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Global SemiConsortium

Global SemiConsortium

Holst Centre：: オランダのTNO（応用科学研究機構）とベルギーのIMECが共同で設立した研究所。フィリップス社の研究センターの跡地に設置。
IME（Institute of Microelectronics）：: シンガポールの半導体研究所。LSIプロセスから実装(3D IC)に至るまで、SiだけではなくGaNやSiCについても研究している。
IMEC（Interuniversity Microelectronics Centre）：: ベルギーにある半導体技術の研究所。世界中から人材が集まり、半導体の設計、製造、応用などについて研究する。
LETI（Laboratoire d'Electronique des Technologies de I'information）：: フランスの科学技術庁CEAの中にある電子情報技術研究所。STMicroelectronicsなどと密に活動している。MEMS技術は定評がある。
NMI（National Microelectronics Institute）：: 英国の半導体企業が集まる非営利の業界団体。
UAlbany：: 米ニューヨーク州立大学アルバニー校。半導体製造に力を入れ、世界の半導体研究の拠点の一つになっている。ニューヨーク州が熱心に資金提供。
SRC（Semiconductor Research Corp）：: 米国の半導体研究を推進する大学のコンソーシアム。
SEMATECH（Semiconductor Manufacturing Technology）：: 半導体プロセスの研究開発を行う米国のコンソーシアム。

2020/3/26: Imec: miDiagnostics Raises €14m to Accelerate the Commercialization of its Disruptive, Lab-quality Silicon Chip Diagnostics Platform
2020/3/20: Leti: Highlights 2019
2020/3/9: IME: Safer High-Performing Batteries with NanoBio Lab's 'Cupcake' Electrolyte
2020/3/9: Leti: Startup Scintil Photonics ready to prototype
2020/3/4: Imec and CST Global Collaborate to Extend Silicon Photonics Portfolio with Hybrid Integrated InP Light Sources
2020/3/3: CEA-Leti Announces Smart-Farm Project to Lower Greenhouse Gas Emissions & Boost Farming Efficiency

2020/2/25: Leti: NuVISION, the gamma camera that can multitask
2020/2/24: Imec demonstrates 24nm pitch lines with single exposure EUV lithography on ASML’s NXE:3400B scanner
2020/2/21: Leti: Optomechanical probe for very high speed sensing of atomic forces
2020/2/19: First millimeter-scale wireless transceiver for electronic pills
2020/2/18: CEA-Leti Is Demonstrating mmWave Communications for 5G Networks on MINATEC Campus
2020/2/18: CEA-Leti and CEA-IRIG Demonstrate Quantum Integrated Circuit Combining Quantum Dot with Digital-Analog Circuits on CMOS Chi
2020/2/18: CEA-Leti Presents High-Performance Processor Breakthrough With Active Interposer and 3D Stacked Chiplets at ISSCC 2020
2020/2/17: A SiGe BiCMOS-based 100Gbaud Analog Time-Interleaver For Datacenters
2020/2/13: IME: Boosting innovation in Digital Design and Advanced Manufacturing: Sembcorp Marine and A*STAR deepen R&D collaboration
2020/2/6: Leti: Kalray, which completed its IPO last year, recently signed a distribution contract that will bring its intensive computing solutions for artificial intelligence to the rapidly-growing Chinese market.
2020/2/5: CEA-Leti Clears a Path to Developing Ultralow Loss, High-Power Photonics in UV through Mid-Infrared Wavelengths
2020/2/3: Imec: InSiDe, a European R&D project targeting mobile early-stage cardiovascular disease diagnosis and monitoring

2020/1/13: Imec: Evonetix collaborate with imec to scale-up chip-based technology production for third generation DNA synthesis platform
2020/1/12: Imec, TNO and Cartamundi develop flexible tags that communicate with standard touch screens
2020/1/9: Imec: MICLEDI Microdisplays, an imec spin-off, raises EUR 4,5M from imec.xpand, PMV, and FIDIMEC for the development of next generation displays for Augmented Reality (AR) glasses

2019/12/18: Ualbany: News Release: Empire State Development and the State University of New York Announce the Establishment of NY CREATES
2019/12/18: Holst Centre: Development project for flexible tags successfully completed within framework Holst Centre
2019/12/17: Imec, TNO and Cartamundi develop flexible tags that communicate with standard touch screens
2019/12/11: CEA-Leti and partners demonstrate potentially scalable readout system for large arrays of quantum dots
2019/12/9: Imec presents forksheet device as the ultimate solution to push scaling towards the 2nm technology node
2019/12/8: Imec shows excellent performance in ultra-scaled FETs with 2D-material channel
2019/12/2: Leti: Retina technology revolutionizes the world of imagers

2019/11/21: Leti: Keeping vehicles on course at all times
2019/11/15: Holst Centre shows next step towards cheaper flexible electronics

2019/10/21: Imec reports monolithic thin-film image sensor for the SWIR range with record pixel density
2019/10/21: Leti: P-link: Could the future of copper be plastic?
2019/10/10: Leti: Real-time indoor tracking of cordless industrial power tools
2019/10/8: Imec: 2D-based single photon emitters integrated with CMOS-compatible Silicon Nitride waveguides
2019/10/7: IME: A*STAR's Novel AI Chip Design platform to give the semiconductor industry a boost in productivity and quality
2019/10/7: Leti: An unprecedented neuroprosthetic allows a tetraplegic patient fitted with an exoskeleton to move

2019/9/23: Imec extends Silicon Photonics portfolio targeting next-generation data center interconnects
2019/9/18: Ualbany: SUNY Poly Advanced Materials Research Featured in CEG's "The Research Connection"
2019/9/18: IME: A*STAR, arQana Technologies to Jointly Develop mmWave Phased Array System for the 5G Cellular Market
2019/9/16: Imec.istart Business Accelerator Program Opens Call for Applicants
2019/9/16: Leti continues to expand its 300 mm capabilities with new equipment
2019/9/13: Imec and NUS to collaborate on chip-based quantum cryptography technology
2019/9/11: Holst Centre: PYCSEL, a new thermal fingerprint sensor
2019/9/10: CEA-Leti and Orolia Announce FlexFusion, A Powerful Positioning & Navigation Technology
2019/9/9: Imec, partner in EnergyVille, and PVcase co-develop next-generation yield-simulation software for solar parks
2019/9/4: Imec: New insulation technique paves the way for more powerful and smaller chips

2019/8/23: Leti: ASCENT delivered access to €2 billion of state-of-the-art facilities for 100 global research projects

2019/7/19: Holst Centre: Creating a sustainable future
2019/7/18: Leti: Weebit Nano and CEA-Leti to demonstrate brain-inspired neuromorphic demo
2019/7/10: CEA-Leti and UnitySC Announce Further Development To Fuel Industry 4.0 with Smarter Tools
2019/7/8: Imec world first to demonstrate 2 Metal layer back-end-of-line for the 3nm technology node
2019/7/3: Leti: CEA’s Precise Localization Technology Boosts Quality Control and Efficiency in Desoutter’s Products

2019/6/27: Leti: CEA-Leti & Radiall to Design Innovative RF Components for 5G Networks and Photonics Components for Harsh Environments
2019/6/25: Leti: Light Communications Alliance formed by Global Industry Leaders
2019/6/19: Leti: Miniaturized chemical sensor integrated on silicon
2019/6/18: Imec, partner in EnergyVille, doubles energy density of its solid-state batteries to 400Wh/liter
2019/6/13: Imec presents a manufacturable solution for field-free switching operation of Spin-Orbit Torque MRAM devices
2019/6/12: Imec demonstrates optimized process flows for high performance Ge-based devices
2019/6/11: Ualbany: SUNY Poly Next-Gen Transistor Research Featured in Advanced Materials
2019/6/11: CEA-Leti Announces Smart-Farm Project to Lower Greenhouse Gas Emissions & Boost Farming Efficiency
2019/6/6: Leti: Aledia invests in own R&D facility
2019/6/3: CEA-Leti and Silvaco Team Up on Yield-Prediction Project For Ultra-Low-Power Static Memories

2019/5/14: Imec and Bloomlife Showcase Prototype of World’s First Wearable 5-Channel ECG Chip to Monitor Fetal Heart Rate and Mobility
2019/5/14: CEA-Leti Develops CMOS Process for High-Performance MicroLEDs That Could Overcome Display-Size Obstacles
2019/5/13: A smart radar system for gesture recognition and non-contact vital signs monitoring.
2019/5/8: Holst Centre demos world's most transparent large-area optical fingerprint sensor
2019/5/6: Leti: Micro-coolers developed in Grenoble equip main ring at CERN

2019/4/24: Leti: SEMI Partners with Powerhouses imec, CEA-Leti and Fraunhofer to Energize Global Innovation
2019/4/8: Imec and Jolywood achieve a record of 23.2 percent with bifacial n-PERT solar cells
2019/4/4: Leti: Exploring in-memory computing
2019/4/3: Holst Centre: Helping flexible solar panels last longer. Holst Centre and DuPont Teijin Films develop production-ready barrier film solution for flexible photovoltaics
2019/4/2: Leti’s lensless microscope was adapted to enable 3D image acquisition

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