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Global SemiConsortium

Global SemiConsortium

Holst Centre：: オランダのTNO (応用科学研究機構)とベルギーのIMECが共同で設立した研究所。フィリップス社の研究センターの跡地に設置。
IME (Institute of Microelectronics)- A*STAR：: シンガポールの科学技術研究庁 (A*STAR)傘下にある半導体研究所。LSIプロセスから実装 (3D IC)に至るまで、SiだけではなくGaNやSiCについても研究している。
IMEC (Interuniversity Microelectronics Centre)：: ベルギーにある半導体技術の研究所。世界中から人材が集まり、半導体の設計、製造、応用などについて研究する。
ITRI (Industrial Technology Research Institute )：: 1973年に台湾で設立された研究開発機構。科学技術の研究開発により、産業発展と経済価値を創造し、社会福祉を促進することをミッションとする。
LETI (Laboratoire d'Electronique des Technologies de I'information)：: フランスの科学技術庁CEAの中にある電子情報技術研究所。STMicroelectronicsなどと密に活動している。MEMS技術は定評がある。
NMI (National Microelectronics Institute)：: 英国の半導体企業が集まる非営利の業界団体。
SRC (Semiconductor Research Corp)：: 米国の半導体研究を推進する大学のコンソーシアム。

2023/6/2: CEA-Leti Proof of Concept Demonstrates Electrons Move Faster in Germanium Tin Than in Silicon or Germanium
2023/6/1: IME: Ross Digital and A*STAR Establish New Programme to Drive Innovation For the Food Services Industry

2023/5/24: NMI: The Latest NMI Directory is NOW AVAILABLE
2023/5/23: Imec first to demonstrate conductor films on 300mm wafers with lower resistivity than Cu and Ru
2023/5/19: NMI: Techworks acknowledges the governments publication of its long-awaited semiconductor strategy
2023/5/16: IMEC: GlobalFoundries, Samsung Electronics, and TSMC Join Imec’s “Sustainable Semiconductor Technologies & Systems” (SSTS) Program

2023/4/26: IME: Launching Networked Virtual Watch Tower Project for Supply Chain Performance
2023/4/25: IME: A*STAR Establishes Centre for Maritime Digitalisation With Flagship Research Programme to Deploy Ai Technologies in the Maritime Industry
2023/4/23: IME: Another Giant Leap Into Space: Successful Launch of Lumelite-4 to Enhance Maritime Communications
2023/4/20: NMI: BPC Electronics Invests in Wire Bonder to Better Serve e-Mobility and Energy Storage Sectors
2023/4/18: ITRI: 2023 ITRI Net Zero Day Brings Industry Technological and Financing Solutions for Net Zero Emissions by 2050
2023/4/13: Holst Centre: TNO at Holst Centre and ZSW announce Li-ion battery collaboration
2023/4/13: IME: Transforming the Future of Healthcare: Singhealth and A*STAR Partner to Foster Healthcare Innovations
2023/4/13: CEA-Leti to Report Progress on 3D Interconnects for Wafer-Level Platforms
2023/4/4: Rapidus, Japan’s newly founded chip manufacturer, joins imec’s Core Partner Program
2023/4/3: SRC Opens 2023 Call for Research

2023/3/15: NMI: Nexperia introduces in-vehicle network ESD protection portfolio for 24 V board net systems
2023/3/1: SRC: Microelectronics & Advanced Packaging Technologies Roadmap

2023/2/28: Imec’s virtual fab underpins strategies to reduce the carbon footprint of lithography and etch process steps
2023/2/20: Imec demonstrates low-power phase-locked loop for short-range automotive and industrial radar applications
2023/2/2: IMEC: Smaller, better, faster: imec presents chip scaling roadmap

2023/1/31: Imec demonstrates the co-integration of its high-quality SiN waveguide technology with its active silicon photonics platform
2023/1/30: CEA-Leti’s recent advances on key AR building blocks, e.g. retinal projection and holography
2023/1/27: Imec hyperspectral camera paves the way for in-vivo detection of low-grade gliomas
2023/1/26: Imec demonstrates combined VIS & NIR spectral camera system, complemented with hi-res RGB imaging, for data acquisition at video rate
2023/1/24: IMEC: IoSA, a new spin-off of UAntwerp and imec, develops animal behavior monitoring tool for research, conservation, and agriculture purposes
2023/1/19: LETI: Electric vehicles: CEA and Renault Group develop a very high efficiency bidirectional on-board charger
2023/1/4: SRC Launches JUMP 2.0 Consortium Aimed at Leap-Ahead Microelectronics Revolution

2022/12/20: IMEC: 100-fold current density enhancement puts imec’s nanomesh electrodes in pole position for high-throughput electrochemical applications
2022/12/15: NMI: Download the Flexciton presentation from the Fab Management Forum 2022
2022/12/8: Imec enables tight standard cell boundary scaling using a two-level semi-damascene integration scheme
2022/12/8: Leti: Path Towards Full Fault-Tolerant Quantum Computing with Si-Based VLSI Technologies In Plenary Talk at IEDM 2022
2022/12/7: CEA-Leti Presents RRAM’s ‘Promising Advantages’ For Neuromorphic/In-Memory Computing at IEDM 2022
2022/12/6: Imec and Rapidus sign Memorandum of Cooperation to collaborate on advanced semiconductor technologies
2022/12/6: Imec introduces simulation framework to better predict thermal transport in RF devices for 5G and 6G.
2022/12/6: NMI: Zuken and CSA Catapult Present Results of an R&D Collaboration for the Optimization of Tools for the Design of Power Modules
2022/12/5: Imec improves ferroelectric response and endurance of HZO-based ferroelectric capacitors

2022/11/25: ITRI Announces Its Collaboration with K&S in Hi-CHIP Alliance
2022/11/17: ITRI Partners with LITEON to Strength IPR Strategic Position
2022/11/16: ITRI Introduces High Resolution Full-Color Micro LED Display for AR Glasses
2022/11/10: ITRI Introduces Point-of-Care AI-DR Software for Rapid Diagnosis of Diabetic Retinopathy and Diabetic Macular Edema

2022/10/27: ITRI and URE’s Easy-Dismantled Solar Panel Module Certified by TÜV Rheinland
2022/10/20: ITRI and Ganvix, Inc. Extend Their Joint Venture to Commercialize Innovative Laser Technology
2022/10/19: IME: Seven parties commit to help businesses navigate towards environmental sustainability with Green Compass
2022/10/14: LETI: CEA & Schneider Electric Extend R&D Collaboration
2022/10/13: Imec demonstrates flat-panel-display-compatible pMUT technology for emerging ultrasound applications
2022/10/10: IME: Fujitsu Asia and A*STAR sign master research collaboration agreement to advance AI and converging technologies
2022/10/6: IME: FairPrice Group and A*STAR launch pilot for Smart Bins to encourage households to recycle more and recycle correctly
2022/10/6: NMI: STMicroelectronics build new plant in Italy
2022/10/3: NMI: SFN looks to end monopoly of Taiwanese and Korean chip producers with ‘Infrastructure Time Machine’ that enables fabs to reduce semiconductor production times 10 fold and increase net profit 40-50 times

2022/9/28: Holst Centre: TNO and imec launch photonics collaboration
2022/9/23: ITRI and Oxford Instruments Announce Breakthrough Development in GaN HEMT Device Performance
2022/9/22: Imec researchers at Ghent University and Nokia Bell Labs work to debut key building block for the deployment of 100G PON networks
2022/9/20: Leti: CEA RF Chip Enables Ultralow-Power IoT Connectivity For Remote Devices Via Astrocast’s Nanosatellite Network
2022/9/16: Holst Centre to host launch of ECOTRON project
2022/9/13: LETI: Valeo and the CEA to collaborate on advanced research in power electronic to prepare for tomorrow’s electric mobility
2022/9/2: IME: Finland And Singapore’s National Quantum Office Ink Mou

2022/8/31: NMI: Alter Technology: Start of mass production for plastic encapsulated semiconductor chips
2022/8/16: NMI: New funding competition from Driving the Electric Revolution: Scale-up for PEMD
2022/8/2: IMEC: 20 Year Roadmap: Tearing Down The Walls
2022/8/2: ITRI Hosts 2022 International Workshop on Trustworthy AI to Discuss Trust and Ethics in AI

2022/7/26: IME: TCOMS opens Ocean Basin facility to strengthen Research and Development capabilities
2022/7/22: Imec joins euROBIN, a new unified European platform for R&D on AI-driven Robotics
2022/7/14: NMI: Busch: Avoiding Unscheduled Downtime in Semicon Fabs with Preventive Vacuum Service
2022/7/12: IME: A*STAR and Johnson & Johnson Vision ink MoU for eye health digital innovation consortium
2022/7/7: ITRI and Pegatron’s 5G O-RAN Energy-Saving System Wins SCF Small Cell Award 2022
2022/7/7: CEA-Leti Barn-Owl Inspired, Object-Localization System Uses Up to ‘5 Orders of Magnitude’ Less Energy than Existing Technology
2022/7/5: NMI: Ilika Commences Economic Assessment on Placing a 100 MWh Solid State Battery Manufacturing Line at the UK Battery Industrialisation Centre

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