Companies - November 2009
- Nov 30
- DOCOMO: Notice Concerning Outcome and Conclusion of Share Repurchase (Share Repurchase under the provisions of Articles of Incorporation pursuant to Article 165 (2) of the Corporation Law)
- Nov 30
- Hamamatsu Photonics: Announces the ORCA-D2 Dual CCD Camera with Interchangeable Optical Blocks for Simultaneous Dual Wavelength Imaging
- Nov 30
- OKI Networks Launches "Ipstage(R) 1000", a Smart Telephony Box Equipped with Key Telephone System and Broadband Router for the European and Japanese Markets
- Nov 30
- Renesas Technology: SH-Mobile Application Engine 4 breaks into GHz realm to open up an entirely new user experience and set the pace for true multimedia convergence
- Nov 30
- SDK to Strengthen Corporate Governance with New Setup
- Nov 30
- SDK: Changes in Corporate Management
- Nov 30
- Sony Commercializes World's First TransferJet(TM) Compatible LSIs
- Nov 30
- Toshiba Awarded Major Order for Mega Solar Power Generation Project By Tokyo Electric Power Company, Inc.
- Nov 27
- Asahi Glass: Announcement on determination of the total amount of issue, etc., of the Zero Coupon Convertible Bonds due 2012 and 2014
- Nov 27
- Epson: Transfer of the Epson Imaging Sales Function to the Sony Group
- Nov 27
- Epson Imaging Announces Executive Personnel Changes
- Nov 27
- Fujitsu Develops World's First Technology for Low-Temperature Full-Surface Direct Formation of Graphene Transistors on Large-Scale Substrates
- Nov 27
- Hitachi: Determination of Interest Rate and Conversion Price Formula for Convertible Bond Type Bonds with Stock Acquisition Rights
- Nov 27
- Honda Sets All-Time October Record for Auto Production in Asia and China
- Nov 27
- NEC Announces Adjustment of Conversion Prices of 1.0% Unsecured Yen Convertible Bonds due 2011 and Zero Coupon Unsecured Euro Yen Convertible Bonds due 2010
- Nov 27
- Sony: Transfer of the Epson Imaging Sales Function to the Sony Group
- Nov 27
- ULVAC Inc. to Launch Luminous NA-8000, New Plasma Ashing System Compatible with Extensive Range of Organic Film Processes for Semiconductor/Electronic Parts
- Nov 26
- Asahi Glass: Announcement of determination of the terms of issuance, etc., of the Zero Coupon Convertible Bonds due 2012 and 2014
- Nov 26
- Elpida Ships Samples of x32-bit I/O 2-Gigabit DDR2 SDRAM
- Nov 26
- Fujitsu Wins Minister of the Environment Award for Energy-saving PRIMERGY BX900 Blade Server
- Nov 26
- OMRON Announces Spin Off of Switch Business, Merger of Subsidiaries and Changes to Trade Names
- Nov 26
- SANYO Aims to Win Top Share of Japanese PV System Market in FY2013 (April 1, 2012 to March 31, 2013)
- Nov 26
- Tokyo Electron and ONYONE Jointly Develop Comfortable Dust-proof Cleanroom Suit
- Nov 25
- Asahi Glass: Announcement regarding the Issuance of Zero Coupon Convertible Bonds due 2012 and 2014
- Nov 25
- DOCOMO to Launch Environmental Sensor Network Business
- Nov 25
- JEITA: Domestic Shipments of Major Consumer Electronic Equipment (October 2009)
- Nov 25
- KYOCERA Headquarters 2009 Christmas Illumination & Concert Schedule
- Nov 25
- Mitsubishi Chemical: Verbatim(R), the World's No.1 Recording Media, releases PhotoSave DVD and OfficeSave DVD for simple photo, video, and data file backup!
- Nov 25
- Nippon Steel: The World' Longest 38m-Straight-web-type Sheet Piles Adopted for A Large-Scale Infrastructure Project Overseas -- The Inchon Bridge of the Republic of Korea --
- Nov 25
- OKI Unveils "ATM-Recycler G7", a Cash Recycling ATM for the Worldwide Market
- Nov 25
- OMRON to Launch Mass-production and Supply of MEMS Acoustic Sensor Chip
- Nov 25
- Panasonic Announces the Extension of the Period of the Tender Offer for SANYO Shares and Other Related Matters
- Nov 25
- Panasonic and SEAS-NVE start pilots of home energy management combined with Smart Grid
- Nov 25
- SANYO: Notice of Announcement by Panasonic regarding Extension of Term for Tender Offer by Panasonic for SANYO Shares
- Nov 24
- Mitsubishi Materials: Results for the Second Quarter Ended September 30, 2009
- Nov 24
- Mitsubishi Materials: Notice Regarding Discrepancies between Second-Quarter Performance Forecast and Actual Results, Revision of Full-Year Forecast, and Revision of Year-End Dividend Forecast
- Nov 24
- NEC Announces Determination of Number of New Shares to Be Issued
- Nov 24
- NEC withdraws its complaint submitted to the European Commission relating to Qualcomm's licensing practice
- Nov 24
- NEC Electronics Announces Development of Ethernet PHY Family for Industrial Automation Systems
- Nov 24
- OKI Uses "DressUP CockPit V3" to Reduce Cost of Monitoring its Group's Core System by 80 per cent
- Nov 24
- SANYO "eneloop bike" and "Solar Parking Lot" Receive Eco-Products Award from the Minister of Economy, Trade, and Industry
- Nov 20
- Asahi Glass: Myboka(R), A New Non-Wired, Thermal-Resistant Tempered Glass for Fire-resistant to be Released
- Nov 20
- Fujitsu Opens New Annex of Tatebayashi System Center
- Nov 20
- KYOCERA Founder Kazuo Inamori Receives "Entrepreneur for the World" Award
- Nov 20
- Panasonic Begins Delivery of P-01B Handsets to NTT DOCOMO
- Nov 20
- Panasonic to Deliver Full Lineup of HD Equipment to Vancouver 2010 Olympic Winter Games
- Nov 20
- Panasonic to Launch Marketing Campaign for Vancouver 2010 Olympic Winter Games
- Nov 20
- Toshiba Signs Memorandum of Understanding on Joint Venture for System LSI Assembly and Testing Service in China
- Nov 19
- Elpida Opens High Speed DRAM Test Laboratory at Munich Design Center
- Nov 19
- Elpida Completes Development of 1-Gigabit GDDR5
- Nov 19
- Epson Releases NS-8010 Series of Compact IC Test Handlers
- Nov 19
- Fujitsu Submits Cloud API Specification to DMTF And Joins Leadership Board of Open Cloud Standards Incubator
- Nov 19
- NTT Com to Enhance OCN Services
- Nov 19
- SDK to Develop New Liquid Electrolytes for Automotive LIBs
- Nov 19
- Sony Accelerates Transformation to Drive Innovation and Growth
- Nov 19
- TDK: Sample kit with varistors for transient voltage suppression up to 385 volts (TDK-EPC Corporation)
- Nov 18
- Asahi Glass: Notice of Posting of Extraordinary Gains regarding Transfer of Shares of a Subsidiary
- Nov 18
- DISCO: Introducing the DFL7020, Economical and Small Footprint Fully Automatic Laser Saw to Scribe Sapphire LED
- Nov 18
- DISCO: Introducing the DFL7161, Fully Automatic Laser Saw for 300 mm Wafers with Enhanced Basic Performance
- Nov 18
- Epson: Groundbreaking Epson Display Technology Presented at Inter BEE 2009
- Nov 18
- Fujitsu's Infrastructure-as-a-Service for Server Offers Flexibility in the Cloud
- Nov 18
- Fujitsu Completes Global ETERNUS DX Disk Storage Lineup with Mid-Range and Enterprise Systems
- Nov 18
- Fujitsu Introduces New True Zero Client Concept
- Nov 18
- Mitsubishi Electric 3MW Solar Panels to Power Italy's Coop Logistic Center.
- Nov 18
- NEC Announces Determination of Offer Price, Selling Price and Other Related Matters
- Nov 18
- ROHM: Additional products have been added to the OKI SEMICONDUCTOR lineup
- Nov 18
- ROHM: Completion of Acquisition of Kionix,Inc.
- Nov 17
- Canon gives Notice to AFM of Acquired Shareholding in Océ
- Nov 17
- Fujitsu Releases GLOVIA/SCP FA V8 Production Scheduling System
- Nov 17
- JEITA: Production by the Japanese Electronics Industry(September 2009)
- Nov 17
- NEC: INTEL, NEC TO DEVELOP SUPERCOMPUTER TECHNOLOGIES OF TOMORROW
- Nov 17
- NTT Com Collaborates with Conexus Mobile Alliance On Enterprise Smartphone Solutions
- Nov 17
- Renesas Technology to Release RS44X, RS45X, and RS46X High-Performance 16-Bit Secure MCUs with Dual Interface and MIFARE Plus S Support for Multifunction Smart Cards for Financial and ID Applications
- Nov 17
- ROHM: Fiscal Year 2010 Interim Financial Report posted.
- Nov 17
- SANYO Announces its Global Production Strategy for HIT Solar Cell
- Nov 17
- Sony: DNP, MPI and Sony Develop MasterCard Compatible IC Credit Card Using Plastic Derived from Biobased Polymer (PLA)
- Nov 17
- Toshiba develops molecular photoresist technology for EUV lithography
- Nov 16
- CANON AND OCÉ TO CREATE GLOBAL LEADER IN PRINTING INDUSTRY
- Nov 16
- DISCO: Introducing the Fully Automatic Thinning Process of Sapphire Substrates for LED
- Nov 16
- DISCO: Improvement in financial management levels in response to the recent business recovery
- Nov 16
- Elpida Announces New President for Subsidiary Akita Elpida
- Nov 16
- Fujitsu Microelectronics: Fujitsu Announces Fast-Response DC/DC Converter IC for Consumer Electronics
- Nov 16
- Hitachi Comments on the Articles of Hitachi's Financial Policy
- Nov 16
- Hitachi: Issuance and Sale of New Shares and Issuance of Call Option Attached Unsecured Bonds with Stock Acquisition Rights (Convertible Bonds)
- Nov 16
- Mitsubishi Chemical: World's No. 1 Recording Media Verbatim(R) Implementing a Collaborative Campaign with Idol Group AKB48 "Go ahead, make a record! AKB4800!"
- Nov 16
- NEC Announces First Integrated Ocean Observation System for Taiwan
- Nov 16
- Tokyo Ohka Kogyo Co., Ltd. Will Exhibit at SEMICON(R) Japan 2009
- Nov 13
- Fujitsu Introduces docomo PRIME Series F-01B
- Nov 13
- Fujitsu Introduces docomo STYLE Series F-02B
- Nov 13
- Fujitsu Laboratories' Fellow Kenichi Miura Wins Seymour Cray Award
- Nov 13
- Maxell: "Fact Book 2009" listed
- Nov 13
- OKI Reaches 20 Million Keyboard Shipments Landmark
- Nov 13
- Pioneer Takes Action against Garmin to Protect Intellectual Property
- Nov 13
- SANYO to Mass Produce New Large-capacity High-voltage Lithium-ion Battery Systems
- Nov 13
- Sony: Initiatives to Strengthen Sony's PC and Digital Imaging Businesses
- Nov 13
- Sony Chemical & Information Device Corporation to Realign Business Strategy and Reorganize Manufacturing Operations in order to Strengthen Business Structure
- Nov 13
- Toshiba Publishes Environmental Report in English Available On-line and in Print Edition
- Nov 12
- Epson Develops 0.52-inch QHD HTPS TFT Color Liquid Crystal Panel for Electronic Viewfinders
- Nov 12
- Fujitsu to Exhibit at SC09 Supercomputing Conference
- Nov 12
- Nippon Steel: Investment in, and obtaining control of, Latinusa, an Indonesian tinplate producer --Strengthening the tinplate business in the growing Asian market--
- Nov 12
- RIKEN: Key mucosal immune response mechanism identified
- Nov 12
- SANYO Releases New 'Contactless Charger Set for Wii Remote'
- Nov 11
- ALPS: Official Announcement Regarding Revisions to Financial Results Forecasts
- Nov 11
- ALPS: Results Briefing FY2009 2Q
- Nov 11
- Asahi Glass: A change in personnel
- Nov 11
- CRIEPI: Update Reports on Research Activities Settlement of Accounts (FY2008)
- Nov 11
- DISCO: Introducing the Z09 Series, Electroformed Blades with Fine Grit Size and High Strength Bond
- Nov 11
- Elpida: Rexchip earns the "Annual Enterprises Environmental Protection Award"
- Nov 11
- Elpida and Winbond Form DRAM Manufacturing Partnership
- Nov 11
- NEC Electronics Introduces 3 New 16-bit All Flash(TM) Microcontrollers with Embedded IEEE 802.15.4 Radio Transceiver for ZigBee(R) RF4CE
- Nov 11
- NTT: On-Demand Gigabit-class Video Transmission Successfully Proven on Testbed Networ
- Nov 11
- NTT Science and Core Technology Laboratory Group: On-Demand Gigabit-class Video Transmission Successfully Proven on Testbed Network
- Nov 11
- Pioneer and Sharp Announce Launch of Optical Disk Joint Venture
- Nov 11
- SANYO Announces a New Addition to eneloop universe products "eneloop stick booster"
- Nov 11
- Sharp: Pioneer and Sharp Announce Launch of Optical Disk Joint Venture
- Nov 11
- Sony: Mori Seiki and Sony Sign Memorandum of Intent Regarding Transfer of SMS Measuring Systems Business
- Nov 10
- Epson Announces Reference Design Kit for State-of-the-Art Drive Recorder IC
- Nov 10
- Fujitsu Launches SaaS-based E-Commerce Service
- Nov 10
- FUNAI: Presentation of Operating Results in 2Q of FY2009
- Nov 10
- NEC Electronics Expands Lineup of System LSI Devices for Automotive Infotainment
- Nov 10
- NTT DOCOMO Unveils 20 New Models — 19 handsets and 1 digital photo frame —
- Nov 10
- SANYO: JAPAN GOOD DESIGN – "eneloop" & "eneloop universe" Exhibit
- Nov 10
- Sharp Environmental Forum in Hangzhou
- Nov 10
- Sony Agrees to Further 3-year Support of the South Africa Mobile Library Project
- Nov 09
- Asahi Kasei: Fiscal 2009 Second Quarter Financial Results
- Nov 09
- DISCO: Introducing the DFD6341, fully automatic dicing saw for 200 mm diameter wafers with enhanced productivity
- Nov 09
- DISCO: DISCO resumes construction of the new building at the Chino Plant
- Nov 09
- Epson Develops World's First 4K Compatible HTPS TFT Liquid Crystal Panel for 3LCD Projectors
- Nov 09
- Fujitsu Interstage BPM Version 11 Lets Businesses Proactively "Sense and Respond" to Change
- Nov 09
- Hitachi: Notice Concerning Capital Injection Changes For the NEC Electronics and Renesas Business Integration
- Nov 09
- Mitsubishi: Notice Concerning Capital Injection Changes For the NEC Electronics and Renesas Business Integration
- Nov 09
- Mitsui Chemical: Statement on Accident at Production Facilities at Shimonoseki Mitsui Chemicals, Inc.
- Nov 09
- NEC: Notice Concerning Capital Injection Changes For the NEC Electronics and Renesas Business Integration
- Nov 09
- NEC Electronics: Notice Concerning Capital Injection Changes For the NEC Electronics and Renesas Business Integration
- Nov 09
- Nichia Files a Patent Infringement Lawsuit against Companies in China, Hong Kong and Canada
- Nov 09
- NTT: Financial Results for the Six Months Ended September 30, 2009
- Nov 09
- NTT Com Announces Financial Results for the Six Months Ended September 30, 2009
- Nov 09
- NTT DOCOMO: Notice Concerning Decision on Matters Relating to Share Repurchase (Share Repurchase under Article 165 (2) of the Corporation Law)
- Nov 09
- NTT East: Financial Statements for the Six Months Ended September 30, 2009
- Nov 09
- NTT West: Financial Statements for the Six Months Ended September 30, 2009
- Nov 09
- Renesas: Notice Concerning Capital Injection Changes For the NEC Electronics and Renesas Business Integration
- Nov 09
- RIKEN: Shaping the way we move
- Nov 09
- ROHM: "Notice Concerning Revisions to Forecast Data" posted.
- Nov 09
- ROHM: Power supply, logic, and voltage detector ICs added to the general-purpose IC search engine.
- Nov 09
- SDK to Commercialize Allyl Ester Resin for Spectacle Lenses
- Nov 06
- Asahi Kasei: Home Order Trends – October 2009
- Nov 06
- Casio Announces Spin-off to Establish a Small and Medium-Size Display Business Subsidiary and Partial Transfer of its Shares
- Nov 06
- Casio: Announcement Concerning Cooperative Venture in Small and Medium-Size Display Business (OLED and TFT Liquid Crystals)
- Nov 06
- Casio: Announcement of consolidated financial results for the second quarter of the fiscal year ending Mar.31 2010
- Nov 06
- DISCO: The dedicated website regarding SEMICON Japan 2009
- Nov 06
- Elpida Memory: Elpida and ProMOS Signed Agreement for DRAM Foundry Services
- Nov 06
- NEC Announces Issuance of New Shares and Secondary Offering of Shares
- Nov 06
- Panasonic: MT Picture Display files for hearing to overturn JFTC
- Nov 06
- Toppan: Announcement Concerning Cooperative Venture in Small and Medium-Size Display Business (OLED and TFT Liquid Crystals)
- Nov 05
- Asahi Glass: Consolidated Financial Results for the Nine Months ended September 30, 2009
- Nov 05
- AGC Revises the Consolidated Outlook for the Fiscal Year 2009
- Nov 05
- AGC Announces an Organizational Change
- Nov 05
- Asahi Glass: Changes in the assignments of Executive Officers
- Nov 05
- Elpida Memory: 2Q FY2009 financial release
- Nov 05
- Fujitsu Launches New Line of Transport Support Solutions
- Nov 05
- Funai: Consolidated Financial Summary in 2Q of FY2009
- Nov 05
- Honda Releases the Civic Type R Euro in Japan
- Nov 05
- JEITA: Imports of Electronics into Japan(August 2009)
- Nov 05
- JEITA: Exports of Electronics from Japan(September 2009)
- Nov 05
- Second Quarter of the Year ending March 2010 Financial Results/Financial and Business Data
- Nov 05
- DOCOMO to Add Service Option for Flat-rate Data Service— Maximum charge reduced for use at selected access points —
- Nov 05
- OKI Announces Consolidated Financial Results for the First Half (Apr.-Sept.) of the Fiscal Year ending March 31, 2010
- Nov 05
- OKI: Technical Journal -- "OKI Technical Review (Current Issue: Special Issue on Networks)" -- is updated.
- Nov 05
- Pioneer Announces Business Results for 2Q Fiscal 2010
- Nov 05
- Pioneer Announces Completion of Assessments on Antitrust Laws Overseas for Optical Disk Joint Venture
- Nov 05
- Pioneer Moves Its Head Office Location
- Nov 05
- SANYO Releases 8-Color AA-size "eneloop" Rechargeable Battery Pack and Product Sets that include the Simple "eneloopy" Battery Checker Celebrating total global shipments of "eneloop" reaching 100 million cells
- Nov 05
- Toshiba Introduces Industry's Largest-Capacity, 320GB 1.8-inch HDD
- Nov 04
- NEC Electronics Announces Sample Shipment of 4 New Single-Chip IO-Link Solutions
- Nov 04
- Panasonic Announces Commencement of Tender Offer for SANYO Shares
- Nov 04
- SANYO Approves Tender Offer for Shares of SANYO Electric Co., Ltd. by Panasonic Corporation
- Nov 02
- Asahi Kasei: Supplementary Financial Summary, second quarter fiscal 2009
- Nov 02
- Asahi Kasei: Financial Summary, second quarter fiscal 2009
- Nov 02
- Asahi Kasei: Consolidated Results for Fiscal Quarter Ended September 30, 2009
- Nov 02
- Asahi Kasei: Notice of revision of performance forecasts
- Nov 02
- NEC contributes to Danish Television history as it switches from Analogue to Digital
- Nov 02
- NTT Com Expands Global e-VLAN in Malaysia
- Nov 02
- Panasonic: Announcement of a Basic Agreement between Minebea Co., Ltd. and Panasonic Corporation regarding the transfer of Information Equipment Motor Business
- Nov 02
- Panasonic Announces Business Restructuring and Growth Strategy for its Motor Business
- Nov 02
- SANYO: For Reference Only: SANYO to Supply HEV Ni-MH Battery System to PSA Peugeot Citroën
- Nov 02
- Toshiba Starts Operation of State-of-the-Art New Facilities in Nuclear Power Plant Engineering Center
