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Important Date

Abstract Submission StartsWednesday, June 20, 2018
Abstract Submission DueMonday, July 30, 2018
Thursday, September 13, 2018 < PDT 8:00 AM >
Notification of Paper AcceptanceThursday, September 13, 2018
Thursday, October 4, 2018

Related Conference Information

ISSM Sponsors

Co Sponsored by: IEEE Electron Devices Society, Minimal Fab, Semiconductor Equipment Association of Japan (SEAJ), Semiconductor Equipment and Materials International (SEMI) and Taiwan Semiconductor Industry Association (TSIA)
Co Sponsored by: IEEE Electron Devices Society, SEMI, TSIA, and Minimal Fab

Endorsement by The Japan Institute of Electronics Packaging, The Japan Society of Applied Physics
>Endorsement by The Japan Institute of Electronics Packaging,  The Japan Society of Applied Physics

Contact to issm issm_2018@semiconportal.com for further inquiries.