Symposium Schedule
(The program is subject to change)
- Schedule of Presentations and Speakers
- AEC/APC Symposium Asia 2015 Poster Session
Schedule of Presentations and Speakers
| 9:15 | Registration Starts / Door Open |
| 9:30 | Opening Remarks from AEC/APC Asia Hidetaka Nishimura Renesas Electronics |
| 9:35 | Program Outline Hidenori Kakinuma Toshiba |
| Session Chair: Takashi Kurosawa, Azbil | |
| 9:40 | Tutorial Speech-1 Tutorial on Applying the VM Technology for TFT-LCD ManufacturingDr. Fan-Tien Cheng National Cheng Kung University |
| Session Co-chairs: Hisato Tanaka, Tokyo Electron / Tomoya Tanaka, TowerJazz Panasonic Semiconductor | |
| 10:40 | [MC-O-30] Prediction and Stabilization of MOSFET Threshold Voltage by VM-APC using Factory Data Takayuki Uemura Sony Semiconductor View Abstract |
| 11:00 | [MC-O-39] Chamber matching of etching rate in HDP-CVD equipment Yoshiyuki Nakao Mie Fujitsu Semiconductor View Abstract |
| 11:20 | [MC-O-23] Predictive Control by Whole Process PLS Model in MEMS Fabrication Tomohiro Yoshimura OMRON |
| 11:40 | [PO-O-12] New Equipment Monitoring Method Using Impedance Measurements Yosuke Inoue Renesas Semiconductor Manufacturing View Abstract |
| 12:00 | Lunch Break & Supplier Exhibition |
| Session Chair: Yuki Takayama, DISCO | |
| 12:50 | Introduction for Posters (3mins Summary Presentation) |
| Session Chair: Yuki Takayama, DISCO | |
| 13:20 | Tutorial Speech-2 The new direction for providing effective data for EES from sensors and digital controllersEisuke Toyoda Azbil |
| Session Co-chairs: Koichi Sakamoto, Tokyo Electron / Toshiya Hirai, Sony Energy Devices | |
| 14:05 | [MT-O-18] Improvement of Thickness variation and Productivity in LP-CVD process by APC system Masaki Ueda Toshiba View Abstract |
| 14:25 | [MT-O-45] Diagnosing Etch Chamber State Using RF Signals Masao Ito Lam Research View Abstract |
| 14:45 | [MT-O-32] Advanced FDC Method using EWMA Yuko Jisaki Panasonic Industrial Devices Engineering View Abstract |
| 15:05 | [MT-O-19] The Detection of Process Variation Synchronous within Wafer Variation Pattern Masanobu Higashide Renesas Electronics View Abstract |
| 15:25 | Supplier Exhibition / Coffee Break |
| Session Chair: Hirofumi Tsuchiyama, Renesas Semiconductor Manufacturing | |
| 15:50 | Keynote Speech Perspective on required packaging technologies for cognitive computing devicesYasumitsu Orii IBM Research Tokyo |
| Session Co-chairs: Takahiro Tsuchiya, Mie Fujitsu Semiconductor / Hirofumi Tsuchiyama, Renesas Semiconductor Manufacturing | |
| 16:20 | [MT-O-37] Etch Run-to-Run Controller Optimization with ProcessWORKS Yulei Sun Rudolph Technologies View Abstract |
| 16:40 | [MT-O-22] Pad Crack detection by APC @ Aluminum Wire Bonding Dr. Michael Brüggemann Infineon View Abstract |
| 17:00 | [DA-O-31] Data driven modeling based on OES sensor for abnormal Vth monitoring in the OLED display process Jeong Jin Hong Samsung Display View Abstract |
| 17:20 | [DA-O-34] Applications of machine learning and data mining methods for advanced equipment control and process control YiFan WANG University of Tsukuba View Abstract |
| 17:40 | [MT-O-41] Development of alignment method for ununiform deformed board by reticle free exposure apparatus Masahiro Nagano Kumamoto University View Abstract |
| 18:00 | Closing |
| 18:10 | Reception (Poster Session / Author's Interview / Supplier Exhibition) |
| 19:30 | Closing Remarks & Best Poster Award & Best Paper Award and Student Award Hidenori Kakinuma Toshiba |
Short Presentation for interactive poster session (12:50-13:20)
| Poster Introduction for Poster |
| [MT-P-36] Detection of wrong assembly in equipment maintenance with EES data Daisuke Tokiwa Toshiba View Abstract |
| [MT-P-21] Pulse Photo-Conductivity Method applied to Contact-less Testing for LSI KOJIRO SHIMIZU Kumamoto University (Graduate School of Science and Technology) View Abstract |
| [MT-P-40] Real time contamination monitoring device development in the gas/chemical delivery line Hong, Joo-Pyo KOREATECH View Abstract |
| [BA-P-25] Systematic Approach of APC to Enable Early Detection of Abnormal Pressure for TPMS Tire Pressure Monitoring Systems BE Testing Process Teh Hui Fen Infineon View Abstract |
| [BA-P-42] The new method developed by the correlation method of monitoring minute particles in space Toshiaki Tanaka Kumamoto University View Abstract |
| [BE-P-38] A Practical Position Estimation for Semiconductor Chip Mounter Shinji Ueyama Samsung View Abstract |
| [CM-P-13] A Multi-step Wafer-level Run-to-Run Controller with Sampled Measurements for Furnace Deposition and CMP Process Flows Yulei Sun Rudolph Technologies View Abstract |
| [DA-P-44] Advanced Trace Analytic Improves Root Cause Analysis for Yield Improvement Tom Ho BISTel America View Abstract |
