This call for papers is directed to the semiconductor and photovoltaic community, and other relevant industries, such as display, LED, lamps or glass. Other industries employing AEC/APC may also submit abstracts.

• Abstract Submission Start: Monday, May 15th, 2023
• Abstract Submission Due: Tuesday, July 18th, 2023
• Notification of abstract acceptance: Thursday, August 24h, 2023

AEC/APC Symposium Asia 2023 Abstract Template

• The abstract has to be used AEC/APC Symposium Asia abstract template.
• The first page consists of the text (max of 1,000 words) and the second page consists of figures, supporting data, charts, photos and drawings.

• Process/Tool Level APC : PTL
  - FDC, SPC, Chamber matching, Process monitoring, Predictive control, Sensor development or utilization
• Fab Level APC : FAB
  - Run to run, Wafer to wafer, Sampling strategy, Defect inspection
• Virtual metrology : VM
  - Soft sensor, Process models, Reduction of measurement process / non-production wafers
• Yield management : YM
  - Yield prediction, Yield improvement, Yield modeling and management
• Manufacturing effectiveness and productivity : MEP
  - Throughput improvement, Productivity improvement, Cost optimization, Maintenance strategy, Production Scheduling
• Data analysis : DA
  - Bigdata analysis, Novel methods of data analysis and visualiation, AI, Machine learning, Statistical approaches
• IT infrastructure : IT
  - Infrastructures, Data collection, Standards
  - Security
• GX(Green Transformation) : GX
  - Environmental monitoring, GX using APC
• Advanced Packaging and Chiplets : ACH
  - 3D bonding, RDL process using APC
• APC Strategy / Future needs : APS
  - Roadmap, Requirements
  - Smart Manufacturing, Digital Twin
  - Metaverse, Robotics