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Press Releases
» Global Consortia - June 2010
Global Consortia - June 2010
Jun 28
ISMI
ISMI Environment, Safety and Health Experts Present Industry Data on Energy and Resource Conservation for Sustainable Manufacturing
Jun 25
UAlbany
CG and CNSE Launch Global Partnership to Establish $20M Center for Intelligent Power at UAlbany NanoCollege
Jun 24
SEMATECH
SEMATECH Makes Important Advances in Power and Performance Features for Next-Generation IC Devices
Jun 21
SEMATECH
SEMATECH to Highlight Leading-Edge Research in Technology and Manufacturing at SEMICON West 2010
Jun 17
ISMI
Edwards Vacuum Joins ISMI's ESH Technology Center
Jun 17
Leti
CEA-Leti and Docea Power to Combine Expertise on 3D Integration
Jun 15
SEMATECH
Qualcomm and SEMATECH Sign Collaborative Agreement
Jun 14
SEMATECH
SEMATECH to Present at Design Automation Conference
Jun 10
SEMATECH
SEMATECH Achieves Submicron 3D IC Bond Alignment Results in Integrated Bonding Tool Platform at UAlbany NanoCollege
Jun 10
UAlbany
SEMATECH Achieves Submicron 3D IC Bond Alignment Results in Integrated Bonding Tool Platform at UAlbany NanoCollege
Jun 9
Holst Centre
World's first application of flexible OLED lighting on foil
Jun 8
IMEC
Imec's cognitive baseband radio to support 4G and broadband access to multiple services
Jun 8
IMEC
Imec significantly reduces cost of germanium-based thermophotovoltaic cells
Jun 8
IMEC
Intel, imec and Five Flemish Universities Open Flanders ExaScience Lab
Jun 8
IMEC
Imec inaugurates first phase in its high-tech pole expansion
Jun 8
SEMATECH
ISMI Announces Keynote Speakers for 2010 Manufacturing Week
Jun 8
SRC
Semiconductor Research Corporation and Cornell University Capture First-Ever Images of Sub-Nanometer Pore Structures in Low-K Materials
Jun 4
IMEC
Imec's Europractice IC service provides TSMC 40nm technologies to European companies and academia
Jun 3
Leti
CEA-Leti and Nokia Research Center develop ultra-wide band radio front-end circuit for remotely powered memory tag
Jun 2
SEMATECH
SEMATECH and AZ Electronic Materials to Partner on Critical Issues in EUV Lithography at UAlbany NanoCollege
Jun 2
UAlbany
SEMATECH and AZ Electronic Materials to Partner on Critical Issues in EUV Lithography at UAlbany NanoCollege
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JSR, TEL, Ibiden launch lithium-ion capacitor R&D project
Sony to boost CMOS image sensor production by 40%
23 companies form harvesting device consortium
Panasonic to complete absorption of IPS Alpha by renaming it
Toshiba starts 24nm NAND chip fabrication
Business
JSR, TEL, Ibiden launch lithium-ion capacitor R&D project
Sony to boost CMOS image sensor production by 40%
23 companies form harvesting device consortium
Japan's first commercial mega solar plant starts operation
Panasonic to complete absorption of IPS Alpha by renaming it
Technology
Toshiba starts 24nm NAND chip fabrication
Canon develops over-11-inch, 120-megapixel, CMOS sensors
Hayabusa 2 will leave Earth in 2014 seeking the origin of life
Samsung, Toshiba intending to standardize high-speed SSD interface
Sony, Tohoku University develops 100W output blue-violet laser
New Products
SD card achieves 95MB/sec read speed
Sharp to introduce LED ceiling lights attuned to demand in Japan
Nichia starts sampling 510nm green laser
Ushio offering 6-inch wafer one-shot exposure system for LED chips
MHI bonds SiC and GaN with silicon wafer at room temperature
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