EmergingTech from Japan

Companies - November 2009

Nov 30
DOCOMO: Notice Concerning Outcome and Conclusion of Share Repurchase (Share Repurchase under the provisions of Articles of Incorporation pursuant to Article 165 (2) of the Corporation Law)
Nov 30
Hamamatsu Photonics: Announces the ORCA-D2 Dual CCD Camera with Interchangeable Optical Blocks for Simultaneous Dual Wavelength Imaging
Nov 30
OKI Networks Launches "Ipstage(R) 1000", a Smart Telephony Box Equipped with Key Telephone System and Broadband Router for the European and Japanese Markets
Nov 30
Renesas Technology: SH-Mobile Application Engine 4 breaks into GHz realm to open up an entirely new user experience and set the pace for true multimedia convergence
Nov 30
SDK to Strengthen Corporate Governance with New Setup
Nov 30
SDK: Changes in Corporate Management
Nov 30
Sony Commercializes World's First TransferJet(TM) Compatible LSIs
Nov 30
Toshiba Awarded Major Order for Mega Solar Power Generation Project By Tokyo Electric Power Company, Inc.
Nov 27
Asahi Glass: Announcement on determination of the total amount of issue, etc., of the Zero Coupon Convertible Bonds due 2012 and 2014
Nov 27
Epson: Transfer of the Epson Imaging Sales Function to the Sony Group
Nov 27
Epson Imaging Announces Executive Personnel Changes
Nov 27
Fujitsu Develops World's First Technology for Low-Temperature Full-Surface Direct Formation of Graphene Transistors on Large-Scale Substrates
Nov 27
Hitachi: Determination of Interest Rate and Conversion Price Formula for Convertible Bond Type Bonds with Stock Acquisition Rights
Nov 27
Honda Sets All-Time October Record for Auto Production in Asia and China
Nov 27
NEC Announces Adjustment of Conversion Prices of 1.0% Unsecured Yen Convertible Bonds due 2011 and Zero Coupon Unsecured Euro Yen Convertible Bonds due 2010
Nov 27
Sony: Transfer of the Epson Imaging Sales Function to the Sony Group
Nov 27
ULVAC Inc. to Launch Luminous NA-8000, New Plasma Ashing System Compatible with Extensive Range of Organic Film Processes for Semiconductor/Electronic Parts
Nov 26
Asahi Glass: Announcement of determination of the terms of issuance, etc., of the Zero Coupon Convertible Bonds due 2012 and 2014
Nov 26
Elpida Ships Samples of x32-bit I/O 2-Gigabit DDR2 SDRAM
Nov 26
Fujitsu Wins Minister of the Environment Award for Energy-saving PRIMERGY BX900 Blade Server
Nov 26
OMRON Announces Spin Off of Switch Business, Merger of Subsidiaries and Changes to Trade Names
Nov 26
SANYO Aims to Win Top Share of Japanese PV System Market in FY2013 (April 1, 2012 to March 31, 2013)
Nov 26
Tokyo Electron and ONYONE Jointly Develop Comfortable Dust-proof Cleanroom Suit
Nov 25
Asahi Glass: Announcement regarding the Issuance of Zero Coupon Convertible Bonds due 2012 and 2014
Nov 25
DOCOMO to Launch Environmental Sensor Network Business
Nov 25
JEITA: Domestic Shipments of Major Consumer Electronic Equipment (October 2009)
Nov 25
KYOCERA Headquarters 2009 Christmas Illumination & Concert Schedule
Nov 25
Mitsubishi Chemical: Verbatim(R), the World's No.1 Recording Media, releases PhotoSave DVD and OfficeSave DVD for simple photo, video, and data file backup!
Nov 25
Nippon Steel: The World' Longest 38m-Straight-web-type Sheet Piles Adopted for A Large-Scale Infrastructure Project Overseas -- The Inchon Bridge of the Republic of Korea --
Nov 25
OKI Unveils "ATM-Recycler G7", a Cash Recycling ATM for the Worldwide Market
Nov 25
OMRON to Launch Mass-production and Supply of MEMS Acoustic Sensor Chip
Nov 25
Panasonic Announces the Extension of the Period of the Tender Offer for SANYO Shares and Other Related Matters
Nov 25
Panasonic and SEAS-NVE start pilots of home energy management combined with Smart Grid
Nov 25
SANYO: Notice of Announcement by Panasonic regarding Extension of Term for Tender Offer by Panasonic for SANYO Shares
Nov 24
Mitsubishi Materials: Results for the Second Quarter Ended September 30, 2009
Nov 24
Mitsubishi Materials: Notice Regarding Discrepancies between Second-Quarter Performance Forecast and Actual Results, Revision of Full-Year Forecast, and Revision of Year-End Dividend Forecast
Nov 24
NEC Announces Determination of Number of New Shares to Be Issued
Nov 24
NEC withdraws its complaint submitted to the European Commission relating to Qualcomm's licensing practice
Nov 24
NEC Electronics Announces Development of Ethernet PHY Family for Industrial Automation Systems
Nov 24
OKI Uses "DressUP CockPit V3" to Reduce Cost of Monitoring its Group's Core System by 80 per cent
Nov 24
SANYO "eneloop bike" and "Solar Parking Lot" Receive Eco-Products Award from the Minister of Economy, Trade, and Industry
Nov 20
Asahi Glass: Myboka(R), A New Non-Wired, Thermal-Resistant Tempered Glass for Fire-resistant to be Released
Nov 20
Fujitsu Opens New Annex of Tatebayashi System Center
Nov 20
KYOCERA Founder Kazuo Inamori Receives "Entrepreneur for the World" Award
Nov 20
Panasonic Begins Delivery of P-01B Handsets to NTT DOCOMO
Nov 20
Panasonic to Deliver Full Lineup of HD Equipment to Vancouver 2010 Olympic Winter Games
Nov 20
Panasonic to Launch Marketing Campaign for Vancouver 2010 Olympic Winter Games
Nov 20
Toshiba Signs Memorandum of Understanding on Joint Venture for System LSI Assembly and Testing Service in China
Nov 19
Elpida Opens High Speed DRAM Test Laboratory at Munich Design Center
Nov 19
Elpida Completes Development of 1-Gigabit GDDR5
Nov 19
Epson Releases NS-8010 Series of Compact IC Test Handlers
Nov 19
Fujitsu Submits Cloud API Specification to DMTF And Joins Leadership Board of Open Cloud Standards Incubator
Nov 19
NTT Com to Enhance OCN Services
Nov 19
SDK to Develop New Liquid Electrolytes for Automotive LIBs
Nov 19
Sony Accelerates Transformation to Drive Innovation and Growth
Nov 19
TDK: Sample kit with varistors for transient voltage suppression up to 385 volts (TDK-EPC Corporation)
Nov 18
Asahi Glass: Notice of Posting of Extraordinary Gains regarding Transfer of Shares of a Subsidiary
Nov 18
DISCO: Introducing the DFL7020, Economical and Small Footprint Fully Automatic Laser Saw to Scribe Sapphire LED
Nov 18
DISCO: Introducing the DFL7161, Fully Automatic Laser Saw for 300 mm Wafers with Enhanced Basic Performance
Nov 18
Epson: Groundbreaking Epson Display Technology Presented at Inter BEE 2009
Nov 18
Fujitsu's Infrastructure-as-a-Service for Server Offers Flexibility in the Cloud
Nov 18
Fujitsu Completes Global ETERNUS DX Disk Storage Lineup with Mid-Range and Enterprise Systems
Nov 18
Fujitsu Introduces New True Zero Client Concept
Nov 18
Mitsubishi Electric 3MW Solar Panels to Power Italy's Coop Logistic Center.
Nov 18
NEC Announces Determination of Offer Price, Selling Price and Other Related Matters
Nov 18
ROHM: Additional products have been added to the OKI SEMICONDUCTOR lineup
Nov 18
ROHM: Completion of Acquisition of Kionix,Inc.
Nov 17
Canon gives Notice to AFM of Acquired Shareholding in Océ
Nov 17
Fujitsu Releases GLOVIA/SCP FA V8 Production Scheduling System
Nov 17
JEITA: Production by the Japanese Electronics Industry(September 2009)
Nov 17
NEC: INTEL, NEC TO DEVELOP SUPERCOMPUTER TECHNOLOGIES OF TOMORROW
Nov 17
NTT Com Collaborates with Conexus Mobile Alliance On Enterprise Smartphone Solutions
Nov 17
Renesas Technology to Release RS44X, RS45X, and RS46X High-Performance 16-Bit Secure MCUs with Dual Interface and MIFARE Plus S Support for Multifunction Smart Cards for Financial and ID Applications
Nov 17
ROHM: Fiscal Year 2010 Interim Financial Report posted.
Nov 17
SANYO Announces its Global Production Strategy for HIT Solar Cell
Nov 17
Sony: DNP, MPI and Sony Develop MasterCard Compatible IC Credit Card Using Plastic Derived from Biobased Polymer (PLA)
Nov 17
Toshiba develops molecular photoresist technology for EUV lithography
Nov 16
CANON AND OCÉ TO CREATE GLOBAL LEADER IN PRINTING INDUSTRY
Nov 16
DISCO: Introducing the Fully Automatic Thinning Process of Sapphire Substrates for LED
Nov 16
DISCO: Improvement in financial management levels in response to the recent business recovery
Nov 16
Elpida Announces New President for Subsidiary Akita Elpida
Nov 16
Fujitsu Microelectronics: Fujitsu Announces Fast-Response DC/DC Converter IC for Consumer Electronics
Nov 16
Hitachi Comments on the Articles of Hitachi's Financial Policy
Nov 16
Hitachi: Issuance and Sale of New Shares and Issuance of Call Option Attached Unsecured Bonds with Stock Acquisition Rights (Convertible Bonds)
Nov 16
Mitsubishi Chemical: World's No. 1 Recording Media Verbatim(R) Implementing a Collaborative Campaign with Idol Group AKB48 "Go ahead, make a record! AKB4800!"
Nov 16
NEC Announces First Integrated Ocean Observation System for Taiwan
Nov 16
Tokyo Ohka Kogyo Co., Ltd. Will Exhibit at SEMICON(R) Japan 2009
Nov 13
Fujitsu Introduces docomo PRIME Series F-01B
Nov 13
Fujitsu Introduces docomo STYLE Series F-02B
Nov 13
Fujitsu Laboratories' Fellow Kenichi Miura Wins Seymour Cray Award
Nov 13
Maxell: "Fact Book 2009" listed
Nov 13
OKI Reaches 20 Million Keyboard Shipments Landmark
Nov 13
Pioneer Takes Action against Garmin to Protect Intellectual Property
Nov 13
SANYO to Mass Produce New Large-capacity High-voltage Lithium-ion Battery Systems
Nov 13
Sony: Initiatives to Strengthen Sony's PC and Digital Imaging Businesses
Nov 13
Sony Chemical & Information Device Corporation to Realign Business Strategy and Reorganize Manufacturing Operations in order to Strengthen Business Structure
Nov 13
Toshiba Publishes Environmental Report in English Available On-line and in Print Edition
Nov 12
Epson Develops 0.52-inch QHD HTPS TFT Color Liquid Crystal Panel for Electronic Viewfinders
Nov 12
Fujitsu to Exhibit at SC09 Supercomputing Conference
Nov 12
Nippon Steel: Investment in, and obtaining control of, Latinusa, an Indonesian tinplate producer --Strengthening the tinplate business in the growing Asian market--
Nov 12
RIKEN: Key mucosal immune response mechanism identified
Nov 12
SANYO Releases New 'Contactless Charger Set for Wii Remote'
Nov 11
ALPS: Official Announcement Regarding Revisions to Financial Results Forecasts
Nov 11
ALPS: Results Briefing FY2009 2Q
Nov 11
Asahi Glass: A change in personnel
Nov 11
CRIEPI: Update Reports on Research Activities Settlement of Accounts (FY2008)
Nov 11
DISCO: Introducing the Z09 Series, Electroformed Blades with Fine Grit Size and High Strength Bond
Nov 11
Elpida: Rexchip earns the "Annual Enterprises Environmental Protection Award"
Nov 11
Elpida and Winbond Form DRAM Manufacturing Partnership
Nov 11
NEC Electronics Introduces 3 New 16-bit All Flash(TM) Microcontrollers with Embedded IEEE 802.15.4 Radio Transceiver for ZigBee(R) RF4CE
Nov 11
NTT: On-Demand Gigabit-class Video Transmission Successfully Proven on Testbed Networ
Nov 11
NTT Science and Core Technology Laboratory Group: On-Demand Gigabit-class Video Transmission Successfully Proven on Testbed Network
Nov 11
Pioneer and Sharp Announce Launch of Optical Disk Joint Venture
Nov 11
SANYO Announces a New Addition to eneloop universe products "eneloop stick booster"
Nov 11
Sharp: Pioneer and Sharp Announce Launch of Optical Disk Joint Venture
Nov 11
Sony: Mori Seiki and Sony Sign Memorandum of Intent Regarding Transfer of SMS Measuring Systems Business
Nov 10
Epson Announces Reference Design Kit for State-of-the-Art Drive Recorder IC
Nov 10
Fujitsu Launches SaaS-based E-Commerce Service
Nov 10
FUNAI: Presentation of Operating Results in 2Q of FY2009
Nov 10
NEC Electronics Expands Lineup of System LSI Devices for Automotive Infotainment
Nov 10
NTT DOCOMO Unveils 20 New Models — 19 handsets and 1 digital photo frame —
Nov 10
SANYO: JAPAN GOOD DESIGN – "eneloop" & "eneloop universe" Exhibit
Nov 10
Sharp Environmental Forum in Hangzhou
Nov 10
Sony Agrees to Further 3-year Support of the South Africa Mobile Library Project
Nov 09
Asahi Kasei: Fiscal 2009 Second Quarter Financial Results
Nov 09
DISCO: Introducing the DFD6341, fully automatic dicing saw for 200 mm diameter wafers with enhanced productivity
Nov 09
DISCO: DISCO resumes construction of the new building at the Chino Plant
Nov 09
Epson Develops World's First 4K Compatible HTPS TFT Liquid Crystal Panel for 3LCD Projectors
Nov 09
Fujitsu Interstage BPM Version 11 Lets Businesses Proactively "Sense and Respond" to Change
Nov 09
Hitachi: Notice Concerning Capital Injection Changes For the NEC Electronics and Renesas Business Integration
Nov 09
Mitsubishi: Notice Concerning Capital Injection Changes For the NEC Electronics and Renesas Business Integration
Nov 09
Mitsui Chemical: Statement on Accident at Production Facilities at Shimonoseki Mitsui Chemicals, Inc.
Nov 09
NEC: Notice Concerning Capital Injection Changes For the NEC Electronics and Renesas Business Integration
Nov 09
NEC Electronics: Notice Concerning Capital Injection Changes For the NEC Electronics and Renesas Business Integration
Nov 09
Nichia Files a Patent Infringement Lawsuit against Companies in China, Hong Kong and Canada
Nov 09
NTT: Financial Results for the Six Months Ended September 30, 2009
Nov 09
NTT Com Announces Financial Results for the Six Months Ended September 30, 2009
Nov 09
NTT DOCOMO: Notice Concerning Decision on Matters Relating to Share Repurchase (Share Repurchase under Article 165 (2) of the Corporation Law)
Nov 09
NTT East: Financial Statements for the Six Months Ended September 30, 2009
Nov 09
NTT West: Financial Statements for the Six Months Ended September 30, 2009
Nov 09
Renesas: Notice Concerning Capital Injection Changes For the NEC Electronics and Renesas Business Integration
Nov 09
RIKEN: Shaping the way we move
Nov 09
ROHM: "Notice Concerning Revisions to Forecast Data" posted.
Nov 09
ROHM: Power supply, logic, and voltage detector ICs added to the general-purpose IC search engine.
Nov 09
SDK to Commercialize Allyl Ester Resin for Spectacle Lenses
Nov 06
Asahi Kasei: Home Order Trends – October 2009
Nov 06
Casio Announces Spin-off to Establish a Small and Medium-Size Display Business Subsidiary and Partial Transfer of its Shares
Nov 06
Casio: Announcement Concerning Cooperative Venture in Small and Medium-Size Display Business (OLED and TFT Liquid Crystals)
Nov 06
Casio: Announcement of consolidated financial results for the second quarter of the fiscal year ending Mar.31 2010
Nov 06
DISCO: The dedicated website regarding SEMICON Japan 2009
Nov 06
Elpida Memory: Elpida and ProMOS Signed Agreement for DRAM Foundry Services
Nov 06
NEC Announces Issuance of New Shares and Secondary Offering of Shares
Nov 06
Panasonic: MT Picture Display files for hearing to overturn JFTC
Nov 06
Toppan: Announcement Concerning Cooperative Venture in Small and Medium-Size Display Business (OLED and TFT Liquid Crystals)
Nov 05
Asahi Glass: Consolidated Financial Results for the Nine Months ended September 30, 2009
Nov 05
AGC Revises the Consolidated Outlook for the Fiscal Year 2009
Nov 05
AGC Announces an Organizational Change
Nov 05
Asahi Glass: Changes in the assignments of Executive Officers
Nov 05
Elpida Memory: 2Q FY2009 financial release
Nov 05
Fujitsu Launches New Line of Transport Support Solutions
Nov 05
Funai: Consolidated Financial Summary in 2Q of FY2009
Nov 05
Honda Releases the Civic Type R Euro in Japan
Nov 05
JEITA: Imports of Electronics into Japan(August 2009)
Nov 05
JEITA: Exports of Electronics from Japan(September 2009)
Nov 05
Second Quarter of the Year ending March 2010 Financial Results/Financial and Business Data
Nov 05
DOCOMO to Add Service Option for Flat-rate Data Service— Maximum charge reduced for use at selected access points —
Nov 05
OKI Announces Consolidated Financial Results for the First Half (Apr.-Sept.) of the Fiscal Year ending March 31, 2010
Nov 05
OKI: Technical Journal -- "OKI Technical Review (Current Issue: Special Issue on Networks)" -- is updated.
Nov 05
Pioneer Announces Business Results for 2Q Fiscal 2010
Nov 05
Pioneer Announces Completion of Assessments on Antitrust Laws Overseas for Optical Disk Joint Venture
Nov 05
Pioneer Moves Its Head Office Location
Nov 05
SANYO Releases 8-Color AA-size "eneloop" Rechargeable Battery Pack and Product Sets that include the Simple "eneloopy" Battery Checker Celebrating total global shipments of "eneloop" reaching 100 million cells
Nov 05
Toshiba Introduces Industry's Largest-Capacity, 320GB 1.8-inch HDD
Nov 04
NEC Electronics Announces Sample Shipment of 4 New Single-Chip IO-Link Solutions
Nov 04
Panasonic Announces Commencement of Tender Offer for SANYO Shares
Nov 04
SANYO Approves Tender Offer for Shares of SANYO Electric Co., Ltd. by Panasonic Corporation
Nov 02
Asahi Kasei: Supplementary Financial Summary, second quarter fiscal 2009
Nov 02
Asahi Kasei: Financial Summary, second quarter fiscal 2009
Nov 02
Asahi Kasei: Consolidated Results for Fiscal Quarter Ended September 30, 2009
Nov 02
Asahi Kasei: Notice of revision of performance forecasts
Nov 02
NEC contributes to Danish Television history as it switches from Analogue to Digital
Nov 02
NTT Com Expands Global e-VLAN in Malaysia
Nov 02
Panasonic: Announcement of a Basic Agreement between Minebea Co., Ltd. and Panasonic Corporation regarding the transfer of Information Equipment Motor Business
Nov 02
Panasonic Announces Business Restructuring and Growth Strategy for its Motor Business
Nov 02
SANYO: For Reference Only: SANYO to Supply HEV Ni-MH Battery System to PSA Peugeot Citroën
Nov 02
Toshiba Starts Operation of State-of-the-Art New Facilities in Nuclear Power Plant Engineering Center

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