AEC/APC Symposium Asia 2019 Report

Thank you very much for your attendance at AEC/APC Symposium Asia 2019!
We had more than 230 expertise from 6 regions.
Look forward to seeing you in 2021 in Japan.

AEC/APC Symposium Asia 2019 Awards

AEC/APC Symposium Asia 2019 Best Paper
[TDA-O-22]
Robust Estimation of Mixed-Type Wafer Map Similarity Utilizing Non-negative Matrix Factorization
Yukako Tanaka, Kioxia
AEC/APC Symposium Asia 2019 Best Paper

AEC/APC Symposium Asia 2019 Best Poster
[TDA-P-25]
Digitalization of Factory utilized embedded Artificial Intelligence (e-AI)
Toshiki Ono, Renesas Electronics
AEC/APC Symposium Asia 2019 Best Paper

AEC/APC Symposium Asia 2019 Student Award
Huizhen Bu, Tsukuba Univ.
AEC/APC Symposium Asia 2019 Best Student

What's New

AEC/APC Symposium Asia 2017 Report

To check AEC/APC Symposium Asia 2017, click here.

About AEC/APC Symposium



Sponsored by:
ISSM
Supported by:
JEITA SEAJ SEMI
In conjunction with:
Dry Process Symposium 2019
Contact Us

AEC/APC Symposium Asia 2019 Secretariat

c/o Semiconductor Portal, Inc.
4F Masonic 39MT Bldg.
2-4-5, Azabudai, Minato-ku, Tokyo
106-0041, Japan

Tel. +81-3-5733-4971 Fax. +81-3-5733-4973

E-mail:aecapc_2019@semiconportal.com