COMMITTEE
Japan Organizing Committee
- Chairman:
- Shozo Saito, Toshiba Corp.
- Vice Chairman:
- Tadahiro Ohmi, Tohoku University
- Committee:
- Keiji Horioka, Applied Materials Japan, Inc.
- Hirofumi Uchida, Dainippon Screen Mfg. Co., Ltd.
- Haruyoshi Yagi, Fujitsu Semiconductor Ltd.
- Michihiro Inoue, National Institute of Advanced Industrial Science and Technology (AIST)
- Yoshitake Ito, Omron Corp.
- Hiroyuki Umimoto, Panasonic Corp.
- Tetsuya Tsurumaru, Renesas Electronics Corp.
- Shuichi Inoue, Renesas Electronics Corp.
- Takahisa Yamaha, Rohm Co., Ltd.
- Takanobu Kaitsuka, Tokyo Electron Ltd.
- Tadashi Nishimura, Tokyo Institute of Technology
- Takashi Yoda, Toshiba Corp.
Japan Advisory Board
- Board Members
- Satoru Ito
- Katsuhiro Tsukamoto, Mitsubishi Electric Corp.
- Hajime Sasaki, NEC Corp.
- Tsuyoshi Kawanishi, TEK Consulting
Japan Executive Committee
- Chairman:
- Shuuichi Inoue, Renesas Electronics Corp.
- Vice Chairman:
- Makoto Hirayama, State University of New York, College of Nanoscale Science and Engineering
- Committee:
- Keiji Horioka, Applied Materials Japan, Inc.
- Hirofumi Uchida, Dainippon Screen Mfg. Co., Ltd.
- Kensuke Uriga, Dura Systems, Inc.
- Takeshi Hattori, Electronic Journal
- Isamu Hanyu, Fujitsu Semiconductor, Ltd.
- Hiroyuki Chuma, Hitotsubashi University
- Naoki Kitano, Intel K.K
- Masao Shimizu, Omron Corp.
- Hiroyuki Umimoto, Panasonic Corp.
- Koji Maekawa, PDF Solutions, Inc.
- Akira Kamisawa, Rohm Co., Ltd.
- Yoichi Nakagawa, SEMI
- Masayasu Tsunematsu, Semiconductor Equipment Association of JapaniSEAJ)
- Jun Ueda, Semiconductor Industry Research Institute of Japan(SIRIJ)
- Takanobu Kaitsuka, Tokyo Electron, Ltd.
- Takashi Yoda, Toshiba Corp.
Japan Program Committee
- Chairman:
- Toshiyuki Uchino, Renesas Electronics Corp.
- Executive Vice Chairman:
- Ayako Shimazaki, Toshiba Corp.
- Vice Chairman:
- Kiyotaka Imai, KLA-Tencor Japan Ltd.
- Hidetoshi Koike, Toshiba Microelectronics Corp.
- Committee leader:
- Kazunori Kato, Advanced Interface Technology Corp.
- Katsutoshi Ozawa, OMRON Corp.
- Shin-ichi Imai, Panasonic Corp.
- Isamu Namose, Seiko Epson Corp.
- Committee:
- Shinsuke Mizuno, Applied Materials Japan, Inc
- Itaru Namura, Fujitsu Semiconductor Ltd.
- Kenji Watanabe, Hitachi High-Technologies Corp.
- Eisuke Nishitani, Hitachi kokusai Electric Inc.
- Fumitaka Homma, LAPIS Semiconductor Co., Ltd.
- Masahiro Shinbo, SANYO Semiconductor Co.,Ltd.
- Minoru Akaishi, SANYO Semiconductor Co.,Ltd.
- Takatoshi Yasui, Panasonic Corp.
- Kenji Miyake, PMT Corp.
- Takeshi Akimoto, Renesas Electronics Corp.
- Yoshio Iwata, Renesas Electronics Corp.
- Toshiharu Katayama, Renesas Electronics Corp.
- Kazuki Yokota, Renesas Electronics Corp.
- Yoshiaki Yamamoto, Renesas Electronics Corp.
- Kyoichi Komachi, Rohm Co., Ltd.
- Yoshiaki Oku, Rohm Co., Ltd.
- Mitsuteru Kubo, Sony Semiconductor Corp.
- Yuj Ezaki, Texas Instruments Japan Ltd.
- Misako Saito, Tokyo Electron, Ltd.
- Hiromi Yajima, Toshiba Corp.
International Program Committee
- Chairman:
- Thomas Sonderman, GlobalFoundries
- Committee:
- Bill Arnold, ASML
- Aarthi Venkateshan, Canon Anelva Corp.
- Jeff McNeil, Cypress
- Lothar Pfitzner, Fraunhofer - IIS-B
- Linda Milor, Georgia Tech
- Els Van Moorhem, IMEC
- Scott Kramer, Mattson Technology
- Shi-Chung Chang, National Taiwan University
- Keith J. Hansen, Novellus Systems Inc.
- Fumitake Mieno, SMIC
- Christian Carlier, ST Microelectronics
- SY Sheen, TSMC
- Risto Puhakka, VLSI Research
