Quake damage recovery list

A snapshot of companies' progress in restoring operations damaged by the M9 earthquake

A snapshot of companies' progress in restoring operations damaged by the M9 earthquake

Some people outside Japan may have the impression that the entire country suffered earthquake damage and is contaminated by radiation from the crippled Fukushima Daiichi Nuclear plant. Fortunately, that is not the case. Most of Japan has suffered no direct damage. Meanwhile, the nation has rallied to help the people in the earthquake- and tsunami-ravaged areas where an immense effort to restore normality is now underway. What is true of Japan as a whole also is true of its companies. Here is a list indicating the extent of the damage and progress to date in getting operations back to normal.

 » Press releases on the impact of the earthquake

Company Updated on Products impacted by the earthquake
Advantest March 23 Semiconductor equipment
Canon March 23 Lens, semiconductor equipment, printers, toners and cartridges
Covalent Materials March 16 Silicon wafer
Elpida March 17 DRAMs
Fujitsu April 14 Semiconducor, peripherals
MEMC March 29 Silicon wafer
Nikon March 25 Lenses, devices for semiconductor/FPD scanner/stepper, digital cameras
On Semiconductor March 17 Semiconductor
Panasonic March 17 Digital consumer products, professional equipment
Renesas Electronics April 22 new Semiconductor
Rohm April 6 Semiconductor
Shin-Etsu Handotai March 29 Single-crystal silicon ingot, silicon wafers
Sony March 17 Lithium-ion batteries, lasers, discs, IC cards
SUMCO April 26 new Single-crystal silicon ingot, silicon wafers
Toshiba April 12 Semiconductors, LCDs
TEL(Tokyo Electron) April 4 Semiconductor equipment

Advantest

Facilities/subsidiary city, prefecture products
Advantest Laboratories Sendai, Miyagi
  • Damaged: Started desk work on Mar. 22. No damage to test and production equipment. Inspection of clean room is underway to begin operation by the end of this month. (Mar. 23)
Sendai Factory (Advantest Component) Sendai, Miyagi Testers
  • Damaged: Sharing the clean room with Advantest Laboratories. No damage to test and production equipment. Inspection of clean room is underway to begin operation by the end of this month. (Mar. 23)
Gunma Factory Ora-gun, Gunma Testers, handlers
  • Light damage to buildings. Operation already resumed. (Mar. 23).
Gunma Factory 2 Ora-gun, Gunma Testers, handlers
  • Light damage to buildings. Operation already resumed. (Mar. 23).
Gunma R&D Center Ora-gun, Gunma
  • Light damage to buildings. Operation already resumed.. (Mar. 23)
Saitama R&D Center Kazo, Saitama
  • Light damage to buildings. Operation already resumed. (Mar. 23).

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Canon

Facilities/subsidiary city, prefecture products
Canon/Utsunomiya PlantUtsunomiya Plant Utsunomiya, Tochigi Lenses for video camcorders, broadcasting cameras, business machines, LCD projectors, etc.
  • Heavily damaged: halted operation¡¨investigation of damage underway¡¨expected to take time until resumption. (Mar. 23)
Canon/Utsunomiya PlantUtsunomiya Optical Products Plant Utsunomiya, Tochigi Semiconductor/LCD exposure units, mirror projection aligners
  • Heavily damaged: same as above (Mar. 23).
Canon/Utsunomiya PlantOptics R&D center Utsunomiya, Tochigi R&D in optical technologies and broadcasting equipment
  • Damaged: resumed operation on Mar. 22. (Mar. 23)
Toride Plant Toride, Ibaraki Office imaging products and chemical products
  • Damaged: operation halted and investigation of damage underway. (Mar. 23)
Ami Plant Inashiki-gun, Ibaraki Manufacturing of liquid crystal exposure equipment and semiconductor exposure equipment parts
  • Damaged: operation halted and investigation of damage underway.(Mar. 23)
Canon Precision Hirosaki, Aomori Micromotors, toner cartridges and sensors
  • Damaged: resumed operation on Mar. 23. (Mar. 23)
Canon Optron Yuki,Ibaraki Optical crystals (for steppers, cameras, telescopes) and vapor deposition materials
  • Damaged: halted operation this week (up to Mar. 25); operation next week in suspense (Mar. 23)
Canon Chemicals/Headquarters Tsukuba, Ibaraki Toner cartridges and advanced functional polymer components
  • Damaged: operation resumed partially last week and returned to full operation this week (Mar. 23)
Canon Chemicals/Kasama plant Kasama, Ibaraki Toner cartridges and advanced functional polymer components
  • Damaged: operation resumed partially (Mar. 23)
Fukushima Canon Fukushima, Fukushima Inkjet printers, print heads and ink tanks
  • Heavily damaged: resumed operation on Mar. 22. (Mar. 23)
Canon Mold Kasama, Ibaraki Precise plastic molding
  • Halted operation; returned to full operation (Mar. 23)

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Covalent Materials

No damage to production facilities reported.

Facilities/subsidiary city, prefecture products
Oguni plant Oguni, Yamagata Silicon wafers
  • No damage: operation halted but resumed. (March 16)
Covalent silicon Kitakambara-gun, Niigata Main production base for silicon wafers
  • No damage: operation halted but resumed (March. 16)

*Dates in parentheses are latest updates.

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Elpida

Facilities/subsidiary city, prefecture products
Akita Elpida Akita, Akita Packaging and text
  • No damage: operation resumed on Mar. 16 as power supply is being restored step by step. (Mar. 17)

*Dates in parentheses are latest updates.

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Fujitsu

Facilities/subsidiary city, prefecture products
Fujitsu Semiconductor Iwate fab Tanasawa-gun, Iwate 6/8" front-end lines for SoC LSIs
  • Targeting resumption of operation on April 20. (April 14)
  • Operation halted by an aftershock on the night of April 7. Damage inspection and preparation for resumption underway (April 12)
  • Operation partially resumed on April 3. (April 3).
  • Preparing for resumption of the front-end process. (March 24)
  • Power supply partly restored and investigation of damage underway. (Mar. 17)
Fujitsu Semiconductor Aizu Wakamatsu fab Aizu Wakamatsu, Fukushima 6/8" front-end lines for SoC LSIs
  • Operation partially resumed on March 28. (March 28)
  • Preparing for resumption of the front-end process. (March 24)
  • Damaged: investigation of damage underway. (Mar. 17)
Fujitsu Semiconductor Technology Aizu Wakamatsu, Fukushima 8" front-end: flash microcontrollers/flash memories
  • Targeting resumption of operation on April 20. (April 14)
  • Operation halted by an aftershock on the evening of April 11. Damage inspection and preparation for resumption underway (April 12)
  • Operation partially resumed on March 28. (March 28)
  • Preparing for resumption of the front-end process. (March 24)
  • Damaged: investigation of damage underway. (Mar. 17)
Fujitsu Integrated Microtechnology Aizu Wakamatsu, Fukushima Packaging, test services
  • Operation of test process partially resumed. (March 24)
  • Damaged: investigation of damage underway. (Mar. 17)
Fujitsu Integrated Microtechnology Miyagi plant Shibata-gun, Miyagi Packaging, test services
  • Operation partially resumed.on March 23 (March 24)
  • Damaged: power supply partly restored and investigation of damage underway. (Mar. 17)
Fujitsu Isotec Date, Fukushima) Assembly: Printers
  • Full-capacity operation started on March 28 for PC servers. PC production started partially. (March 28)
  • Production of printers started on March 22 and of PC servers on March 23. Shimane Fujitsu (in western Japan) started shouldering more PC production on March 23 (March 24.)
  • Damaged: investigation of damage underway.

*Dates in parentheses are latest updates.

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MEMC

Facilities/subsidiary city, prefecture products
  • Damaged: operation halted, inspection underway. (March 15)
  • Restoration underway targeting resumption on April 11. (March 29)

*Dates in parentheses are latest updates.

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Nikon

Eight facilities were damaged and halted operation.

Facilities/subsidiary city, prefecture products
Mito Plant Mito, Ibaraki Custom products, R&D of production technology
  • Resumed operation on March 23. (March 24)
  • Damaged operation halted (March 18)
Sendai Nikon Sendai, Miyagi Professional-use and high-end SLR cameras
  • Preparing to resume operation by the end of March (March 24)
  • Damaged operation halted. No prospect of resumption for the time being (March 18)
Miyagi Nikon Precision Natori, Miyagi Devices for IC and LCD steppers and scanners
  • Preparing to resume operation by the end of March (March 24)
  • Damaged operation halted. No prospect of resumption for the time being (March 18)
Nikon-Trimble/Zao plant Karita-gun, Miyagi Surveying instruments
  • Resumed operation on March 23. (March 24)
  • Damaged operation halted (March 18)
Tochigi Nikon Ota, Tochigi Interchangeable lenses and optical lenses
  • Resumed operation on March 18. (March 24)
  • Damaged operation halted (March 18)
Tochigi Nikon Precision Ota, Tochigi Devices for IC and LCD steppers and scanners
  • Resumed operation on March 23. (March 24)
  • Damaged operation halted (March 18)
Kurobane Nikon Yuki,Ibaraki Objective lenses for microscopes, measuring instruments, semiconductor inspection equipment
  • Resumed operation on March 23. (March 24)
  • Damaged operation halted (March 18)
Nasu Nikon Tsukuba, Ibaraki
  • Resumed operation on March 23. (March 24)
  • Damaged operation halted (March 18)

*Dates in parentheses are latest updates.

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On Semiconductor (Sanyo Semiconductor)

On Semiconductor completed acquisition of Sanyo Semiconductor from Sanyo Electric in January.

Facilities/subsidiary city, prefecture products
Sanyo Semiconductor Niigata fab Ojiya, Niigata Front-end: Discrete ICs, power devices, analog ICs
  • No damage: (Mar. 17)
Sanyo Semiconductor Gunma fab Ora-gun, Gunma Front-end: Discrete ICs, power devices, analog ICs
  • Inspection of damage underway; operation halted after the earthquake; preparing for start-up when power supply resumes. (Mar. 17)

The company said there will be no delay in delivery in its statement in Japanese.

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Panasonic

Facilities/subsidiary city, prefecture products
Panasonic AVC/ Sendai plant Sendai, Miyagi Digital consumer products
  • Damaged: facilities damaged aftershocks have prevented engineers from entering the buildings to investigate damage. (Mar. 17)
Panasonic AVC/ Fukushima plant Fukushima, Fukushima digital consumer products
  • Damaged: facilities damaged and employees lightly injured; aftershocks have prevented engineers from entering the buildings to investigate damage. (Mar. 17)
Sanyo Tokyo Works Ora-gun, Gunma industrial air conditioner, store equipment
  • Damaged: buildings damaged operation resumed partially on Monday; operation will be limited because of scheduled power outages. (Mar. 17)

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Renesas Electronics

Facilities/subsidiary city, prefecture products
Renesas Kitanihon Semiconductor Tsugaru fab Goshogawara, Aomori 6" front lines: microcontrollers for automotive, general-purpose applications
  • A M7.1 aftershock on April 7 disrupted electricity supply from Tohoku Electric Power and halted operation. Preparations underway for resumption of operation within April. (April 12)
  • Full operation started on April 1. (April 7)
  • Operation partially resumed on March 20 with limited capacity (March 25)
  • Damaged: buildings damaged; status of production facilities unclear as there is no power supply; when power supply resumes, inspection of damage will start. (Mar. 17)
Yonezawa plant Yonezawa, Yamagata Back-end:
  • Operation resumed on March 19 but may be subject to scheduled power outages" (March 25)
  • Damaged: Buildings and production facilities are damaged; but preparations are underway to resume operation; but operation will be limited in view of scheduled power outages. (Mar. 17)
Renesas Yamagata Semiconductor Tsuruoka, Yamagata 300mm front-end lines: system-on-chip LSIs for digital consumer products
  • A M7.1 aftershock on April 7 disrupted electricity supply from Tohoku Electric Power and halted operation. Preparations underway for resumption of operation within April. (April 12)
  • Full operation started on April 6. (April 7)
  • Operation resumed on March 22 with limited capacity (March 25)
  • No damage: operations were halted when the earthquake struck and are now ready for resumption; but as Tohoku Electric Power has scheduled power outages, the facilities are shut down; resumption of operation depends on availability of stable power supply. (Mar. 17)
Renesas Electronics / Naka fab Hitachi Naka, Ibaraki 300mm and 200mm front-end lines: microcontrollers and system LSIs for mobile phones
  • Test run to start on April 23 and mass production scheduled to begin on June 15 at the 200mm line. (April 22)
  • Restoring production facilities on both the 300mm and 200mm lines. Started raising the cleanliness level in the 200mm cleanroom on April 10. Renesas revised its estimation and expects resumption is likely to be earlier than July (April 12)
  • Partial resumption of operation targeted for July (April 6)
  • Started repairing power supply for production facilities on March 28. Equipment out of alignment in both the 300mm and 200mm cleanrooms. Resumption schedule to be announced next week. (April 1)
  • Inspection underway targeting resumption partially in July. (March 29)
  • Heavy damage to internal power supply, power partially restored, available only for lighting; damage investigation of 300mm lines started on March 20 and 200mm lines on March 24. (March 25)
  • Damaged: Buildings and production facilities are damaged; operation suspended; no power available; when power supply resumes, detailed inspection of damage will be carried out. (Mar. 17)
Renesas Electronics / Takasaki fab Takahashi, Gunma 5"/6" front-end lines for power MOS semiconductors
  • Full operation resumed on April 12 as scheduled power outages were cancelled. (April 12)
  • Resumed wafer test process on March 26 and backside grinding process on April 6, as these operations can be scheduled even though outages are anticipated. (April 7)
  • Operation halted, resumption dependent on the termination of scheduled power outages (March 25).
  • Damaged: Buildings are damaged but production facilities are OK; Operation is halted in view of scheduled power outages planned for Takasaki; resumption of operation depends on availability of stable power supply. (Mar. 17)
Renesas Electronics / Kofu fab Kofu, Yamanashi 6"/8" front end lines for power MOS semiconductor
  • Full operation resumed on April 12 as scheduled power outages were cancelled. (April 12)
  • Resumed wafer test process on March 25 and backside grinding process on April 6, as these operations can be scheduled even though outages are anticipated. (April 7)
  • Operation halted, resumption dependent on the termination of scheduled power outages (March 25).
  • Damaged: buildings and production facilities are damaged; preparations underway for resumption of operation; but resumption depends on the availability of stable power supply, scheduled power outages planned for Kofu. (Mar. 17)
Renesas High Components Kitatsugaru-gun, Aomori Back-end
  • Operating at full capacity as scheduled power outages were cancelled. (April 12)
  • Operation resumed on March 19 but may be subject to scheduled power outages.(March 25)
  • No damage: preparing to restart operation; but restart depends on availability of stable power supply; scheduled power outages planned for Aomori Prefecture. (Mar. 17)
Renesas Eastern Japan Semiconductor Oume, Tokyo Back-end
  • Operation of certain processes resumed but may be subject to scheduled power outage. Scheduled to shift full operation from April 1. (March 25)
  • No damage: Production partially restarted in view of scheduled power outages; as pure water supply has stopped, production is limited to products already on the lines. (Mar. 17)

*Dates in parentheses are latest updates.

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Rohm

Rohm reports progress of recovery day by day in detail. Please refer to "Press releases on the impact of the earthquake"

Facilities/subsidiary city, prefecture products
OKI Semiconductor Miyagi Kurokawa-gun, Miyagi LSIs
  • Operation is scheduled to resume on April 10. (April 4)
  • Water supply restored. Targeting resumption of operation in early April. (March 28)
  • Power supply restored, but water supply not yet restored. (March 22)
  • Operation suspended because of unavailability of utilities. Substitute production system is being formulated at the ROHM Kyoto main factory and ROHM Hamamatsu Co., Ltd. (March 16)
ROHM Tsukuba Tsukuba, Ibaraki Transistors, diodes
  • Full operation resumed on March 31 (April 1)
  • Water supply for the factory restored and water purification system started running. (March 21)
  • Operation resumed partially on March 19, though water supply to the factory is not yet restored. (March 20)
  • Operation suspended because of unavailability of utilities. Substitute production system at ROHM Wako Devices Co., Ltd. and ROHM Apollo Devices Co., Ltd., maintains supply to customers (March 16)
OKI Semiconductor Hachioji, Tokyo Monolithic ICs
  • No damage: Operations are subject to scheduled power outages.

*Dates in parentheses are latest updates.

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Shin-Etsu

Facilities/subsidiary city, prefecture products
Shirakawa plant Shirakawa, Fukushima Single-crystal silicon ingot, 300mm and 200mm polished and epi wafers
  • Detailed survey of the damage yet to be completed because of aftershocks.(March 29)
  • Inspection suspended because of aftershocks: unclear about the timing of resumption (March 17)
  • Ongoing Inspection revealed damage to production facilities. (March 15)
  • Damaged: operation halted. (March 12)
Mimasu Semiconductor Industry Takasaki, Gunma 300mm wafers
  • Operation may be subject to rolling power outages. (March 15)
  • Damage was light and operation resumed on March 13. (March. 14)

*Dates in parentheses are latest updates.

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Sony

The following units stopped operation after the earthquake.

Facilities/subsidiary city, prefecture products
Sony Chemical & Information Device Tagajo plant Tagajo, Miyagi Magnetic tapes, Blu-ray discs
  • Damaged: severe flooding; operation halted; no power; inspection of damage underway. (Mar. 17)
Sony Chemical & Information Device Tome Plant Tome, Miyagi Optical components, IC cards
  • Damaged: operation halted; no power; inspection of damage underway. (Mar. 17)
Sony Chemical & Information DevicesKanuma plant Kanuma/Ibaraki Materials for electronic components
  • No damage: operation halted voluntarily; resumed operation on Wednesday but liable to disruption by scheduled power outages. (Mar. 17)
Sony Shiroishi Semiconductor Shiroishi/Miyagi Semiconductor lasers
  • Damaged: preparing for start-up. (Mar. 17)
Sony Energy Device /Koriyama plant Koriyama /Fukushima Lithium-ion batteries
  • No damage: the plant is located within 50-60km of the stricken Fukushima Daiichi Nuclear Power Station and the authorities ordered the company to allow employees to stay at home; so, although there is no damage, operation is halted. (Mar. 17)
Sony Energy Device /Motomiya plant Motomiya /Fukushima Lithium-ion batteries
  • No damage: the plant is located within 50-60km of the stricken Fukushima Daiichi Nuclear Power Station and the authorities ordered the company to allow the employees to stay at home; so, although there is no damage, operation is halted. (Mar. 17)
Sony Manufacturing Systems Kuki, Saitama Mounting equipment
  • No damage: resumed operation on Tuesday but liable to disruption by scheduled power outages. (Mar. 17)
Sony DADC Japan /Ibaraki plant Naka, Ibaraki CD, DVD
  • No damage: resumed operation. (Mar. 17)
Sony / Sendai Technology Center Tagajo, Miyagi R&D
  • Damaged: severe flooding; operation halted; no power; investigation of damage underway. (Mar. 17)

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  • Damaged:

    • SUMCO

    Six facilities in Japan other than the Yonezawa plant are operating normally.

    Facilities/subsidiary city, prefecture products
    Yonezawa plant Yonezawa, Yamagata Single-crystal silicon ingots, silicon wafers
    • Restoration is scheduled to be completed in early May and production will return to normal in May. (April 22)
    • Operation partially restarted. Still experiencing large aftershocks, but no serious damage. Backup production at plants in western Japan started. (April 12)
    • Ongoing inspection revealed damage to facilities and equipment; restoration started. Resumption may be affected by rolling power outages and material supply chain (March 28)
    • Damaged: operation halted. (March 14)
    Mimasu Semiconductor Industry Takasaki, Gunma
    • Operation may be subject to rolling power outages. (March 15)
    • Damage was light and operation resumed on March 13. (March. 14)

    *Dates in parentheses are latest updates.

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    TEL (Tokyo Electron)

    TEL has established communications with all suppliers in the stricken area and more than 90% of them are expected to restart operations soon. TEL expects minimal impact on production schedules for the first half (April-September) of this fiscal year ending March 2012.

    Facilities/subsidiary city, prefecture products
    Tokyo Electron Tohoku Oshu, Iwate Thermal processing systems
    • Operation partially resumed on March 17¡¤ normal operation resumed (April 4)
    • Light damaged: utilities are available and quick recovery is expected. (March 17)
    Tokyo Electron Technology Development Institute Sendai, Miyagi R&D and manufacture of RLSA etchers
    • Operation partially resumed on March 28. Manufacturing facilities are also operating (April 4)
    • Light damage: once utilities recover, operation is estimated to be resumed in one week. (March 17)
    Tokyo Electron Miyagi/Matsushima plant** Matsushima-cho, Miyagi plasma etchers
    • Operation partially resumed on March 28. Recovery of cleanroom functionality underway. Deliveries will begin mid-April to early May. Tokyo Electron Yamanashi is expanding its capacity to cover the reduced operation at this plant. (April 4)
    • Damaged: once utilities recover, operation is estimated to be resumed in 2-4 weeks. (March 17)
    Tokyo Electron Miyagi/headquarters Taiwa-cho, Miyagi Development and manufacturing of etchers
    • Light damage to buildings: Under construction. No facilities installed yet. The opening originally scheduled in April has been postponed until July, considering availability of manpower for construction, stable supplies from utilities and smooth relocation of employees. The headquarters plant is scheduled to begin operation in October. (April 4)
    • Investigation underway. (March 23)
    Tokyo Electron Yamanashi Nirasaki, Yamanashi Plasma etchers, CVD systems, FPD etchers/ashing systems
    • No damage: Covering etcher production for Tokyo Electron Miyagi Matsushima plant.

    *Dates in parentheses are latest updates.

    **Former Tokyo Electron AT, which was transferred to a plant of Tokyo Electron Miyagi as of April 1.

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    Toshiba

    Facilities/subsidiary city, prefecture products
    Iwate Toshiba Electronics Kitakami, Iwate 6" front-end lines: SoC LSIs and CMOS sensors
    • Resumption scheduled for April 11 delayed about one week because of a 7.1 aftershock on April 7. (April 12)
    • Started test operation on March 28. Partial resumption of production scheduled for April 11. (April 1)
    • Power partly recovered; investigation inside cleanroom started; some lines are out of alignment; setting up equipment for production is scheduled to begin on March 28; part of production shifted to other fabs in Oita, Himeji and Kanazawa.(March 25)
    • Damaged: buildings are damaged; damage to production facilities will be investigated; no prospect of restart at present. (Mar. 17)
    Toshiba / Fukaya plant Fukaya, Saitama LCDs for TVs and mobile phones.
    • Operation scheduled to return to normal within April (April 12)
    • Setting up and testing equipment started. (April 1)
    • About one month for setting up for resumption; subject to scheduled power outages; part of production shifted to Ishikawa plant. (March 25)
    • Damaged: some lines are out of alignment; operation halted; about one month before resumption. (Mar. 17)
    Toshiba Medical Systems Nasu, Tochigi Medical CT scanning systems
    • Damaged: operation resumed and no impact on supply chain. (March. 25)

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