KEYNOTE

ISSM 2008 featured keynote speakers that spanned a broad spectrum of industry leadership and technology innovation.

Mr. Yukio Sakamoto

President&CEO
Elpida Memory, Inc.
"Challenges in The DRAM Business"

The worst of the DRAM market downturn - which started back in early 2007 - is behind us, but the huge drop in prices has hurt the industry severely, depriving some players of the ability to deal with increasing R&D and capital expenditures needed for next- generation technologies. Yukio Sakamoto, President & CEO of Elpida Memory, will talk about the measures Elpida has taken to deal with the challenges presented by the downturn and further actions the company needs to take. He will also discuss fundamental problems in the DRAM industry and likely developments in the DRAM market.

Biography

Yukio Sakamoto is president and CEO of Elpida Memory, a leading provider of DRAM products. Since he assumed current responsibilities in November 2002, he has successfully turned around the business. Elpida Memory completed its IPO in November 2004. Mr. Sakamoto has 35 years of experience in the global semiconductor industry. Prior to joining Elpida Memory, he was president of UMC JAPAN, a subsidiary of UMC, a Taiwan-based semiconductor foundry. Prior to that, he managed the semiconductor division at Kobe Steel. He began his career at Texas Instruments Japan, where he worked for 26 years and held various management positions. He graduated from Nippon Sport Science University in 1970 with a bachelorfs degree in Physical Education.

Dr. Nicky C. C. Lu

Chairman/CEO,
Etron Technology, Inc.
"Heterogeneous Integration and Clustered Virtual Vertical Integration for IC Industry"

The trend of heterogeneous integration (HI) in technology and business, as the speaker presented in 2004 ISSCC, has been well proved worldwide and especially observed in Asia. The emergence of HI is transforming both the ES and IC industries by four aspects: (1) synergistic growth of technologies; (2) different business structures; (3) growing emphasis on knowledge economy; and (4) mix-and-match in human culture and IC usages. After the horizontal segmentation in the mid 1980s through the 1990s, a clustered integration structure that allows various companies with complementary skills from different specialty segments to either form alliances or partnership to realize effective vertical integration of knowledge has emerged. The clustered virtual vertical integration (CVVI) of multiple companies provides an effective solution to shorten the IC design-win cycle, which is becoming more important in the 21st century with the growing importance of system chips and consumer electronics devices. This talk will give more aspects on recent developments of the trend in the IC industry in both technology and business.

Biography

As chief executive, researcher, design architect, and entrepreneur, Dr. Nicky Lu has dedicated his career to the worldwide IC design and semiconductor industry. He is the Founder and CEO of Etron since 1991, and co-founded several other high-tech companies, including Ardetec Corp. and Global Unichip Corp., which are now public. Dr. Lu received his B.S. in Electrical Engineering from National Taiwan University and M.S. and Ph.D. in EE from Stanford University. He worked for the IBM and won numerous IBM recognition awards, including an IBM Corporate Award. He holds over 24 U.S. patents and has published more than 50 technical papers.

Dr. Lu received the National Medal of Excellence in Science and Technology by the Premier of the Republic of China and the IEEE Solid State Circuits Field Award, and is an IEEE Fellow and member of National Academy of Engineering of the United States. Dr. Lu also serves as Managing Board Director of the Taiwan Semiconductor Industry Association (TSIA), and the Board Director and Asia-Pacific Leadership Council Chairman of the Global Semiconductor Alliance (GSA).

Dr. Tien Wu

Dr. Tien Wu Chief Operating Officer, Board of Directors
Advanced Semiconductor Engineering Inc.(ASE)
"The New Dynamics of Semiconductor Industry"

Biography

Tien Wu joined Advanced Semiconductor Engineering, Inc. (ASE) in March 2000 and is currently the Chief Operating Officer. In March 2003, Tien assumed the position of Chief Executive Officer at ISE Labs, a premier semiconductor testing and engineering house based in Fremont, California, USA. Tien also serves as a member of the Board of Directors at Advanced Semiconductor Engineering Inc.

Tien plays a vital role from defining and mapping ASEfs execution path to continuously charting the companyfs growth. His personal involvement in expanding mutually beneficial partnerships with customers and vendors consistently provides an impetus for ASE to strengthen its leadership position and widen its market share. In 2003, ASE emerged to be number one in the semiconductor packaging and test service provider market. Tien is also responsible for all ASE sales and marketing activities worldwide.

Prior to joining ASE, Tien Wu held several management positions within IBM including R&D, process development, manufacturing, application and ASIC design, marketing, and sales in the United States, Europe, and Asia-Pacific. Tien holds twelve U.S. patents in the field of microelectronics and has authored over twenty-five articles published in leading journals & academic books. Tien has a BSCE degree from Taiwan University, and also earned MS and Ph.D. degrees in mechanical engineering and applied mechanics from the University of Pennsylvania.

Other Affiliation

Board of Directors, Global Semiconductor Alliance.

Dr. Bernard S. Meyerson

VP Strategic Alliances and CTO, IBM Fellow
IBM Systems and Technology Group,
IBM Corp.
"From Radical Innovation to Radical Collaboration - The Industry in Flux"

Semiconductor technology is no longer proceeding down the path of the prior 40 years, the ability to benefit from further scaling alone having been lost. This discontinuity led segments of the industry over a "power cliff" many did not see coming, driving the need for dramatic strategic and organizational shifts. Forced to move to a strategy demanding continuous innovation as the alternative to ongoing scaling, industry R&D expenditures grew at rates rendering prior business models and alignments financially unsustainable. This chain of events has led to a consolidation of competitors around global innovation networks engaged in pre-competitive alliances, and the emergence of a model based upon coopetition as a business imperative as opposed to an option. Through alliances based upon the integration of both physical and intellectual capital, companies once again have achieved the critical mass required for financial stability. Similarly, new technical models based upon Holistic Design, a system based view of technology's future, has displaced semiconductor technology as the key differentiator in the global IT arena. This talk will explore the implications these changes have for both our industry and society at large.

Biography

Dr. Meyerson is Vice President for Strategic Alliances and Chief Technology Officer (CTO) of IBMfs Systems and Technology Group (STG). Dr. Meyerson was appointed to this position in December 2005.

In 1980, Dr. Meyerson joined IBM Research as a Staff member, leading the development of silicon:germanium and other high performance technologies over a period of 10 years.

In 1992, Dr. Meyerson was appointed an IBM Fellow - IBMfs highest technical honor. In 2001 he was appointed Chief Technologist of IBMfs Technology Group, and in 2003 he assumed operational responsibility for IBMfs global semiconductor R&D efforts. In that role Dr. Meyerson led the worldfs largest semiconductor development consortium - members being IBM, Sony, Toshiba, AMD, Samsung, Chartered Semiconductor, and Infineon.

Dr. Meyerson is a Fellow of the American Physical Society and the Institute of Electrical and Electronics Engineers, Inc. (IEEE). He is also a member of the National Academy of Engineering. He has received numerous awards for his work, which include: the Materials Research Society Medal, the Electrochemical Society Electronics Division Award, the IEEE Ernst Weber Award, the Electron Devices Society J. J. Ebers Award, and most recently the 2007 Lifetime Achievement Award from SEMI.

Dr. Meyerson was cited as "Inventor of the Year" by the New York State Legislature in 1988, and he was recognized as "United States Distinguished Inventor of the Year" by the US IP Law Association and the Patent and Trademark office in 1999.

Dr. Meyerson and his team was the subject of a long-running study on the topic of innovation in large organizations, culminating in the 2001 Harvard Business School Press publication titled: "Radical Innovation; How Mature Companies Can Outsmart Upstarts."

Dr. Reinhard Ploss

Member of the Management Board Operations
Infineon Technologies AG
"Manufacturing Challenges in Automotive Nanoelectronics"

Biography

1981 - 1986 Assistant position leading to Munich Doctorate in Engineering at Technical University of Munich

1986 - 1992 several Group Manager positions:Process Engineering for Ion Implantation;Development, Ion Implantation;Ion Implantation and Epitaxy at Siemens AG, Munich

1992 - 1996 several leading positions within Process Engineering & Product Engineering group; inally responsible for the whole group at Siemens AG, Villach (Austria)

1996 - 1999 VP & GM of Power Semiconductors Business Unit with focus on Development and Production at Siemens AG, Munich

1999 - 2000 President of eupec GmbH Co. KG at Infineon Technologies AG, Munich

2000 - 2005 SVP & GM of Automotive and Industrial (AI) Business Group at Infineon Technologies AG, Munich

since April 2005 Group Vice President & General Manager, Automotive, Industrial & Multimarket Group at Infineon Technologies AG, Munich

additionally:
since July 2003 CEO of Infineon Technologies Austria AG, Villach
since June 2007 Member of the Management Board, Head of Operations, Infineon Technologies AG
Education: Study of Chemical Engineering, Technical University Munich, Doctorate in Chemical Engineering