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Global SemiConsortium

Global SemiConsortium

Holst Centre：: オランダのTNO（応用科学研究機構）とベルギーのIMECが共同で設立した研究所。フィリップス社の研究センターの跡地に設置。
IME（Institute of Microelectronics）：: シンガポールの半導体研究所。LSIプロセスから実装(3D IC)に至るまで、SiだけではなくGaNやSiCについても研究している。
IMEC（Interuniversity Microelectronics Centre）：: ベルギーにある半導体技術の研究所。世界中から人材が集まり、半導体の設計、製造、応用などについて研究する。
LETI（Laboratoire d'Electronique des Technologies de I'information）：: フランスの科学技術庁CEAの中にある電子情報技術研究所。STMicroelectronicsなどと密に活動している。MEMS技術は定評がある。
NMI（National Microelectronics Institute）：: 英国の半導体企業が集まる非営利の業界団体。
UAlbany：: 米ニューヨーク州立大学アルバニー校。半導体製造に力を入れ、世界の半導体研究の拠点の一つになっている。ニューヨーク州が熱心に資金提供。
SRC（Semiconductor Research Corp）：: 米国の半導体研究を推進する大学のコンソーシアム。
SEMATECH（Semiconductor Manufacturing Technology）：: 半導体プロセスの研究開発を行う米国のコンソーシアム。

2018/7/24: Imec Beats Silicon PV with 27.1 Percent Perovskite-Silicon Tandem
2018/7/11: Leti and Oscaro Partner on Leti’s New Low-Power, Low-Cost Transceiver To Track Millions of Parcels
2018/7/10: Leti and Soitec Launch A New Substrate Innovation Center To Develop Engineered Substrate Solutions
2018/7/9: Imec and Soitec Demonstrate Sequential 3D Planar Device Achieving High-Reliability at Low Temperature
2018/7/9: Imec Demonstrates Hybrid FinFET-Silicon Photonics Technology for Ultra-Low Power Optical I/O
2018/7/9: Imec Reports Breakthrough in Extending Interconnects Beyond the 3nm Technology Node
2018/7/5: Leti, Transdev and IRT Nanoelec Announce Pilot Program To Assess New Perception Sensors For Autonomous Vehicles

2018/6/20: Imec Presents Complementary FET (CFET) as Scaling Contender for Nodes Beyond N3
2018/6/19: Imec furthers high-mobility nanowire FETs for nodes beyond 5nm
2018/6/18: Imec demonstrates manufacturability of state-of-the-art spin-orbit torque MRAM devices on 300mm Si wafers
2018/6/15: International Team Launches Microfluidics Group To Write Standards To Speed Device Development & Manufacturing
2018/6/7: Imec demonstrates compact low-power 140GHz CMOS radar with on-chip antennas
2018/6/4: Imec Extends Damascene Metallization Towards the 3nm Technology Node

2018/5/30: Imec demonstrates compatibility of state-of-the-art 0.8V-transceiver, with industry standard Arm Cordio IP for BLE 5
2018/5/29: Imec demonstrates efficient cost-effective cooling solution for high performance chips
2018/5/28: Imec Develops Industry-Compatible Screen-Printing Process for Highly Efficient n-PERT Solar Cells
2018/5/23: Imec Packs New Fast Eye Tracking Technology into Ergonomic Design for High-Quality AR/VR Experiences
2018/5/23: Imec and Unisantis Unveil Ultra-Scaled EUV-Enabled Surrounding Gate Transistor SRAM Cell
2018/5/22: Leti: Smart digital systems / Cybersecurity: chips individually marked by e-beam lithography
2018/5/16: Holst Centre: Flexible fingerprint sensors promise embedded secure access control
2018/5/14: Ualbany: SUNY Poly collaborative research published in APL Materials
2018/5/8: Ualbany: NYS Photonics Board of Officers Announces Tool Installation Work Begins at AIM Photonics TAP Facility in Rochester
2018/5/3: Leti & Cellmic LLC To Accelerate The Global Market Adoption Of Lens-Free Diagnostics And Biomedical Sensing
2018/5/2: Leti: Australian Prime Minister and French President announce plans for new quantum computing collaboration

2018/4/17: Ualbany: SUNY Poly research published in Journal of Microscopy
2018/4/17: Imec: ESPResSo, an Ambitious EU Funded Collaboration to Make Perovskite Solar Cells a Market Reality
2018/4/10: Imec reaches milestone for next-gen solid-state batteries to power future long-range electrical vehicles
2018/4/6: Imec and Qromis Present High Performance p-GaN HEMTs on 200mm CTE-matched Substrates
2018/4/5: Leti Silicon Photonics Design Kit Available For Synopsys OptoDesigner Pic Design Solution

2018/3/26: Leti: Pixcurve reduces camera size by half
2018/3/20: Leti: CEA Shows Path to Creating Building Blocks of Quantum Processors With 28si Isotope In a CMOS Fab Line
2018/3/15: Ualbany: Semiconductor Today: AIM Photonics detailing opportunities for integrated photonics-related partnerships at OFC
2018/3/7: Ualbany: AIM Photonics News Release: AIM Photonics To Detail Opportunities for Integrated Photonics-Related Partnerships During OFC 2018-the Optical Networking and Communication Conference & Exhibition
2018/3/6: Ualbany: SUNY Poly's Center for Semiconductor Research in Albany Earns World-Class TÜV SÜD AMERICA INC. ISO 9001:2015 Certification
2018/3/5: Leti: Electron holography delivers atomic resolution, providing new insights into material structures

2018/2/28: Imec and Cadence Tape Out Industry’s First 3nm Test Chip
2018/2/26: Ualbany: Manufacturing USA: New Video: AIM Photonics Powering the 21st Century with Integrated Photonics
2018/2/23: Ualbany: CDRInfo: IBM Researchers Talk About the Future of EUV, Research at SUNY Poly at SPIE
2018/2/23: Imec Pushes the Limits of EUV Lithography Single Exposure for Logic N5 Metal Layers and Dense DRAM Applications
2018/2/21: Leti & Mapper will Present 3 Papers on Massively Parallel Electron-Beam Litho at SPIE Advanced Lithography 2018
2018/2/20: Leti: Shorter time-to-market for CPS-based solutions
2018/2/15: Leti: EU-South Korean Project Will Demonstrate 5G System Prototype at 2018 Winter Games
2018/2/14: Leti: Close to the Edge: Brain-Inspired Technologies Will Bring Data Processing and Analytics to IoT Devices
2018/2/12: Imec Presents Together with Renesas Electronics an Ultra-Low Power Transceiver for Bluetooth 5 and Beyond with Lowest Supply Voltage Ever Reported
2018/2/12: Imec Introduces CMOS Chip With 16,384 Micro-electrodes and 1,024 Channels for Multimodal Cell Interfacing
2018/2/5: Holst Centre: Henkel and Holst Centre continue collaboration
2018/2/2: Leti Proposes Curving Technology For Optical Equipment That Improves Performance And Reduces Cost And Size

2018/1/29: Imec’s high-speed ultrasonic SNAPSCAN camera enables hyperspectral imaging acquisition in less than one second
2018/1/25: Imec demonstrates Shortwave Infrared (SWIR) range hyperspectral imaging camera
2018/1/18: Leti To Demonstrate New Curving Technology That Improves Performance Of Optical Components @ Photonics West
2018/1/18: SRC: Beyond 5G: UCSB is the lead institution for a research center that will explore terahertz-range communications and sensing
2018/1/16: Leti: Fingerprints under the microscope
2018/1/16: SRC: New C-BRIC center will tackle brain-inspired computing
2018/1/9: Imec's SWEET study collects world's largest dataset on stress detection
2018/1/9: Imec and Holst Centre introduce EEG Headset for emotion detection

2017/12/21: SRC: Steering electrical current with spinning light
2017/12/18: Leti and CloudNet IT-Solutions Demonstrate New Multicarrier Waveform for Rural and Maritime Broadband Radio
2017/12/14: Leti to Demonstrate First 3D Anti-crash Solution for Embedding in Drones @CES2018
2017/12/8: Leti recently miniaturized a key component for the testing and measurement market
2017/12/6: Leti Integrates Hybrid iii-v Silicon Lasers On 200mm Wafers Using Standard CMOS Process
2017/12/6: Leti Memory Breakthroughs Point Way To Significant Improvements In System-on-Chip Memories
2017/12/4: Imec Achieves Record Low Contact Resistivity on Ga-doped Ge Source/Drain Contacts for pMOS Transistors
2017/12/4: Imec Demonstrates Power-Performance-Area-Cost Benefit of Heterogeneous Sequential-3D Integration for Advanced CMOS Nodes
2017/12/4: Imec Demonstrates for the First Time Functional Ring Oscillators Based on Stacked Gate-all-Around Silicon Nanowire Transistors

2017/11/16: Leti: Silicon photonics for high-performance computing
2017/11/15: Holst Centre: (Not) breaking the barrier to foldable OLED displays
2017/11/14: Imec expands strategic partnership with Western Digital
2017/11/14: Leti Announces FED4SAE Project to Accelerate European Cyber-Physical-System Solutions to Market
2017/11/13: Imec and Panasonic introduce innovative nanocomposite electrolyte for next-generation batteries
2017/11/13: Leti Demonstrates World’s First 300-mm Wafer-to-Wafer Direct Hybrid Bonding With 1-micron Pitch on EV Group System
2017/11/8: IME: A*STAR IME's New Multi-Chip Fan-Out Wafer Level Packaging Development Line to drive Innovation and Growth in Semiconductor Industry

2017/10/30: Imec partners in European initiative to develop Organs-on-Chip
2017/10/17: Holst Centre, imec and Philips demo world's first curved, plastic photodetector
2017/10/11: Imec and Analog Devices sign strategic research partnership for development of next-generation IoT devices
2017/10/10: Leti: ISKN, the first B-to-C startup to be spun off by CEA Tech institute Leti, has done very well, with selling more than 3,000 units of its flagship Slate through several distribution channels.
2017/10/4: SRC: Samsung Electronics Joins SRC
2017/10/3: Imec Leverages the Power of Silicon Fabrication to Create Innovative Neural Probe Demonstrator with Unprecedented Electrode Density
2017/10/3: Imec Reports Micro-Optomechanical Pressure Sensor Advancing Pressure Monitoring in Biomedical Applications

2017/9/28: Leti: A GaN microdisplay with incredible resolution
2017/9/20: Holst Centre: CPT and imec / Holst Centre Demonstrate 1250 ppi, FMM-free Multicolor OLED Displays with Photolithography
2017/9/20: Imec: CPT and imec / Holst Centre Demonstrate 1250 ppi, FMM-free Multicolor OLED Displays with Photolithography
2017/9/19: Leti Develops Proof Of Concept To Test Wireless Systems In Aircraft
2017/9/19: SRC: Samsung Electronics Company Joins SRC
2017/9/11: Leti: Semiconductor industry backs SigmaFusion for automotive applications
2017/9/6: Imec Reports World-Class Low-Power IP Blocks for 5G
2017/9/5: Leti and Partners in PiezoMAT Project Develop New Fingerprint Technology For Highly Reliable Security and ID Applications

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