022/10/6: IME: FairPrice Group and A*STAR launch pilot for Smart Bins to encourage households to recycle more and recycle correctly
2022/10/6: NMI: STMicroelectronics build new plant in Italy
2022/10/3: NMI: SFN looks to end monopoly of Taiwanese and Korean chip producers with ‘Infrastructure Time Machine’ that enables fabs to reduce semiconductor production times 10 fold and increase net profit 40-50 times

2022/9/28: Holst Centre: TNO and imec launch photonics collaboration
2022/9/23: ITRI and Oxford Instruments Announce Breakthrough Development in GaN HEMT Device Performance
2022/9/22: Imec researchers at Ghent University and Nokia Bell Labs work to debut key building block for the deployment of 100G PON networks
2022/9/20: Leti: CEA RF Chip Enables Ultralow-Power IoT Connectivity For Remote Devices Via Astrocast’s Nanosatellite Network
2022/9/16: Holst Centre to host launch of ECOTRON project
2022/9/13: LETI: Valeo and the CEA to collaborate on advanced research in power electronic to prepare for tomorrow’s electric mobility
2022/9/2: IME: Finland And Singapore’s National Quantum Office Ink Mou

2022/8/31: NMI: Alter Technology: Start of mass production for plastic encapsulated semiconductor chips
2022/8/16: NMI: New funding competition from Driving the Electric Revolution: Scale-up for PEMD
2022/8/2: IMEC: 20 Year Roadmap: Tearing Down The Walls
2022/8/2: ITRI Hosts 2022 International Workshop on Trustworthy AI to Discuss Trust and Ethics in AI

2022/7/26: IME: TCOMS opens Ocean Basin facility to strengthen Research and Development capabilities
2022/7/22: Imec joins euROBIN, a new unified European platform for R&D on AI-driven Robotics
2022/7/14: NMI: Busch: Avoiding Unscheduled Downtime in Semicon Fabs with Preventive Vacuum Service
2022/7/12: IME: A*STAR and Johnson & Johnson Vision ink MoU for eye health digital innovation consortium
2022/7/7: ITRI and Pegatron’s 5G O-RAN Energy-Saving System Wins SCF Small Cell Award 2022
2022/7/7: CEA-Leti Barn-Owl Inspired, Object-Localization System Uses Up to ‘5 Orders of Magnitude’ Less Energy than Existing Technology
2022/7/5: NMI: Ilika Commences Economic Assessment on Placing a 100 MWh Solid State Battery Manufacturing Line at the UK Battery Industrialisation Centre

2022/6/30: Imec Shows Path to Line Resistance Halving using Semi-Damascene with High-Aspect-Ratio Processing
2022/6/28: IMEC: Swave, a new Imec and VUB, Spin-off, Raises €7M to Deliver Truly Realistic AR/VR Experiences to Applications Like the Metaverse
2022/6/27: ITRI Partners with Industry and Academia in Joint Announcement of Leading-Edge Magnetic Memory Technology
2022/6/23: IMEC: DYAMAND, a new imec and Ghent University spin-off, launches ‘eSave’ – reducing building owners’ heating costs by up to 30%
2022/6/16: Imec's new direct-digitization readout design enables small, low-noise, low-power neural interfaces
2022/6/16: CEA & Partners Present ‘Powerful Step Towards Industrialization’ Of Linear Si Quantum Dot Arrays Using FDSOI Material at VLSI Symposium
2022/6/14: Imec demonstrates backside power delivery with buried power rails for back- and frontside routing
2022/6/2: CEA-Leti & Intel Report Die-to-Wafer Self-Assembly Breakthrough Targeting High Alignment Accuracy and Throughput

2022/5/17: Imec unites partners from the semiconductor value chain to jointly target net-zero emissions for chip manufacturing

2022/4/26: IME: Launch Of Smu-A*star Joint Lab In Social & Human-centred Computing
2022/4/25: Imec Ramps Up the Development of the High-NA EUV Patterning Ecosystem
2022/4/8: Leti: Leading Semiconductor Players to Advance Next Generation FD-SOI Roadmap for Automotive, IoT and Mobile Applications
2022/4/7: IME: Innovating For Game-changing Green Technologies
2022/4/7: SRC selected by NIST for critical roadmap work
2022/4/4: Imec and Bühler Leybold enable high-throughput manufacturing of filter-on-chip CMOS sensors with unmatched precision

2022/3/24: Leti: CEA and Startup C12 Join Forces to Develop Next-Generation Quantum Computers with Multi-Qubit Chips at Wafer Scale
2022/3/22: Holst Centre: Bayflex Solutions Unveils First Continuous Testing Lab in Europe at Holst Centre
2022/3/22: Imec.xpand II reaches an important milestone on its way to become one of world’s most impactful, early-stage funds dedicated to semiconductor innovation
2022/3/16: IME: Developing Solutions with PSA to Manage AGV Fleets at Tuas Port
2022/3/8: IME: A*STAR Sets Up New Research Institute To Support Singapore’s Sustainability Goals
2022/3/3: ITRI and UCLA to Collaborate on World-Leading Memory Technology Development
2022/3/1: ITRI and Pegatron Exhibit Taiwan’s First 5G O-RAN Energy-Saving Private Network Solution at MWC 2022
2022/3/1: Leti: CEA and Spectronite Develop Software Radio For Spectrally Efficient Backhaul Solutions

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