Sponsored by:
Supported by:
In conjunction with:
Dry Process Symposium 2013

The 24th Plasma electronics seminar (JSAP)

AEC/APC Asia 2013 Report

AEC/APC Symposium Asia 2013 Best Paper Award

Improvement of Overall Equipment Efficiency by Virtual Metrology using
Equipment data in Reactive Sputtering of Titanium Nitride
Tomoya Tanaka, Panasonic Corporation

AEC/APC Symposium Asia 2013 Student Award 2013

Non-Destructive Surface States Measurement by Pulse Photoconductivity Method
Masaaki Furuta, Junpei Fukashi, Ndagijimana Justin, Kumamoto University

AEC/APC Symposium Asia 2013 Best Paper Award / Student Award 2013

What's New

- AEC/APC Symposium Asia 2013 Survey form has been sent to all attendees on November 12th. In case if you haven't received it yet, please contact aecapc_2013@semiconportal.com

About AEC/APC Symposium

This symposium, part of a series of such meeting held three times a year in North America, Europe, and Asia brings together IC manufacturers, suppliers in an effort to accelerate the move toward more efficient and more intelligent manufacturing through data-driven and automated decision making.

In recent years, remarkable achievements are born in the field of AEC/APC which can be so called the core of scientific semiconductor production technology. It is an important factor holding the key to improving efficiency of equipment and yield enhancement in leading-edge LSI manufacturing.

Experts will present the results of advanced development AEC/APC in the field of AEC/APC and exchange the knowledge and technology. Device manufacturer, equipment manufacturer, software vender, sensor and metrology maker will get together at AEC/APC Symposium Asia 2013.

Contact Us

AEC/APC Symposium Asia 2013 Secretariat

c/o Semiconductor Portal, Inc.
4F Masonic 39MT Bldg.
2-4-5, Azabudai, Minato-ku, Tokyo
106-0041, Japan

Tel. +81-3-5733-4971 Fax. +81-3-5733-4973