EmergingTech from Japan
Username:
Password:
Register Now
|
Forgot your password?
HOME
News Center
News
News Flash
Technology
Business
The Semiconductor Industry News
Government
New Products
Devices
Materials
Equipment
Industry Info
Industry at a Glance
Statistics
Directory
Government
Events
Glossary
Press Releases
Companies
Government
Global Consortia
About Us
About us
Corporate Profile
Member List
Advertisement
Privacy Policy
Sitemap
Japanese
HOME
»
Press Releases
» Government - May 2010
Government - May 2010
May 31
METI
Release of the New Strategies for Innovation of Information and Economy
May 31
METI
Memorandum of understanding (MOU) on the establishment of the E-Commerce Policy Council signed between METI and China's Ministry of Commerce
May 31
METI
Two memoranda of cooperation signed between METI and the NDRC of China
May 27
METI
U.S.-Japan Dialogue to Promote Innovation, Entrepreneurship and Job Creation
May 26
METI
Republic of Costa Rica announces its decision to adopt Japan's digital terrestrial broadcasting format
May 26
METI
Report by the Industrial Science Technology Policy Committee, Industrial Structure Council
May 21
JFTC
Cease and Desist Orders and Surcharge Payment Orders against Manufacturers of Optical Fiber Cable Products
May 20
METI
Enhanced Structure for Research and Development of SiC (Silicon Carbide), New Material for Power Semiconductor Devices - Establishment of Expanded "R&D Partnership for Future Power Electronics Technology" and "SiC Alliance"
May 18
METI
Implementation Status of the Program to Promote the Spread of Green Home Appliances by Utilizing Eco-Points (as of the end of April)
May 17
METI
Establishment of the Study Group on the Scheme for Next-Generation Power Transmission and Distribution Systems and the Study Group on the Smart Meter Scheme
May 14
JFTC
Decision to Commence Hearing Procedures against Samsung SDI Co., Ltd. (Price fixing case by Manufacturers of Cathode Ray Tubes for Televisions )
May 14
METI
Report by the Study Group on the Content Industry's Growth Strategy
May 14
METI
Implementation status of the Program to Promote the Spread of Eco-Friendly Houses by Utilizing Eco-Points (Eco-point system for housing) (as of the end of April 2010)
May 14
METI
Announcement of Projects Selected for Subsidies under the FY 2010 Human Resource Development and Employment Support Program for Next-Generation Advanced Technologies in Small and Medium Enterprises
May 10
MEXT
Guidelines for Building Organized and Continuous Cooperation Including Double and Joint Degree Programs
May 07
METI
Results of the Joint Study for an FTA among China, Japan, and Korea
HOME
|
Archives
Monthly
Archives
Select...
Sep 1, 2010
Aug 1, 2010
Jul 1, 2010
Jun 1, 2010
May 1, 2010
Apr 1, 2010
Mar 1, 2010
Feb 1, 2010
Jan 1, 2010
Dec 1, 2009
Nov 1, 2009
Oct 1, 2009
Sep 1, 2009
Aug 1, 2009
Jul 1, 2009
Jun 1, 2009
May 1, 2009
Apr 1, 2009
Mar 1, 2009
Feb 1, 2009
Jan 1, 2009
Dec 1, 2008
Nov 1, 2008
Oct 1, 2008
Sep 1, 2008
Aug 1, 2008
Feed(RSS 1.0)
-
About Feed
powered by Google
News Flash
JSR, TEL, Ibiden launch lithium-ion capacitor R&D project
Sony to boost CMOS image sensor production by 40%
23 companies form harvesting device consortium
Panasonic to complete absorption of IPS Alpha by renaming it
Toshiba starts 24nm NAND chip fabrication
Business
JSR, TEL, Ibiden launch lithium-ion capacitor R&D project
Sony to boost CMOS image sensor production by 40%
23 companies form harvesting device consortium
Japan's first commercial mega solar plant starts operation
Panasonic to complete absorption of IPS Alpha by renaming it
Technology
Toshiba starts 24nm NAND chip fabrication
Canon develops over-11-inch, 120-megapixel, CMOS sensors
Hayabusa 2 will leave Earth in 2014 seeking the origin of life
Samsung, Toshiba intending to standardize high-speed SSD interface
Sony, Tohoku University develops 100W output blue-violet laser
New Products
SD card achieves 95MB/sec read speed
Sharp to introduce LED ceiling lights attuned to demand in Japan
Nichia starts sampling 510nm green laser
Ushio offering 6-inch wafer one-shot exposure system for LED chips
MHI bonds SiC and GaN with silicon wafer at room temperature
Press Releases
Companies
Government
Global Consortia