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Global SemiConsortium

Global SemiConsortium

Holst Centre：: オランダのTNO（応用科学研究機構）とベルギーのIMECが共同で設立した研究所。フィリップス社の研究センターの跡地に設置。
IME（Institute of Microelectronics）：: シンガポールの半導体研究所。LSIプロセスから実装(3D IC)に至るまで、SiだけではなくGaNやSiCについても研究している。
IMEC（Interuniversity Microelectronics Centre）：: ベルギーにある半導体技術の研究所。世界中から人材が集まり、半導体の設計、製造、応用などについて研究する。
LETI（Laboratoire d'Electronique des Technologies de I'information）：: フランスの科学技術庁CEAの中にある電子情報技術研究所。STMicroelectronicsなどと密に活動している。MEMS技術は定評がある。
NMI（National Microelectronics Institute）：: 英国の半導体企業が集まる非営利の業界団体。
UAlbany：: 米ニューヨーク州立大学アルバニー校。半導体製造に力を入れ、世界の半導体研究の拠点の一つになっている。ニューヨーク州が熱心に資金提供。
SRC（Semiconductor Research Corp）：: 米国の半導体研究を推進する大学のコンソーシアム。
SEMATECH（Semiconductor Manufacturing Technology）：: 半導体プロセスの研究開発を行う米国のコンソーシアム。

2020/12/18: CEA-Leti Scientists Present In-Memory Computing Pathways for Edge-AI & Neural Networks with 3D Architectures & Resistive-RAM
2020/12/17: Imec presents smallest finFET-based biosensor for high-sensitivity molecule detection
2020/12/16: Leti: Aledia Announces it Has Produced its First Nanowire Chips on 300mm Silicon Wafers Using CEA-Leti Pilot Lines
2020/12/15: Imec Demonstrates Capacitor-less IGZO-Based DRAM Cell With >400s Retention Time
2020/12/15: CEA to Enable High-Performance Processors That Will Power Exascale Computing
2020/12/9: Imec Presents a Thin-Film Short-Wave-InfraRed Image Sensor with Sub-2µm Pixel Pitch
2020/12/3: Imec Applies Photolithography To Push Functionality and Reliability Barriers In OLED Display Manufacturing

2020/11/26: Imec and XIMEA launch industrial grade hyperspectral camera solution addressing the high-quality standards for machine vision applications
2020/11/18: Imec: New imec research program pursues the development of scalable and energy-efficient 6G device technology

2020/10/29: CEA-Leti to Build Quantum-Photonics Platform to Ensure Ultra-Secure Data for Finance, Energy, Defense and Other Industries
2020/10/28: Holst Centre: Advanced interactive surfaces by TNO at Holst Centre: consoles and control panels re-invented
2020/10/27: CEA-Leti Announces Collaboration with Intel to Advance Chip Design Through Cutting-Edge 3D Packaging Technologies
2020/10/23: Imec begins developing SARS-CoV-2 test to identify positive cases and confirm whether someone is contagious in less than five minutes
2020/10/20: Holst Centre: TNO at Holst Centre part of Madras project, a new European consortium
2020/10/13: CEA Achieves Mass-Spectrometry Breakthrough that Paves the Way to Detecting Viruses
2020/10/9: Imec presents alternative metals in advanced interconnect and contact schemes as a path to 2nm technology nodes
2020/10/3: Leti: Light Communications Alliance formed by Global Industry Leaders
2020/10/3: Leti and Partners in PiezoMAT Project Develop New Fingerprint Technology For Highly Reliable Security and ID Applications
2020/10/2: NMI: The NMI Directory 20/21 is now available to download

2020/9/25: IME: AI Tool to Enhance COVID-19 Screening

2020/8/28: Holst Centre: InSCOPE project boosts printed electronics past the research phase
2020/8/4: Imec presents low-power 60 GHz radar chip for contactless health tracking in battery-powered devices

2020/7/22: Imec: Five trends that will shape the future semiconductor technology landscape
2020/7/21: Leti: HORIBA Medical and CEA-Leti to develop tomorrow’s diagnostics at the point of care.
2020/7/15: Holst Centre’s near infrared vein detection sensor takes biometric security to a new level
2020/7/14: Imec: University of Antwerp and imec launch Crowdscan, a new spin-off to measure crowds without compromising personal privacy
2020/7/8: Imec and GLOBALFOUNDRIES Announce Breakthrough in AI Chip, Bringing Deep Neural Network Calculations to IoT Edge Devices
2020/7/1: Leti: New consortium to develop a 5G and beyond strategic roadmap for future European connectivity systems and components

2020/6/24: Holst Centre: The Province of Noord-Brabant, Economic Affairs & Climate Policy and TNO invest in Holst Centre’s new generation battery technology
2020/6/24: IME: SingHealth and A*STAR co-developed smart chatbot to enhance care for COVID-19 patients at community care facilities
2020/6/23: Imec: Deltaray enables zero-defect product manufacturing
2020/6/23: Leti: EU Team Demonstrates Full Data-Transfer Silicon Photonics Module Delivering 100 Gb/s and Develops Building Blocks for Tb/s
2020/6/22: CEA-Leti Scientists Demonstrate CMOS Device Fabrication at 500°C, Paving the Way to High-Performance 3D Monolithic CMOS Integration
2020/6/19: Holst Centre creates method for effective production of electrolytes for solid-state batteries
2020/6/16: Imec Overcomes Fundamental Operation Challenge for Voltage-Controlled Magnetic Random-Access Memories (RAM)
2020/6/15: Imec Demonstrates Excellent Performance of Si FinFET CMOS devices with Integrated Tungsten Buried Power Rails
2020/6/15: CEA-Leti Demonstrates Breakthrough Architecture for HPC Devices Using Gate-All-Around Nanosheet Fabrication Process
2020/6/11: CEA-Leti Researchers Breakthrough put Record for LiFi Communications Using Single GaN Blue Micro-Light-Emitting Diode
2020/6/10: NMI: Moortec Launches New In-Chip Technology
2020/6/9: Holst Centre: Nederlandse uitvinding spatial Atomic Layer Deposition (sALD) van groot belang voor mondiale hightech industrie

2020/5/19: Imec combines advanced machine learning algorithms and innovations in chip design to achieve cm accuracy and low-power ultra wideband localization
2020/5/13: Imec: Lopos, a spin-off of imec and the Ghent University, presents the SafeDistance wearable that helps employees follow social distancing guidelines
2020/5/8: Ualbany: SUNY Poly's Dr. Spyridon Galis' 'Engineered telecom emission and controlled positioning of Er3+ enabled by SiC nanophotonic structures' research published in Nanophotonics
2020/5/7: CEA-Leti Explores Technology Roadmap For Sixth-Generation Wireless Networks in mmWave Bands
2020/5/5: Imec: Roswell Biotechnologies and Imec to Develop First Molecular Electronics Biosensor Chips for Infectious Disease Surveillance, Precision Medicine and DNA Storage
2020/5/5: Leti: A wireless detonation system designed to increase productivity and safety at open pit mines

2020/4/28: Imec Builds World’s First Spiking Neural Network-Based Chip for Radar Signal Processing
2020/4/21: Imec: European research institutes and industry partners join forces to develop high-performance solar panels with improved environmental profiles
2020/4/14: SRC: Call for Research in Hardware Security
2020/4/3: IME: SINGAPORE MARSHALLS R&D EFFORTS TO COMBAT COVID-19
2020/4/2: Leti: Compact Model Developed at CEA-Leti for FD-SOI Technologies Designated as a Chip-Industry Standard
2020/4/2: Ualbany: SUNY Poly Faculty and Staff Begin Manufacturing Personal Protective Equipment to Assist Front-Line Medical Workers

2020/3/31: Leti: CEA sells its stake in Exagan
2020/3/26: Imec: miDiagnostics Raises €14m to Accelerate the Commercialization of its Disruptive, Lab-quality Silicon Chip Diagnostics Platform
2020/3/20: Leti: Highlights 2019
2020/3/9: IME: Safer High-Performing Batteries with NanoBio Lab's 'Cupcake' Electrolyte
2020/3/9: Leti: Startup Scintil Photonics ready to prototype
2020/3/4: Imec and CST Global Collaborate to Extend Silicon Photonics Portfolio with Hybrid Integrated InP Light Sources
2020/3/3: CEA-Leti Announces Smart-Farm Project to Lower Greenhouse Gas Emissions & Boost Farming Efficiency

2020/2/25: Leti: NuVISION, the gamma camera that can multitask
2020/2/24: Imec demonstrates 24nm pitch lines with single exposure EUV lithography on ASML’s NXE:3400B scanner
2020/2/21: Leti: Optomechanical probe for very high speed sensing of atomic forces
2020/2/19: First millimeter-scale wireless transceiver for electronic pills
2020/2/18: CEA-Leti Is Demonstrating mmWave Communications for 5G Networks on MINATEC Campus
2020/2/18: CEA-Leti and CEA-IRIG Demonstrate Quantum Integrated Circuit Combining Quantum Dot with Digital-Analog Circuits on CMOS Chi
2020/2/18: CEA-Leti Presents High-Performance Processor Breakthrough With Active Interposer and 3D Stacked Chiplets at ISSCC 2020
2020/2/17: A SiGe BiCMOS-based 100Gbaud Analog Time-Interleaver For Datacenters
2020/2/13: IME: Boosting innovation in Digital Design and Advanced Manufacturing: Sembcorp Marine and A*STAR deepen R&D collaboration
2020/2/6: Leti: Kalray, which completed its IPO last year, recently signed a distribution contract that will bring its intensive computing solutions for artificial intelligence to the rapidly-growing Chinese market.
2020/2/5: CEA-Leti Clears a Path to Developing Ultralow Loss, High-Power Photonics in UV through Mid-Infrared Wavelengths
2020/2/3: Imec: InSiDe, a European R&D project targeting mobile early-stage cardiovascular disease diagnosis and monitoring

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