Home - AEC/APC Symposium Asia 2021

A survey has been distributed to all participants. After answering the questionnaire, you can download the presentation materials of the keynote speech. If you have not received it, please contact us at
aecapc_2021@semiconportal.com.

AEC/APC Symposium Asia 2021 Report

Thank you very much for your attendance at AEC/APC Symposium Asia 2021!
We had more than 300 expertise from 4 regions.
Look forward to seeing you in 2023 in Japan.

AEC/APC Symposium Asia 2021 Awards

AEC/APC Symposium Asia 2021 Best Paper
TDA-014
"Application of Contrastive Representation Learning to Unsupervised Defect Classification in Semiconductor Manufacturing"
Shota Mizukami, Kioxia

AEC/APC Symposium Asia 2021 Student Award
MPC-010
"Development of Virtual Metrology Using Plasma Information Variables to Predict Si Etch Profile Processed by SF6/O2/Ar Capacitively Coupled Plasma"
Ji-Won Kwon, Seoul National University

What's New

NEW! Those who have registered for the AEC/APC Symposium Asia 2021 will be able to view the presentations on-demand until December 31.
An email invitation to the "Virtual Attendee Hub" and "Proceedings" was sent out to registrants today.
If you have not received it, please contact the secretariat. at aecapc_2021@semiconportal.com (10/28)
Please see the attendee manual from here. You can find access to Virtual attendee Hub to join the symposium, (To join the symposium, you need to register first) (10/28)
Registration is now open. Please take advantage of the early bird discount registration!
The Program Schedule is now available.
"AEC/APC Symposium Asia 2021 Virtual Symposium Presentation Guidelines" is updated.
The notification of abstract acceptance of AEC/APC Symposium Asia 2021 has been sent to the all authors.
The keynote Speaker's information is now available.
Accepted Author’s guideline is now available.

AEC/APC Symposium Asia 2021 Message

High-speed, high-performance and high-functionality semiconductor devices have made a great contribution to development of digitalized society. According to some estimates, however, along with an explosive increase of data volume, calculation amount and communication traffic, their power consumption is expected to exceed total amount of power generated on the earth in a few years.
AEC/APC has made a long-term contribution so far, as one of the key enabling technologies, to increase productivity of semiconductor devices. As new digital technologies such as AI and IoT spread in the market, more efficient and valuable initiative of digital transformation (DX) has started. In addition to DX promotion to enhance its competitive edge, each business is now required to address sustainability transformation (SX) which features broader perspective to contribute to the fields of ESG (environment/society/governance). SDGs are ultimate goals that every business must pursue.
It is essential for semiconductor devices to achieve lower power consumption in addition to higher speed, performance and functionality. Higher efficiency is required in R&D and startup of high-volume production. Environmental footprints need to be reduced also at the stage of production of semiconductor devices. Lowering costs and lead time through further productivity enhancement and process optimization is one of the solutions to reduce environmental footprints, but more comprehensive efforts are required so as to optimize consumption of utilities and raw materials or to extend environmental initiatives to supply chain and engineering chain. Amid such circumstances, AEC/APC providing various control loops, both small and large, grows increasingly important and need to evolve furthermore.