新着情報

AEC/APC Symposium Asia 2019 Report

Thank you very much for your attendance at AEC/APC Symposium Asia 2019!
We had more than 230 expertise from 6 regions.
Look forward to seeing you in 2021 in Japan.

AEC/APC Symposium Asia 2019 Awards

AEC/APC Symposium Asia 2019 Best Paper
[TDA-O-22]
Robust Estimation of Mixed-Type Wafer Map Similarity Utilizing Non-negative Matrix Factorization
Yukako Tanaka, Kioxia
AEC/APC Symposium Asia 2019 Best Paper

AEC/APC Symposium Asia 2019 Best Poster
[TDA-P-25]
Digitalization of Factory utilized embedded Artificial Intelligence (e-AI)
Toshiki Ono, Renesas Electronics
AEC/APC Symposium Asia 2019 Best Paper

AEC/APC Symposium Asia 2019 Student Award
Huizhen Bu, Tsukuba Univ.
AEC/APC Symposium Asia 2019 Best Student

AEC/APC Symposium Asia 2017報告

2017年のプログラム・様子をご覧になりたい方はこちら

AEC/APC Symposium Asia 2019 について



Sponsored by:
ISSM
Supported by:
JEITA SEAJ SEMI
In conjunction with:
Dry Process Symposium 2019
Contact Us

AEC/APC Symposium Asia 2019事務局
(株式会社セミコンダクタポータル内)
〒106-0041
東京都港区麻布台2-4-5 メソニック 39MTビル 4F

Tel. 03-5733-4971 Fax. 03-5733-4973

E-mail:aecapc_2019@semiconportal.com