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¡þToshiba to split up its businesses-Toshiba is to restructure itself into three separate entities, reports the Nikkei. (11·î8ÆüÉÕ¤± Electronics Weekly (UK))

¡þToshiba to split into 3 companies by 2023-Toshiba plans to divide into 3 -New entities to list separately to maximize shareholder returns and profit (11·î9ÆüÉÕ¤± Nikkei Asian Review (Japan))
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¡þToshiba to split into three units after pressure from activists-Toshiba to divide into 3 companies (11·î12ÆüÉÕ¤± Bloomberg)

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¡þGeneral Electric Stock Soars On Plans to Split Iconic Group Into Three Companies-GE to split into 3 firms for aviation, energy, health care (11·î9ÆüÉÕ¤± TheStreet)
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¡þNvidia creates digital twin of Earth to battle climate change-Nvidia takes on climate change, creates digital Earth 2 (11·î9ÆüÉÕ¤± VentureBeat)
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¡þVirtual world builder: Nvidia positions Omniverse Enterprise as its metaverse creation platform (11·î9ÆüÉÕ¤± FierceElectronics)
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¡þNvidia builds out its Omniverse with Avatar and Replicator tools (11·î9ÆüÉÕ¤± SILICON VALLEY BUSINESS JOURNAL)
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¡þNvidia makes massive language model available to enterprises-Nvidia embraces the "omniverse," offers huge language model (11·î9ÆüÉÕ¤± VentureBeat)
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¡þNvidia launches new products to plug cars, factories into its Omniverse (11·î9ÆüÉÕ¤± Reuters)

¡þNvidia Touts Computing at Both Ends of the Scale (11·î10ÆüÉÕ¤± EE Times)
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¡þNvidia Touts Computing at Both Ends of the Scale (11·î12ÆüÉÕ¤± EE Times India)

¡þNvidia CEO says metaverse is ¡Ænot hype¡Ç and outlines massive Earth digital twin (11·î10ÆüÉÕ¤± FierceElectronics)
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¡þSamsung to discontinue DDR3 product line in 2 years (11·î9ÆüÉÕ¤± DIGITIMES)

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¡þSK Hynix Demos 24GB HBM3 at 6.4 Gbps and Samsung Works on Cheaper H-Cube-SK Hynix and Samsung each unveil HBM3 memory products-HBM is developing, just not for consumers. (11·î11ÆüÉÕ¤± Tom's Hardware)
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