EmergingTech from Japan

Companies - February 2010

Feb 26
Casio: Regarding the Postponement of the Launch of the New Joint Venture between Casio Hitachi Mobile Communications and NEC's Mobile Terminal Unit
Feb 26
Fuji Electric Group Joins the United Nations Global Compact
Feb 26
Hitachi: Regarding the Postponement of the Launch of the New Joint Venture between Casio Hitachi Mobile Communications and NEC's Mobile Terminal Unit
Feb 26
Mitsubishi Electric Completes Installation of Diamond Vision Screen in Paddock Area of Hakodate Racecourse.
Feb 26
Murata Manufacturing: Smallest and Thinnest in the World! Developing Surface Mount Pyroelectric Infrared Sensor
Feb 26
NEC: Regarding the Postponement of the Launch of the New Joint Venture between Casio Hitachi Mobile Communications and NEC's Mobile Terminal Unit
Feb 26
OMRON enhances PLC performance and flexibility with CJ2M series
Feb 25
Alps Achieves Industry's Longest Detection Distance Magnetic Sensor
Feb 25
Epson Ships 60 Millionth HTPS-TFT Panel for 3LCD Projection Systems
Feb 25
Fuji Electric Group Formulates New Medium-term Management Plan (FY2009 to FY2011)
Feb 25
Fuji Electric Holdings and GE signed MOU to form a JV for Japan's meter business
Feb 25
Honda: All-New CR-Z Hybrid Vehicle Introduced in Japan
Feb 25
JSR introduces non-topcoat self-freezing ArF Photoresist for double patterning process
Feb 25
Mitsubishi Electric Develops World's First GaN HEMT Amplifier Exclusive to Satellite Applications.
Feb 25
NEC Announces its Mid-Term Growth Plan "V2012"
Feb 25
NEC: Reorganization for Achieving Mid-Term Management Plan
Feb 25
NEC Announces Executive Personnel Changes
Feb 25
NTT DOCOMO to Reduce Interconnection Fees
Feb 25
Renesas Technology to Release Eight 800V TRIAC Products, Including BCR16CM-16LH, with High Commutation Characteristics Among the Best in the Industry, and Junction Temperature of 150 deg C
Feb 25
TDK: Multilayer ceramic capacitors: Further miniaturized series of C0G MLCCs (TDK-EPC Corporation)
Feb 24
Epson: Notification of Corporate Split Concerning Epson and Consolidated Subsidiary Company
Feb 24
Fujitsu: Notice Regarding Acquisition of Company's Own Stock
Feb 24
Hitachi and Hitachi Plant Technologies Announce Making Hitachi Plant Technologies a Wholly Owned Subsidiary of Hitachi via a Share Exchange
Feb 24
Hitachi and Hitachi Maxell Announce Making Hitachi Maxell a Wholly Owned Subsidiary of Hitachi via a Share Exchange
Feb 24
Hitachi Software Engineering and Hitachi Systems & Services to Merge
Feb 24
JEITA: Domestic Shipments of Major Consumer Electronic Equipment (January 2010)
Feb 24
Hitachi and Hitachi Maxell Announce Making Hitachi Maxell a Wholly Owned Subsidiary of Hitachi via a Share Exchange
Feb 24
Hitachi Maxell Announces New Executive Officers
Feb 24
Pioneer Announces Determination of Number of New Shares to Be Issued
Feb 24
TEL Joins SEMATECH's Lithography Program at UAlbany NanoCollege
Feb 23
Epson to Launch Production of Ultra-Low Power 4-Bit Microcontrollers
Feb 23
Epson Toyocom Develops the World's Smallest Single Package 6-Axis Sensor
Feb 23
Fujitsu Develops Industry's First System-Failure Management Technology for Cloud Computing Era
Feb 23
Honda Sets All-Time Monthly Record for Production in Asia
Feb 23
Pioneer Announces Determination of Offer Price Relating to Issuance of New Shares
Feb 23
Pioneer Announces Determination of Amount to Be Paid Relating to Issuance of New Shares Through Third-party Allotment to Mitsubishi Electric Corporation
Feb 23
Pioneer Announces Determination of Amount to Be Paid Relating to Issuance of New Shares Through Third-party Allotment to Mitsubishi Chemical Corporation
Feb 23
Renesas Technology to Release the Industry's First "Herstellerinitiative Software Recommended Optimization AUTOSAR" Specification-compliant Software Supporting Release 3.1 for R32C/100 Series
Feb 23
RIKEN: International Aphid Genomics Consortium publishes genome sequence of the pea aphid
Feb 23
ROHM: High Fidelity Multifunctional Sound Processors for Car Audio Systems
Feb 23
Sumitomo Chemical Unveils New Corporate Business Plan (FY 2010-2012)
Feb 22
Canon to exhibit at Milano Salone design festival
Feb 22
DISCO Laser Saws Sales Exceed 200
Feb 22
Fujitsu's Updated IFRS Accounting Solution Deployed by NDK
Feb 22
Fujitsu Delivers Cloud Services Enhancing Business ICT Operations
Feb 22
Honda Announces Management Changes
Feb 22
JSR participates in TABLE FOR TWO (TFT) ~ Implementing social contribution activities at the JSR Group ~
Feb 22
Mitsubishi Electric to Sell 19.2-inch TFT-LCD Module Internationally.
Feb 22
NEC's Video Quality Assessment Technologies Adopted as an International Standard
Feb 22
NEC Distributes System Performance Analysis Software for Global Markets
Feb 22
OKI Networks and Kyushu University Successfully Stream Live High-Definition Video of Surgical Procedures to Overseas Recipients
Feb 22
Panasonic Announces Proposed Senior Management Changes
Feb 20
Hitachi to Implement Educational Seminar "Japan's Experience as a Benchmark" at Riyadh, Saudi Arabia
Feb 19
Honda 2010 Motorsports Overview
Feb 19
NEC Electronics Expands Lineup with 78 new 32-bit Microcontrollers with Industry-Leading Low Power Consumption and Dramatically Reduced Package Size
Feb 18
Alps Unveils New Slide Switch for Mobile Devices
Feb 18
KYOCERA: Possible Inability to Collect or Delay in Collection of Accounts Receivable from WILLCOM, Inc
Feb 18
Hitachi Maxell Announces Development of Coin type Lithium Rechargeable Battery (CLB)
Feb 18
Mitsubishi Electric Names New President & CEO, Chairman.
Feb 18
Murata has developed the world's Smallest 1.6X0.8mm Size 10µF Monolithic Ceramic Capacitor Rated at 25V
Feb 18
NEC Selected by Telefonica as a Strategic Partner to Promote Cloud Computing
Feb 18
NEC's Mobile Backhaul Supports O2's First 4G Mobile Network LTE Trial in the UK
Feb 18
NEC Electronics Introduces 14 New 8-bit MCUs for Automotive Dashboard Applications
Feb 18
NTT Com to Launch Biz Security PC Management
Feb 18
Tokyo Electron Limited (TEL) Announces Joint Collaboration for Advanced Double-Patterning Technology
Feb 18
Toshiba Corporation Signs MOU with Bharat Heavy Electricals Limited on Collaboration in the T&D business
Feb 17
Fujitsu Microelectronics: Additional Page for Flash USB Programmer
Feb 17
JEITA: Production by the Japanese Electronics Industry(December 2009)
Feb 17
KYOCERA Develops World's Fastest Thermal Printhead for Card Printers
Feb 17
NEC: Developing LSI for High Speed Next Generation Communication Interfaces
Feb 17
ROHM: Fiscal Year 2010 Third Quarter Financial Report posted.
Feb 17
ROHM: "Notice Concerning Revisions to Forecast Data" posted.
Feb 17
Toshiba introduces small form factor enterprise HDD achieving the industry's highest capacity
Feb 16
Canon and Fujitsu Join Forces on Managed Services
Feb 16
NTT DOCOMO: Leading Operators Unite to Unleash Global Apps Potential
Feb 16
Fujitsu: Canon and Fujitsu Join Forces on Managed Services
Feb 16
Hitachi: SaskPower and Hitachi Announce to Collaborate on Low-Carbon Energy Technologies Provider including Steam Turbine for Carbon Capture and Sequestration Demonstration Project
Feb 16
Mitsubishi Electric Develops New Photovoltaic Inverter Technology to Maximize Solar Power Output.
Feb 16
Mitsubishi Electric Achieves 14.8% Conversion Efficiency in Thin-film Silicon Solar Cell.
Feb 16
Mitsubishi Electric Sets Two World Records in Solar Cell Conversion Efficiency.
Feb 16
NEC builds first Norwegian femtocell network for Network Norway
Feb 16
NEC Develops World's First 3D Simulator for LTE SON
Feb 16
NTT Com to Expand Global e-VLAN Service to Australia
Feb 16
OKI Announces Mid-term Business Plan
Feb 16
Tokyo Electron (TEL) and imec expand collaboration on EUVL
Feb 15
Canon: Notice regarding results of tender offer by Canon Inc. for shares of OPTOPOL Technology S.A.
Feb 15
Central Glass: Construction of New Electrolyte Facility for Lithium-ion Batteries
Feb 15
DISCO: Construction of a New Building at the Kure Plant
Feb 15
DISCO: Completion of a New Building at the Kuwabata Plant for Manufacturing Precision Processing Equipment and Tools
Feb 15
Fuji Electric: Establishment of Hanoi Representative Office in Vietnam
Feb 15
Mitsubishi Materials: Results for the Third Quarter Ended December 31, 2009
Feb 15
Toshiba and AIST Jointly Develop Mask Pattern Optimizing Technology That Extends Life of Optical Lithography
Feb 15
ULVAC-RIKO announces Resonance Shear Measurement System (RSM-1), the world's first ever commercially available solution for the evaluation of viscosity, friction, and lubrication properties for confined liquids at nano-scale thickness.
Feb 12
Fujitsu Develops A/D Converter with World's Highest Power Efficiency in Its Class
Feb 12
KYOCERA Achieves World Record Conversion Efficiency for Multicrystalline Solar Modules
Feb 12
NEC Electronics Introduces Two New Embedded DRAM Intelligent Buffer ICs for High-Resolution Mobile Graphics Applications
Feb 12
Panasonic: Sarah Brightman helps launch Panasonic song at the Vancouver 2010 Olympic Winter Games
Feb 12
Panasonic opens Full HD 3D Theatre at the Vancouver 2010 Olympic Winter Games Live Site
Feb 12
SANYO: For Reference Only: About Certain Reports in the Media
Feb 12
SDK: 2009 Financial Results: Presentation Material
Feb 10
Asahi Glass: The New Medium-Term Management Plan, "Grow Beyond-2012"
Feb 10
Asahi Glass: AGC Establishes "AGC Group Social Contribution Basic Policy"
Feb 10
Asahi Glass: Consolidated Financial Results for the Fiscal Year ended December 31st, 2009
Feb 10
Asahi Glass: Notice regarding Ordinary-Type Stock Options (Stock Acquisition Rights)
Feb 10
Asahi Glass: Concept and Policy on Reduction of Minimum Stock Trading Unit
Feb 10
DNP: Announcement of Commencement of Tender Offer for Shares of Intelligent Wave Inc.
Feb 10
Fujitsu and University of Toronto Develop High-Reliability Read-Method for Spin-Torque-Transfer MRAM, Next-Generation Non-Volatile Memory
Feb 10
Fujitsu and University of Toronto Develop World's First Digitally-Processed Gigabit-Class High-Speed Transceiver Chip
Feb 10
Fujitsu Develops Compact Frequency-Synthesizer for Terrestrial Digital TV Broadcast Tuners
Feb 10
Honda: Recall of Driver's SRS Airbag
Feb 10
Konica Minolta: Termination of the Strategic Business Alliance Agreement with Oce
Feb 10
NEC Establishes a Battery Business Subsidiary Supporting the Expansion of Environmentally Friendly Energy
Feb 10
NEC to Show Smallest All-in-One Compact LTE Base Station at MWC 2010
Feb 10
NEC to Launch New Femtocell Access Point from Ubiquisys
Feb 10
Nippon Steel: A Strategic Alliance between Nippon Steel Corporation and Nippon Denko Co., Ltd.
Feb 10
Pioneer Announces Issuance of New Shares (Supplemental Information)
Feb 10
Renesas Technology: Imec, Renesas and M4S report a single-chip reconfigurable multi-standard wireless transceiver in 40nm CMOS
Feb 10
SDK to Reduce Amount of Capital Reserve
Feb 10
SDK: 2009 Financial Results (Summary)
Feb 10
SDK: 2009 Consolidated Financial Statemants
Feb 10
Sony Enters the Flow Cytometry Business in Life Science Field by Acquiring iCyt
Feb 10
Sony: Executive Appointment
Feb 10
Toshiba Signs Definitive Agreement on Joint Venture for System LSI Assembly and Testing Service in China
Feb 09
ALPS ELECTRIC: Official Announcement Regarding Revisions to Financial Results Forecasts
Feb 09
ALPS ELECTRIC: Results Briefing FY2009 3Q
Feb 09
Epson Awarded Silver Class in 'Sustainability Yearbook 2010'
Feb 09
Mitsubishi Chemical and Pioneer Concluded Business and Capital Alliance Agreement on Organic Light Emitting Diode (OLED) Lighting
Feb 09
Mitsui High-tec: ISO14001 Environmental Policy Updating
Feb 09
NEC and PacketVideo to demonstrate new mobile media apps for NEC Femtocell at Mobile World Congress 2010
Feb 09
Nikon: AF-S NIKKOR 16-35mm f/4G ED VR
Feb 09
Nikon: AF-S NIKKOR 24mm f/1.4G ED
Feb 09
NTT Com Increases Japan-U.S. Backbone Speed to 300 Gbps
Feb 09
Pioneer Announces Business Results for 3Q Fiscal 2010
Feb 09
Pioneer Announces Issuance of New Shares
Feb 09
Pioneer Announces Strengthening of Business Alliance with Mitsubishi Electric Corporation and Issuance of New Shares Through Third-Party Allotment
Feb 09
Pioneer Announces Business Alliance with Mitsubishi Chemical Corporation and Issuance of New Shares Through Third-Party Allotment
Feb 09
Pioneer Announces Progress of Issuance of New Shares Through Third-Party Allotment to Honda Motor Co., Ltd.
Feb 09
Pioneer: Mitsubishi Chemical and Pioneer Concluded Business and Capital Alliance Agreement on Organic Light Emitting Diode (OLED) Lighting
Feb 09
Renesas Technology: Heterogeneous Multicore IC for the Next Generation of Information Appliances Developed
Feb 09
TEL Announces Organizational and Personnel Changes
Feb 09
Tokyo Electron: 3Q FY2010 Financial Announcement
Feb 08
Asahi Kasei: Fiscal 2009 Third Quarter Financial Results
Feb 08
Canon: Announcement of Share Exchange Agreement under which Canon Inc. Will Make Canon Finetech Inc. Its Wholly Owned Subsidiary
Feb 08
Fujitsu Releases Solutions for Data Warehousing on Microsoft(R) SQL Server(R)
Feb 08
Hamamatsu Photonics: Financial Results for the First Quarter of Fiscal Year ending September 30, 2010
Feb 08
KYOCERA to Unveil World's Lightest, Smallest and Most Efficient LTE Base Station at Mobile World Congress 2010
Feb 08
NEC Electronics Introduces EMMA Mobile(TM) EV SoCs for Full HD Portable Audio-Visual Devices
Feb 08
SDK Announces Revised Performance Forecast for 2009
Feb 08
Sharp and Samsung Reach Settlement in LCD Patent Infringement Disputes
Feb 08
Sony Develops World's First Millimeter-wave Wireless Intra-Connection Technology for Internal High Speed Data Transfer within Electronics Products
Feb 08
Toshiba Develops SRAM Circuit Technique that Secures Low Voltage Operation of System LSI
Feb 06
Pioneer: Statement on Media Reports on Capital
Feb 05
Asahi Kasei: Home Order Trends – January 2010
Feb 05
Casio Revises Consolidated Financial Results Forecast
Feb 05
Casio: Announcement of consolidated financial results for the third quarter of the fiscal year ending Mar.31.2010.
Feb 05
CRIEPI: Annual Research Report 2009
Feb 05
Fuji Electric: Merger of Fuji Electric Group Power Semiconductor Manufacturing Subsidiaries
Feb 05
Nintendo: Third Quarter Financial Results Briefing for the 70th Fiscal Term Ending March 2010 (held on January 29, 2010) - Q & A
Feb 05
NTT: Financial Results for the Nine Months Ended December 31, 2009
Feb 05
NTT Com Announces Financial Results for the Nine Months Ended December 31, 2009
Feb 05
NTT EAST: Financial Statements for the Nine Months Ended December 31, 2009
Feb 05
NTT WEST: Financial Statements for the Nine Months Ended December 31, 2009
Feb 05
Panasonic Signed an Agreement to Absorb Wholly-Owned Subsidiary (Panasonic Battery Electrode Co., Ltd.)
Feb 05
Panasonic: Consolidated Financial Results for Third Quarter and Nine Months ended December 31, 2009
Feb 05
Sharp Wins BLI's 2009 "Line of the Year" and BERTL(SM)'s Best 2009 Awards
Feb 04
AGC Revises the Consolidated Outlook for the Fiscal Year 2009
Feb 04
AGC Posts Valuation Losses on Shares of Affiliates (Non-consolidated)
Feb 04
Funai: Presentation of Operating Results in 3Q of FY2009
Feb 04
Hitachi Announces Changes to Top Managements
Feb 04
Hitachi Announces Executive Changes
Feb 04
Hitachi: Consolidated Financial Results for the Third Quarter ended December 31, 2009
Feb 04
Hitachi Announces Revisions of Consolidated Business Forecasts for Fiscal 2009
Feb 04
NEC, Airvana to Bring a Standards-Compliant Femtocell Solution to Market
Feb 04
NEC Extends OpenFlow Technologies to Mobile Network
Feb 04
NEC and Netezza to Jointly Deverop Data Warehouse Appliance
Feb 04
NEC Electronics Introduces New SoC that Enables High-End Camera Functionality and Improved Functionalities for Camera Phones
Feb 04
Nikon: Third Quarter of the Year ending March 2010 Financial Results/Financial and Business Data
Feb 04
NTT DATA: PARTIAL CORRECTION TO THE "NOTICE REGARDING COMMENCEMENT OF TENDER OFFER FOR SHARES OF NJK CORPORATION" AND CORRECTIONS TO THE "PUBLIC NOTICE OF THE COMMENCEMENT OF THE TENDER OFFER"
Feb 04
SANYO: For Reference Only:SANYO Reports its FY2010 Third Quarter Results
Feb 04
SANYO: For Reference Only:SANYO Revises Forecast for Fiscal Year Ending March 2010
Feb 04
Sony: Consolidated Financial Results for the Third Quarter Ended December 31, 2009
Feb 04
Toshiba Group 19th Environmental Exhibition
Feb 03
Asahi Kasei: Supplementary Financial Summary, third quarter fiscal 2009
Feb 03
Asahi Kasei: Financial Summary, third quarter fiscal 2009
Feb 03
Asahi Kasei: Consolidated Results for Fiscal Quarter Ended December 31, 2009
Feb 03
Asahi Kasei: Notice of revision of consolidated performance forecast
Feb 03
Fuji Electric: Establishment of the Zhejiang University - Fuji Electric Innovation Center
Feb 03
Funai: Consolidated Financial Summary in 3Q of FY2009
Feb 03
Honda: Consolidated Financial Summary for the Fiscal 3rd Quarter ended December 31, 2009
Feb 03
JEITA: Imports of Electronics into Japan(November 2009)
Feb 03
JEITA: Exports of Electronics from Japan(December 2009)
Feb 03
Konica Minolta Establishes a New Company in China
Feb 03
Nikon: Digital Compact Camera Nikon COOLPIX S8000/S6000
Feb 03
Nikon: Digital Compact Camera Nikon COOLPIX S4000/S3000
Feb 03
Nikon: Digital Compact Camera Nikon COOLPIX P100, L110
Feb 03
Nikon: Digital Compact Camera Nikon COOLPIX L22/L21
Feb 03
OKI Announces Consolidated Financial Results for the First Nine Months of the Fiscal Year ending March 31, 2010
Feb 03
Pioneer: Statement on Media Reports on Capital Alliance
Feb 03
Renesas Expands Back-End Process Plant in Beijing by Adding New Building on Site
Feb 03
RIKEN to host a booth at AAAS 2010 annual meeting
Feb 03
SDK and PLANTEC Test Thermoelectric Power Generation Modules
Feb 03
Sharp: Press Conference (Consolidated Financial Results for the Third Quarter Ended December 31, 2009)
Feb 03
Sharp: Consolidated Financial Results for the Third Quarter Ended December 31, 2009
Feb 03
TEL Donates to Haiti Earthquake Relief and Recovery Efforts
Feb 03
Toshiba to strengthen memory back-end process development capabilities
Feb 02
Canon adopts MPEG-2 Full HD (4:2:2) file-based recording codec for upcoming professional video camcorder
Feb 02
DISCO: Introducing the Ultrasonic Dicing Technology, Effective for the Processing of SiC for Power Semiconductors
Feb 02
Epson Provides Support for Haiti Earthquake Relief Efforts
Feb 02
Fuji Electric Holdings Awarded Disclosure Award from the TSE
Feb 02
Fujitsu and Symantec to Expand Global Strategic Partnership
Feb 02
Fujitsu Launches Support Services for International Financial Reporting Standards
Feb 02
Mitsubishi Electric Announces Consolidated Financial Results for the First 9 Months and Third Quarter of Fiscal 2010.
Feb 02
NEC Electronics and KWest Introduce EMMA Mobile(TM) 1 Turnkey Design for Multimedia Web Tablets and Advanced Remote Control Functionality
Feb 02
NTT Com: Financial Results for the Third Quarter of the fiscal year ending March 31, 2010(From April 1, 2009 to December 31, 2009)
Feb 02
OKI Delivers "Next Generation Automated Gate System" to Immigration Bureau, the Ministry of Justice
Feb 02
Panasonic: WWF and Panasonic Start Yalu River Coastal Area Ecosystem Based Management Demonstration Project
Feb 02
Panasonic First out of the Gate with Blu-ray 3D(TM) Authoring Facility
Feb 01
Fujitsu and Cisco Create Unified Communications Environment for JGC
Feb 01
Fujitsu Releases Enhanced Product-Data Management System Solution
Feb 01
NEC supplies Greek Digital Network Operator Digea with DVB-T Transmitters
Feb 01
NEC to Exhibit LTE Concept Terminal at Mobile World Congress 2010
Feb 01
NEC Electronics and Renesas Announce the New Executive Team Following Merger
Feb 01
Renesas Technology: NEC Electronics and Renesas Announce the New Executive Team Following Merger
Feb 01
TDK Receives the Decision by the National Tax Tribunal on the Request for Reconsideration of Transfer Pricing Taxation
Feb 01
Tokyo Electron (TEL) Introduces "Trias e+" a New Cluster-Tool Platform for Single Wafer CVD Processes
Feb 01
Toshiba, JSW and Toshiba JSW Celebrate Cornerstone Laying Ceremony

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