Companies - June 2010
- Jun 30
- Hitachi: Transfer of Management Rights Relating to IPS Alpha Technology
- Jun 30
- Hitachi Files Form 20-F for Fiscal 2009
- Jun 30
- KYOCERA Supplies Solar Modules for Toyota Marine Recreational Boats
- Jun 30
- Mitsubishi Electric Introduces "Eco Changes" Statement Outside Japan.
- Jun 30
- Mitsubishi Electric to Issue Environmental Report on Website.
- Jun 30
- NEC Begins Shipment of LRE for NTT DOCOMO
- Jun 30
- Nikon: Entries for the Nikon Photo Contest International 2010-2011 to Be Accepted
- Jun 30
- NTT Com to Make Green Donations for Searches on OCN Portal
- Jun 30
- NTT East Submits Profit and Loss Statements for Designated Telecommunications Services and Basic Telecommunications Services
- Jun 30
- NTT West Submits Profit and Loss Statements for Designated Telecommunications Services and Basic Telecommunications Services
- Jun 30
- Panasonic: Transfer of Management Rights Relating to IPS Alpha Technology
- Jun 30
- TDK: Announcement of personnel changes in TDK Corporation
- Jun 30
- Toshiba LEDs to light up the Louvre Museum
- Jun 29
- Asahi Kasei: Microza hollow-fiber membrane systems selected for large-scale water clarification plants in Asia
- Jun 29
- Nikon: Announcement of Allotment of Offered Stock Acquisition Rights (Stock Compensation-type Stock Options)
- Jun 29
- Nikon: On the conclusion of the 146th Annual General Shareholders' Meeting
- Jun 29
- Nikon: Notice of the division of work among directors and officers
- Jun 29
- Renesas: Development of Close Proximity Wireless Technology with Integrated On-Chip Antenna
- Jun 29
- SANYO: EV Racing Car Powered by SANYO Li-ion Batteries Achieves the Best Record for EV in a hill climbing race
- Jun 29
- Shin-Etsu Chemical: Notification Concerning Continuation of the Handling Policy (Anti-takeover Defensive Plan) toward Large-scale Purchase of Our Company's Shares and Other Securities at the Annual Meeting of Stockholders of Our Company
- Jun 28
- Canon: Announcement of Execution of Share Exchange Agreement under which Canon Inc. Will Make Canon Machinery Inc. Its Wholly Owned Subsidiary
- Jun 28
- Canon: Announcement of Execution of Share Exchange Agreement under which Canon Inc. Will Make Tokki Corporation Its Wholly Owned Subsidiary
- Jun 28
- Funai Reports Matters Concerning Controlling Shareholder
- Jun 28
- Honda: Production, Sales and Export Results in May, 2010
- Jun 28
- Mitsubishi Electric Strengthens Railcar Equipment Business in Europe with IRIS Certification.
- Jun 28
- Murata: Announcing the Development of the Field-Coupled Wireless Power Transmission System
- Jun 28
- NEC launches ePASOLINK the ultra-high capacity backhaul solution for HSPA+ and LTE
- Jun 28
- NEC Technology Simulates LSI Package Warping and Soldering
- Jun 28
- NEC Brasil implements asset tracking system in the Hospital Israelita Albert Einstein
- Jun 28
- ROHM Microstep Motor Drivers Deliver High Performance and Reliability
- Jun 28
- SDK to Raise Chloroprene Rubber Price in Overseas Markets
- Jun 28
- Sharp Develops and Will Introduce New Tuner Unit for Terrestrial Digital and Analog Broadcasting
- Jun 28
- Shin-Etsu Chemical to expand sales of silicone products in China
- Jun 28
- Sony: Annual Report 2010 (Year Ended March 31, 2010)
- Jun 28
- SUMCO: Annual Report 2010
- Jun 28
- ULVAC, Inc. Launches the "MPEC-opt1300," a Local Efficiency/Haze Measurement System for Tandem Type Thin-Film Solar Cells
- Jun 25
- Murata Manufacturing: Chip Common Mode Choke Coils Supporting USB3.0 SuperSpeed Signals Now Commercialized
- Jun 25
- NEC Corporation of Japan to reduce the cost of international operations by 20% through business process excellence
- Jun 24
- Elpida Completes Development of 2-Gigabit GDDR5
- Jun 24
- Mitsubishi Electic Launches NEXIEZ Elevator Series for Global Market.
- Jun 24
- Mitsubishi Materials: Anticipated Resumption of Operations at Yokkaichi Plant
- Jun 24
- NEC Wins Femto Forum Award for Femtocell Network Element Design and Technology Innovation
- Jun 24
- OKI Provides Source Code for SSF, an SIP Applications Development Framework, as Open Source Software for the JBoss Community
- Jun 24
- Panasonic's EVERLEDS LED Light Bulbs Win Gold at the IDEA 2010 Awards
- Jun 24
- ULVAC: Micro Powder Dry system for powder process: ULVAC has launched a fully packaged process line, integrated from dosing to powder filling, for pharmaceutical freeze drying processes.
- Jun 23
- Disco: The process of ring removal for TAIKO wafer by circle cutting
- Jun 23
- JEITA: Domestic Shipments of Major Consumer Electronic Equipment (May 2010)
- Jun 23
- Renesas Electronics Announces Development of On-Chip Inductor Technology with a Wide Inductance Variability
- Jun 23
- Sharp: Approval of Continuation of Plan Regarding Large-Scale Purchases of Sharp Corporation Shares (Takeover Defense Plan)
- Jun 23
- Sharp: Executive Appointment (effective June 23, 2010)
- Jun 23
- Toshiba to Build Drive Motors for Electrified Vehicles in the U.S.
- Jun 22
- Fujitsu Semiconductor: Warning against Counterfeit Products
- Jun 22
- Hitachi and Mitsubishi Heavy Industries Agree in Principle to Cooperate in Railway Systems for Overseas Markets
- Jun 22
- KYOCERA Provides "Eco-Lessons" to Over 23,000 Primary School Children
- Jun 22
- NEC's New I/O Virtualization Technology Enables Simultaneous Sharing of I/O Devices among Multiple Computers
- Jun 22
- Nintendo: 2010 E3 Expo Analyst Q&A Session
- Jun 22
- OMRON: List of directors, corporate auditors and executive officers updated
- Jun 22
- Panasonic Develops A Gallium Nitride (GaN) Terahertz Detector with High Sensitivity
- Jun 22
- Panasonic Begins Shipping Samples of New Catalyst for Diesel Exhaust Gas Purification
- Jun 22
- Sony develops 1.2kWh-class energy storage module using lithium-ion rechargeable batteries made from olivine-type lithium iron phosphate
- Jun 22
- Toshiba and Trek Establish Forum to Promote SD Cards Embedding Wireless Communication Functions
- Jun 21
- Elpida, PTI, and UMC Partner on 3D IC Integration Development For Advanced Technologies Including 28nm
- Jun 21
- Fujitsu Semiconductor to Rename Nine of Its Group Companies
- Jun 21
- Mitsubishi Electric Announces Launch of 12.1-inch Color TFT-LCD Module for Industrial Use.
- Jun 21
- Mitsubishi Electric to Supply 127 Elevators and Escalators for Shanghai JingAn Kerry Centre.
- Jun 21
- Renesas Electronics Announces Executive Personnel Changes of a Manufacturing Subsidiary
- Jun 21
- ROHM: High voltage resistance ensures high reliability audio playback operation in a variety of sets
- Jun 21
- Toshiba introduces the world's first dual-touch-screen Windows mini-notebook PC "libretto W100" and other products in Japanese market
- Jun 18
- Asahi Glass: A change in the assignment of Executive Officer
- Jun 18
- Fujitsu Introduces New Visual Identity to Express "shaping tomorrow with you"
- Jun 18
- KYOCERA to Participate in "CO2 Reduction / Light-Down Campaign" for 3rd Consecutive Year
- Jun 18
- NEC Installs Retail Solutions at the Guangzhou Baiyun International Airport
- Jun 18
- Nikon Formulates Medium Term Management Plan for Fiscal 2011/3-2013/3
- Jun 18
- NTT DOCOMO Announces New Executives
- Jun 18
- Sony: Executive Appointments
- Jun 18
- TEL Announces Personnel Changes
- Jun 17
- Fujitsu and Toshiba Sign MOU to Merge Mobile Phone Businesses
- Jun 17
- Fujitsu Develops Technology Enabling Higher-Density Spin-Torque-Transfer MRAM
- Jun 17
- Funai: Notice of the 58th Ordinary General Meeting of Shareholders
- Jun 17
- Hitachi: Strengthening the Battery Business with a Focus on Lithium-ion Batteries
- Jun 17
- Itochu: Eco Action Points Introduced to the MOTTAINAI Campaign
- Jun 17
- JEITA: Production by the Japanese Electronics Industry (April 2010)
- Jun 17
- Mitsubishi Electric Surpasses 10 Million Unit Sales Milestone for MELSEC-F Series Micro PLC.
- Jun 17
- Mitsubishi Electric Announces Sale of 12.5 V High Power MOSFET for Commercial 2-way Radios.
- Jun 17
- NEC Attends the Femtocells World Summit 2010
- Jun 17
- NEC and CA Technologies Strengthen Cooperation in the Application Performance Management Software Field
- Jun 17
- Toshiba: Fujitsu and Toshiba Sign MOU to Merge Mobile Phone Businesses
- Jun 17
- Toshiba Launches Industry's Largest Embedded NAND Flash Memory Modules
- Jun 16
- AGC launches sale of a glass-ceramics substrate for high-power LED lighting - More luminous, more durable with Glass -
- Jun 16
- Fujitsu's Eco-Friendly Servers Reduce Cleanup Corp's Carbon Footprint
- Jun 16
- Fujitsu Expands Line of 8-bit Microcontrollers for Motor Control
- Jun 16
- Fujitsu Semiconductor: Fujitsu Expands Line of 8-bit Microcontrollers for Motor Control
- Jun 16
- NEC Enhances its Business Structure for Middle East and African Regions
- Jun 16
- Sharp Develops and Will Introduce New Coil-Integrated DC-DC Converter Module
- Jun 16
- Sony: PLAYSTATION MOVE MOTION CONTROLLER TO HIT WORLDWIDE MARKET STARTING THIS SEPTEMBER (for Japan)
- Jun 16
- Sony: PLAYSTATION PLUS, THE NEW SUBSCRIPTION SERVICE PACKAGE ON PLAYSTATION NETWORK. DELIVERS A WHOLE NEW EXPERIENCE TO USERS
- Jun 16
- Sony: REGISTERED ACCOUNTS ON PLAYSTATION NETWORK EXCEED 50 MILLION WORLDWIDE
- Jun 16
- SONY COMPUTER ENTERTAINMENT ANNOUNCES SURROUND SOUND SYSTEM FOR THE PLAYSTATION 3 SYSTEM HITTING WORLDWIDE MARKET IN FALL 2010
- Jun 15
- Disco: Completion of a New Building at the Chino Plant
- Jun 15
- Fujitsu Introduces docomo STYLE series F-08B
- Jun 15
- Fujitsu Releases New Virtual Product Simulator
- Jun 15
- SANYO to Expand Production Capacity at its HIT Solar Cell Module Factories in Nishikinohama and Shiga
- Jun 15
- Sony: Executive Appointments
- Jun 15
- Sumitomo: J:COM's VOD service first to deliver movies before their theatrical release
- Jun 15
- Tokyo Electron Introduces Probus-SiC, a CVD Tool used in Epitaxial Film Growth on Silicon Carbide Substrates
- Jun 15
- Toshiba develops leading-edge silicon nanowire transistor for 16nm generation and beyond
- Jun 14
- Fujitsu: Regarding the Court's Rejection of the Petition by Mr. Nozoe, Former President
- Jun 14
- Mitsubishi: Mitsubishi UFJ Trust and Banking Corporation and Mitsubishi Corporation to jointly launch Japan's first Precious Metals Exchange Traded Funds (ETFs) backed by physical metal stored domestically (Product Name: "Japan Physical Precious Metals ETF")
- Jun 14
- NEC: Capsule from Asteroid Explorer "HAYABUSA" Successfully Returns to Earth
- Jun 14
- Nikon: The latest Nikon equipment to be used in the Russian segment of the International Space Station
- Jun 14
- NTT DATA AND INTELLIGROUP ENTER INTO DEFINITIVE MERGER AGREEMENT
- Jun 11
- Fujitsu: Regarding media reports on mobile phone business
- Jun 11
- NTT DATA: Investment in Singapore-Based Apex Systems Pte Ltd.
- Jun 11
- Shin-Etsu Chemical: Agreement under Mutual Agreement Procedure between Japan and the United States relating to Transfer Pricing Taxation
- Jun 10
- Fujitsu Develops World's First Technology Employing 10 Gbps Virtual Switch to Substitute for On-Server Virtual Switch Functions
- Jun 10
- Fujitsu: Gartner Ranks Fujitsu Third-Largest Worldwide IT Services Provider
- Jun 10
- KDDI: Conclusion of Memorandum of Understanding on Consideration of Alliance
- Jun 10
- NTT Com Launches Low-cost Global Phone Service
- Jun 10
- SANYO to Expand Solar and Energy Solutions Business in Europe
- Jun 09
- Asahi Glass: Notice on the Allotment of Stock Compensation-Type Stock Options (Stock Acquisition Rights)
- Jun 09
- Asahi Glass: Notice on the Allotment of Ordinary-Type Stock Options (Stock Acquisition Rights)
- Jun 09
- Fujitsu Named Top US Patent Recipient in Optical Communications for Fifth Consecutive Year
- Jun 09
- Fujitsu Launches World's First PC with Full 3D Experience
- Jun 09
- Hitachi: Strategies for Seven Businesses Toward Achieving New Management Plan Goals
- Jun 09
- Honda Affiliate to Open New Safety Driving Center in Singapore
- Jun 09
- NEC Announces Group Environmental Management Action Plan 2017/2030
- Jun 09
- NTT Com: Biz Hosting Global to Launch in Singapore, Offer One-stop Management with Biz Hosting Enterprise
- Jun 09
- NTT DATA and MicroStrategy Japan Agree to Expand Promotion of DWH/BI Solutions
- Jun 09
- OMRON Precision Technology to Establish a New LCD Backlight Production Base in China, Increasing Production Capacity
- Jun 09
- Panasonic to Launch the World's First Ultra-Large Full HD 3D Professional Plasma Displays
- Jun 09
- Renesas Electronics Announces Development of Package Design Technology for Implementation of High-Speed Interfaces at Low-Cost
- Jun 08
- Credit Saison Deploys Fujitsu's Automated Teller Machines
- Jun 08
- Mitsubishi Electric Completes Installation of Main Diamond Vision Screen at Hakodate Racecourse.
- Jun 08
- Murata Introduces World's First Ultra-Thin Waterproof Piezoelectric Speaker
- Jun 08
- NEC Introduces New License Scheme Ideal for Virtual Environments with its High-Availability "EXPRESSCLUSTER" Software
- Jun 08
- NTT Com, Infinera and Ixia to Provide World's First Practical 100 Gbps Ethernet Interconnection at Interop Tokyo 2010
- Jun 08
- DOCOMO to Begin Pre-launch Operation of LTE Network
- Jun 08
- Shin-Etsu Chemical: Notice of Convocation of the 133rd Ordinary General Meeting of Shareholders
- Jun 08
- Sony: TOM COSGROVE TO LEAD SONY, DISCOVERY COMMUNICATIONS AND IMAX JOINT VENTURE 3D TELEVISION NETWORK
- Jun 08
- Sony: "3D world Created by Sony" 3D Experience Pavilion Opens in South Africa
- Jun 07
- Alps Receives ASI Award from Quality Engineering Society
- Jun 07
- Asahi Kasei: Home Order Trends – May 2010
- Jun 07
- Fujifilm Reinforces Organization for Digital Camera Business
- Jun 07
- Fujitsu Develops World's First Ultrafast 3D CAD Engine
- Jun 07
- Funai: 2010 FACT BOOK
- Jun 07
- JSR included in Socially Responsible Investment benchmark index: FTSE4Good Index Series for 7 years running
- Jun 07
- NEC Member Recognized with the MSF "Circle of Excellence Award"
- Jun 07
- Nichia: Patents regarding phosphors that emit a light of red color for LEDs (CASN and S-CASN)
- Jun 07
- NTT Com to Launch "Kazaspot" Mobile Marketing Solution
- Jun 07
- Panasonic Begins Licensing 'HD-PLC' Patents and Technologies
- Jun 07
- SANYO: New Air Purification Systems for Duct-type Air Conditioners Used in Large Spaces
- Jun 07
- Sharp: World Topics "Sharp to Introduce New Multi-Screen Display System"
- Jun 07
- Sharp to Introduce New Multi-Screen Display System
- Jun 07
- Tokyo Electron Limited (TEL) and Ebara Corporation (Ebara) Mutually Agree on Joint Evaluation about Ruthenium Based Technology for Advanced Copper Interconnect
- Jun 07
- Toshiba "dynabook TX/98MBL" is the Industry's First PC Supporting the Blu-ray 3D Format
- Jun 04
- Asahi Kasei: Final Phase of Growth Action – 2010 & Concept for the Next Initiative
- Jun 04
- Asahi Kasei: Notice of the 119th Ordinary Convocation of Shareholders
- Jun 04
- Elpida Memory: Notice of Partial Revision to Reference Documents for the General Meeting of Shareholders
- Jun 04
- Murata Manufacturing: Arithmetic Processing IP Core for MP3 DecodersFeature Smallest Circuit Size and Lowest Power Consumption!,
- Jun 04
- SUMCO: Q1 FY2010 Supplementary Explanation Materials
- Jun 04
- SUMCO: Financial Summary for Q1 FY2010
- Jun 03
- Disco: "Will be displayed at SEMICON West 2010" has been added.
- Jun 03
- Fujitsu Develops World's Highest-Performance Ultra-Low-Noise Transistor for Millimeter-Band Receivers
- Jun 03
- Honda Releases the All-new BF115 4-stroke Outboard Engine Featuring Best-in-Class Acceleration and Fuel Economy
- Jun 03
- Honda Announces Improvements to Its BF150/135 4-stroke Outboard Engine Series Featuring Outstanding Acceleration and Fuel Economy
- Jun 03
- ITOCHU Corporation and General Electric Company entered into Renewable Energy Investment Collaboration Agreement
- Jun 03
- JEITA: Imports of Electronics into Japan (March 2010)
- Jun 03
- JEITA: Exports of Electronics from Japan (April 2010)
- Jun 03
- KYOCERA Commences U.S. Manufacturing of Solar Modules
- Jun 03
- Mitsubishi Electric to Supply 65 Elevators and Escalators for Mexico City Metro Line 12.
- Jun 03
- OKI's New Color LED Digital Printer Series' Receives "5-Star, Exceptional Status" From BERTL
- Jun 03
- Renesas Electronics: CORRECTION: Renesas Electronics Reports Financial Results for the Year Ended March 31, 2010
- Jun 03
- Toshiba and Kazatomprom Sign Definitive Agreement on JV for Rare Metals
- Jun 02
- Fujitsu Releases RF Transceiver LSI for Multimode, Multiband Communication with SAW Filter-less
- Jun 02
- Fujitsu Semiconductor: Fujitsu Releases RF Transceiver LSI for Multimode, Multiband Communication with SAW Filter-less
- Jun 02
- NEC Provides Cloud Computing Based Education System for Argentina's San Juan Province Ministry of Education
- Jun 02
- NTT Com: Biz Desktop Service Enables Virtual Desktop via Cloud
- Jun 02
- Sony Realigns its Blu-ray Disc (TM) and DVD products businesses to strengthen competitiveness
- Jun 01
- Fujitsu Begins Operations of SaaS Online Delivery Site for Small- and Medium-Sized Businesses
- Jun 01
- Fujitsu Introduces docomo PRIME series F-06B
- Jun 01
- Maxell Ships DAT 320, Seventh Generation DDS Technology Maxell DAT 320 Data Cartridge Extends Capacity to 320GB
- Jun 01
- NEC Provides Support for Communities Impacted by the Recent Outbreak of Foot-and-mouth Disease
- Jun 01
- NTT Com Expands ISO/IEC 20000-1:2005 to Cloud Hosting
- Jun 01
- OKI Upgrades "COINServ-COSMOS-R/R", Information System for Chemical Substances in Products, to Comply with JGPSSI's Latest Survey Format (Ver. 4)
- Jun 01
- Olympus Announces the Global Launch of a Nondestructive Testing Instrument-the 38DL PLUS Advanced Ultrasonic Thickness Gage
- Jun 01
- Renesas Joins Symbian Foundation to Further Innovate Mobile Chipsets for Symbian Platform
- Jun 01
- TDK: Newly Completed Anechoic Chamber Building Ready for Operation
- Jun 01
- Tokyo Ohka: Development of High Temperature Tolerant Temporary Adhesive for Use in the TSV Process for 3D LSIs
