Companies - February 2010
- Feb 26
- Casio: Regarding the Postponement of the Launch of the New Joint Venture between Casio Hitachi Mobile Communications and NEC's Mobile Terminal Unit
- Feb 26
- Fuji Electric Group Joins the United Nations Global Compact
- Feb 26
- Hitachi: Regarding the Postponement of the Launch of the New Joint Venture between Casio Hitachi Mobile Communications and NEC's Mobile Terminal Unit
- Feb 26
- Mitsubishi Electric Completes Installation of Diamond Vision Screen in Paddock Area of Hakodate Racecourse.
- Feb 26
- Murata Manufacturing: Smallest and Thinnest in the World! Developing Surface Mount Pyroelectric Infrared Sensor
- Feb 26
- NEC: Regarding the Postponement of the Launch of the New Joint Venture between Casio Hitachi Mobile Communications and NEC's Mobile Terminal Unit
- Feb 26
- OMRON enhances PLC performance and flexibility with CJ2M series
- Feb 25
- Alps Achieves Industry's Longest Detection Distance Magnetic Sensor
- Feb 25
- Epson Ships 60 Millionth HTPS-TFT Panel for 3LCD Projection Systems
- Feb 25
- Fuji Electric Group Formulates New Medium-term Management Plan (FY2009 to FY2011)
- Feb 25
- Fuji Electric Holdings and GE signed MOU to form a JV for Japan's meter business
- Feb 25
- Honda: All-New CR-Z Hybrid Vehicle Introduced in Japan
- Feb 25
- JSR introduces non-topcoat self-freezing ArF Photoresist for double patterning process
- Feb 25
- Mitsubishi Electric Develops World's First GaN HEMT Amplifier Exclusive to Satellite Applications.
- Feb 25
- NEC Announces its Mid-Term Growth Plan "V2012"
- Feb 25
- NEC: Reorganization for Achieving Mid-Term Management Plan
- Feb 25
- NEC Announces Executive Personnel Changes
- Feb 25
- NTT DOCOMO to Reduce Interconnection Fees
- Feb 25
- Renesas Technology to Release Eight 800V TRIAC Products, Including BCR16CM-16LH, with High Commutation Characteristics Among the Best in the Industry, and Junction Temperature of 150 deg C
- Feb 25
- TDK: Multilayer ceramic capacitors: Further miniaturized series of C0G MLCCs (TDK-EPC Corporation)
- Feb 24
- Epson: Notification of Corporate Split Concerning Epson and Consolidated Subsidiary Company
- Feb 24
- Fujitsu: Notice Regarding Acquisition of Company's Own Stock
- Feb 24
- Hitachi and Hitachi Plant Technologies Announce Making Hitachi Plant Technologies a Wholly Owned Subsidiary of Hitachi via a Share Exchange
- Feb 24
- Hitachi and Hitachi Maxell Announce Making Hitachi Maxell a Wholly Owned Subsidiary of Hitachi via a Share Exchange
- Feb 24
- Hitachi Software Engineering and Hitachi Systems & Services to Merge
- Feb 24
- JEITA: Domestic Shipments of Major Consumer Electronic Equipment (January 2010)
- Feb 24
- Hitachi and Hitachi Maxell Announce Making Hitachi Maxell a Wholly Owned Subsidiary of Hitachi via a Share Exchange
- Feb 24
- Hitachi Maxell Announces New Executive Officers
- Feb 24
- Pioneer Announces Determination of Number of New Shares to Be Issued
- Feb 24
- TEL Joins SEMATECH's Lithography Program at UAlbany NanoCollege
- Feb 23
- Epson to Launch Production of Ultra-Low Power 4-Bit Microcontrollers
- Feb 23
- Epson Toyocom Develops the World's Smallest Single Package 6-Axis Sensor
- Feb 23
- Fujitsu Develops Industry's First System-Failure Management Technology for Cloud Computing Era
- Feb 23
- Honda Sets All-Time Monthly Record for Production in Asia
- Feb 23
- Pioneer Announces Determination of Offer Price Relating to Issuance of New Shares
- Feb 23
- Pioneer Announces Determination of Amount to Be Paid Relating to Issuance of New Shares Through Third-party Allotment to Mitsubishi Electric Corporation
- Feb 23
- Pioneer Announces Determination of Amount to Be Paid Relating to Issuance of New Shares Through Third-party Allotment to Mitsubishi Chemical Corporation
- Feb 23
- Renesas Technology to Release the Industry's First "Herstellerinitiative Software Recommended Optimization AUTOSAR" Specification-compliant Software Supporting Release 3.1 for R32C/100 Series
- Feb 23
- RIKEN: International Aphid Genomics Consortium publishes genome sequence of the pea aphid
- Feb 23
- ROHM: High Fidelity Multifunctional Sound Processors for Car Audio Systems
- Feb 23
- Sumitomo Chemical Unveils New Corporate Business Plan (FY 2010-2012)
- Feb 22
- Canon to exhibit at Milano Salone design festival
- Feb 22
- DISCO Laser Saws Sales Exceed 200
- Feb 22
- Fujitsu's Updated IFRS Accounting Solution Deployed by NDK
- Feb 22
- Fujitsu Delivers Cloud Services Enhancing Business ICT Operations
- Feb 22
- Honda Announces Management Changes
- Feb 22
- JSR participates in TABLE FOR TWO (TFT) ~ Implementing social contribution activities at the JSR Group ~
- Feb 22
- Mitsubishi Electric to Sell 19.2-inch TFT-LCD Module Internationally.
- Feb 22
- NEC's Video Quality Assessment Technologies Adopted as an International Standard
- Feb 22
- NEC Distributes System Performance Analysis Software for Global Markets
- Feb 22
- OKI Networks and Kyushu University Successfully Stream Live High-Definition Video of Surgical Procedures to Overseas Recipients
- Feb 22
- Panasonic Announces Proposed Senior Management Changes
- Feb 20
- Hitachi to Implement Educational Seminar "Japan's Experience as a Benchmark" at Riyadh, Saudi Arabia
- Feb 19
- Honda 2010 Motorsports Overview
- Feb 19
- NEC Electronics Expands Lineup with 78 new 32-bit Microcontrollers with Industry-Leading Low Power Consumption and Dramatically Reduced Package Size
- Feb 18
- Alps Unveils New Slide Switch for Mobile Devices
- Feb 18
- KYOCERA: Possible Inability to Collect or Delay in Collection of Accounts Receivable from WILLCOM, Inc
- Feb 18
- Hitachi Maxell Announces Development of Coin type Lithium Rechargeable Battery (CLB)
- Feb 18
- Mitsubishi Electric Names New President & CEO, Chairman.
- Feb 18
- Murata has developed the world's Smallest 1.6X0.8mm Size 10µF Monolithic Ceramic Capacitor Rated at 25V
- Feb 18
- NEC Selected by Telefonica as a Strategic Partner to Promote Cloud Computing
- Feb 18
- NEC's Mobile Backhaul Supports O2's First 4G Mobile Network LTE Trial in the UK
- Feb 18
- NEC Electronics Introduces 14 New 8-bit MCUs for Automotive Dashboard Applications
- Feb 18
- NTT Com to Launch Biz Security PC Management
- Feb 18
- Tokyo Electron Limited (TEL) Announces Joint Collaboration for Advanced Double-Patterning Technology
- Feb 18
- Toshiba Corporation Signs MOU with Bharat Heavy Electricals Limited on Collaboration in the T&D business
- Feb 17
- Fujitsu Microelectronics: Additional Page for Flash USB Programmer
- Feb 17
- JEITA: Production by the Japanese Electronics Industry(December 2009)
- Feb 17
- KYOCERA Develops World's Fastest Thermal Printhead for Card Printers
- Feb 17
- NEC: Developing LSI for High Speed Next Generation Communication Interfaces
- Feb 17
- ROHM: Fiscal Year 2010 Third Quarter Financial Report posted.
- Feb 17
- ROHM: "Notice Concerning Revisions to Forecast Data" posted.
- Feb 17
- Toshiba introduces small form factor enterprise HDD achieving the industry's highest capacity
- Feb 16
- Canon and Fujitsu Join Forces on Managed Services
- Feb 16
- NTT DOCOMO: Leading Operators Unite to Unleash Global Apps Potential
- Feb 16
- Fujitsu: Canon and Fujitsu Join Forces on Managed Services
- Feb 16
- Hitachi: SaskPower and Hitachi Announce to Collaborate on Low-Carbon Energy Technologies Provider including Steam Turbine for Carbon Capture and Sequestration Demonstration Project
- Feb 16
- Mitsubishi Electric Develops New Photovoltaic Inverter Technology to Maximize Solar Power Output.
- Feb 16
- Mitsubishi Electric Achieves 14.8% Conversion Efficiency in Thin-film Silicon Solar Cell.
- Feb 16
- Mitsubishi Electric Sets Two World Records in Solar Cell Conversion Efficiency.
- Feb 16
- NEC builds first Norwegian femtocell network for Network Norway
- Feb 16
- NEC Develops World's First 3D Simulator for LTE SON
- Feb 16
- NTT Com to Expand Global e-VLAN Service to Australia
- Feb 16
- OKI Announces Mid-term Business Plan
- Feb 16
- Tokyo Electron (TEL) and imec expand collaboration on EUVL
- Feb 15
- Canon: Notice regarding results of tender offer by Canon Inc. for shares of OPTOPOL Technology S.A.
- Feb 15
- Central Glass: Construction of New Electrolyte Facility for Lithium-ion Batteries
- Feb 15
- DISCO: Construction of a New Building at the Kure Plant
- Feb 15
- DISCO: Completion of a New Building at the Kuwabata Plant for Manufacturing Precision Processing Equipment and Tools
- Feb 15
- Fuji Electric: Establishment of Hanoi Representative Office in Vietnam
- Feb 15
- Mitsubishi Materials: Results for the Third Quarter Ended December 31, 2009
- Feb 15
- Toshiba and AIST Jointly Develop Mask Pattern Optimizing Technology That Extends Life of Optical Lithography
- Feb 15
- ULVAC-RIKO announces Resonance Shear Measurement System (RSM-1), the world's first ever commercially available solution for the evaluation of viscosity, friction, and lubrication properties for confined liquids at nano-scale thickness.
- Feb 12
- Fujitsu Develops A/D Converter with World's Highest Power Efficiency in Its Class
- Feb 12
- KYOCERA Achieves World Record Conversion Efficiency for Multicrystalline Solar Modules
- Feb 12
- NEC Electronics Introduces Two New Embedded DRAM Intelligent Buffer ICs for High-Resolution Mobile Graphics Applications
- Feb 12
- Panasonic: Sarah Brightman helps launch Panasonic song at the Vancouver 2010 Olympic Winter Games
- Feb 12
- Panasonic opens Full HD 3D Theatre at the Vancouver 2010 Olympic Winter Games Live Site
- Feb 12
- SANYO: For Reference Only: About Certain Reports in the Media
- Feb 12
- SDK: 2009 Financial Results: Presentation Material
- Feb 10
- Asahi Glass: The New Medium-Term Management Plan, "Grow Beyond-2012"
- Feb 10
- Asahi Glass: AGC Establishes "AGC Group Social Contribution Basic Policy"
- Feb 10
- Asahi Glass: Consolidated Financial Results for the Fiscal Year ended December 31st, 2009
- Feb 10
- Asahi Glass: Notice regarding Ordinary-Type Stock Options (Stock Acquisition Rights)
- Feb 10
- Asahi Glass: Concept and Policy on Reduction of Minimum Stock Trading Unit
- Feb 10
- DNP: Announcement of Commencement of Tender Offer for Shares of Intelligent Wave Inc.
- Feb 10
- Fujitsu and University of Toronto Develop High-Reliability Read-Method for Spin-Torque-Transfer MRAM, Next-Generation Non-Volatile Memory
- Feb 10
- Fujitsu and University of Toronto Develop World's First Digitally-Processed Gigabit-Class High-Speed Transceiver Chip
- Feb 10
- Fujitsu Develops Compact Frequency-Synthesizer for Terrestrial Digital TV Broadcast Tuners
- Feb 10
- Honda: Recall of Driver's SRS Airbag
- Feb 10
- Konica Minolta: Termination of the Strategic Business Alliance Agreement with Oce
- Feb 10
- NEC Establishes a Battery Business Subsidiary Supporting the Expansion of Environmentally Friendly Energy
- Feb 10
- NEC to Show Smallest All-in-One Compact LTE Base Station at MWC 2010
- Feb 10
- NEC to Launch New Femtocell Access Point from Ubiquisys
- Feb 10
- Nippon Steel: A Strategic Alliance between Nippon Steel Corporation and Nippon Denko Co., Ltd.
- Feb 10
- Pioneer Announces Issuance of New Shares (Supplemental Information)
- Feb 10
- Renesas Technology: Imec, Renesas and M4S report a single-chip reconfigurable multi-standard wireless transceiver in 40nm CMOS
- Feb 10
- SDK to Reduce Amount of Capital Reserve
- Feb 10
- SDK: 2009 Financial Results (Summary)
- Feb 10
- SDK: 2009 Consolidated Financial Statemants
- Feb 10
- Sony Enters the Flow Cytometry Business in Life Science Field by Acquiring iCyt
- Feb 10
- Sony: Executive Appointment
- Feb 10
- Toshiba Signs Definitive Agreement on Joint Venture for System LSI Assembly and Testing Service in China
- Feb 09
- ALPS ELECTRIC: Official Announcement Regarding Revisions to Financial Results Forecasts
- Feb 09
- ALPS ELECTRIC: Results Briefing FY2009 3Q
- Feb 09
- Epson Awarded Silver Class in 'Sustainability Yearbook 2010'
- Feb 09
- Mitsubishi Chemical and Pioneer Concluded Business and Capital Alliance Agreement on Organic Light Emitting Diode (OLED) Lighting
- Feb 09
- Mitsui High-tec: ISO14001 Environmental Policy Updating
- Feb 09
- NEC and PacketVideo to demonstrate new mobile media apps for NEC Femtocell at Mobile World Congress 2010
- Feb 09
- Nikon: AF-S NIKKOR 16-35mm f/4G ED VR
- Feb 09
- Nikon: AF-S NIKKOR 24mm f/1.4G ED
- Feb 09
- NTT Com Increases Japan-U.S. Backbone Speed to 300 Gbps
- Feb 09
- Pioneer Announces Business Results for 3Q Fiscal 2010
- Feb 09
- Pioneer Announces Issuance of New Shares
- Feb 09
- Pioneer Announces Strengthening of Business Alliance with Mitsubishi Electric Corporation and Issuance of New Shares Through Third-Party Allotment
- Feb 09
- Pioneer Announces Business Alliance with Mitsubishi Chemical Corporation and Issuance of New Shares Through Third-Party Allotment
- Feb 09
- Pioneer Announces Progress of Issuance of New Shares Through Third-Party Allotment to Honda Motor Co., Ltd.
- Feb 09
- Pioneer: Mitsubishi Chemical and Pioneer Concluded Business and Capital Alliance Agreement on Organic Light Emitting Diode (OLED) Lighting
- Feb 09
- Renesas Technology: Heterogeneous Multicore IC for the Next Generation of Information Appliances Developed
- Feb 09
- TEL Announces Organizational and Personnel Changes
- Feb 09
- Tokyo Electron: 3Q FY2010 Financial Announcement
- Feb 08
- Asahi Kasei: Fiscal 2009 Third Quarter Financial Results
- Feb 08
- Canon: Announcement of Share Exchange Agreement under which Canon Inc. Will Make Canon Finetech Inc. Its Wholly Owned Subsidiary
- Feb 08
- Fujitsu Releases Solutions for Data Warehousing on Microsoft(R) SQL Server(R)
- Feb 08
- Hamamatsu Photonics: Financial Results for the First Quarter of Fiscal Year ending September 30, 2010
- Feb 08
- KYOCERA to Unveil World's Lightest, Smallest and Most Efficient LTE Base Station at Mobile World Congress 2010
- Feb 08
- NEC Electronics Introduces EMMA Mobile(TM) EV SoCs for Full HD Portable Audio-Visual Devices
- Feb 08
- SDK Announces Revised Performance Forecast for 2009
- Feb 08
- Sharp and Samsung Reach Settlement in LCD Patent Infringement Disputes
- Feb 08
- Sony Develops World's First Millimeter-wave Wireless Intra-Connection Technology for Internal High Speed Data Transfer within Electronics Products
- Feb 08
- Toshiba Develops SRAM Circuit Technique that Secures Low Voltage Operation of System LSI
- Feb 06
- Pioneer: Statement on Media Reports on Capital
- Feb 05
- Asahi Kasei: Home Order Trends – January 2010
- Feb 05
- Casio Revises Consolidated Financial Results Forecast
- Feb 05
- Casio: Announcement of consolidated financial results for the third quarter of the fiscal year ending Mar.31.2010.
- Feb 05
- CRIEPI: Annual Research Report 2009
- Feb 05
- Fuji Electric: Merger of Fuji Electric Group Power Semiconductor Manufacturing Subsidiaries
- Feb 05
- Nintendo: Third Quarter Financial Results Briefing for the 70th Fiscal Term Ending March 2010 (held on January 29, 2010) - Q & A
- Feb 05
- NTT: Financial Results for the Nine Months Ended December 31, 2009
- Feb 05
- NTT Com Announces Financial Results for the Nine Months Ended December 31, 2009
- Feb 05
- NTT EAST: Financial Statements for the Nine Months Ended December 31, 2009
- Feb 05
- NTT WEST: Financial Statements for the Nine Months Ended December 31, 2009
- Feb 05
- Panasonic Signed an Agreement to Absorb Wholly-Owned Subsidiary (Panasonic Battery Electrode Co., Ltd.)
- Feb 05
- Panasonic: Consolidated Financial Results for Third Quarter and Nine Months ended December 31, 2009
- Feb 05
- Sharp Wins BLI's 2009 "Line of the Year" and BERTL(SM)'s Best 2009 Awards
- Feb 04
- AGC Revises the Consolidated Outlook for the Fiscal Year 2009
- Feb 04
- AGC Posts Valuation Losses on Shares of Affiliates (Non-consolidated)
- Feb 04
- Funai: Presentation of Operating Results in 3Q of FY2009
- Feb 04
- Hitachi Announces Changes to Top Managements
- Feb 04
- Hitachi Announces Executive Changes
- Feb 04
- Hitachi: Consolidated Financial Results for the Third Quarter ended December 31, 2009
- Feb 04
- Hitachi Announces Revisions of Consolidated Business Forecasts for Fiscal 2009
- Feb 04
- NEC, Airvana to Bring a Standards-Compliant Femtocell Solution to Market
- Feb 04
- NEC Extends OpenFlow Technologies to Mobile Network
- Feb 04
- NEC and Netezza to Jointly Deverop Data Warehouse Appliance
- Feb 04
- NEC Electronics Introduces New SoC that Enables High-End Camera Functionality and Improved Functionalities for Camera Phones
- Feb 04
- Nikon: Third Quarter of the Year ending March 2010 Financial Results/Financial and Business Data
- Feb 04
- NTT DATA: PARTIAL CORRECTION TO THE "NOTICE REGARDING COMMENCEMENT OF TENDER OFFER FOR SHARES OF NJK CORPORATION" AND CORRECTIONS TO THE "PUBLIC NOTICE OF THE COMMENCEMENT OF THE TENDER OFFER"
- Feb 04
- SANYO: For Reference Only:SANYO Reports its FY2010 Third Quarter Results
- Feb 04
- SANYO: For Reference Only:SANYO Revises Forecast for Fiscal Year Ending March 2010
- Feb 04
- Sony: Consolidated Financial Results for the Third Quarter Ended December 31, 2009
- Feb 04
- Toshiba Group 19th Environmental Exhibition
- Feb 03
- Asahi Kasei: Supplementary Financial Summary, third quarter fiscal 2009
- Feb 03
- Asahi Kasei: Financial Summary, third quarter fiscal 2009
- Feb 03
- Asahi Kasei: Consolidated Results for Fiscal Quarter Ended December 31, 2009
- Feb 03
- Asahi Kasei: Notice of revision of consolidated performance forecast
- Feb 03
- Fuji Electric: Establishment of the Zhejiang University - Fuji Electric Innovation Center
- Feb 03
- Funai: Consolidated Financial Summary in 3Q of FY2009
- Feb 03
- Honda: Consolidated Financial Summary for the Fiscal 3rd Quarter ended December 31, 2009
- Feb 03
- JEITA: Imports of Electronics into Japan(November 2009)
- Feb 03
- JEITA: Exports of Electronics from Japan(December 2009)
- Feb 03
- Konica Minolta Establishes a New Company in China
- Feb 03
- Nikon: Digital Compact Camera Nikon COOLPIX S8000/S6000
- Feb 03
- Nikon: Digital Compact Camera Nikon COOLPIX S4000/S3000
- Feb 03
- Nikon: Digital Compact Camera Nikon COOLPIX P100, L110
- Feb 03
- Nikon: Digital Compact Camera Nikon COOLPIX L22/L21
- Feb 03
- OKI Announces Consolidated Financial Results for the First Nine Months of the Fiscal Year ending March 31, 2010
- Feb 03
- Pioneer: Statement on Media Reports on Capital Alliance
- Feb 03
- Renesas Expands Back-End Process Plant in Beijing by Adding New Building on Site
- Feb 03
- RIKEN to host a booth at AAAS 2010 annual meeting
- Feb 03
- SDK and PLANTEC Test Thermoelectric Power Generation Modules
- Feb 03
- Sharp: Press Conference (Consolidated Financial Results for the Third Quarter Ended December 31, 2009)
- Feb 03
- Sharp: Consolidated Financial Results for the Third Quarter Ended December 31, 2009
- Feb 03
- TEL Donates to Haiti Earthquake Relief and Recovery Efforts
- Feb 03
- Toshiba to strengthen memory back-end process development capabilities
- Feb 02
- Canon adopts MPEG-2 Full HD (4:2:2) file-based recording codec for upcoming professional video camcorder
- Feb 02
- DISCO: Introducing the Ultrasonic Dicing Technology, Effective for the Processing of SiC for Power Semiconductors
- Feb 02
- Epson Provides Support for Haiti Earthquake Relief Efforts
- Feb 02
- Fuji Electric Holdings Awarded Disclosure Award from the TSE
- Feb 02
- Fujitsu and Symantec to Expand Global Strategic Partnership
- Feb 02
- Fujitsu Launches Support Services for International Financial Reporting Standards
- Feb 02
- Mitsubishi Electric Announces Consolidated Financial Results for the First 9 Months and Third Quarter of Fiscal 2010.
- Feb 02
- NEC Electronics and KWest Introduce EMMA Mobile(TM) 1 Turnkey Design for Multimedia Web Tablets and Advanced Remote Control Functionality
- Feb 02
- NTT Com: Financial Results for the Third Quarter of the fiscal year ending March 31, 2010(From April 1, 2009 to December 31, 2009)
- Feb 02
- OKI Delivers "Next Generation Automated Gate System" to Immigration Bureau, the Ministry of Justice
- Feb 02
- Panasonic: WWF and Panasonic Start Yalu River Coastal Area Ecosystem Based Management Demonstration Project
- Feb 02
- Panasonic First out of the Gate with Blu-ray 3D(TM) Authoring Facility
- Feb 01
- Fujitsu and Cisco Create Unified Communications Environment for JGC
- Feb 01
- Fujitsu Releases Enhanced Product-Data Management System Solution
- Feb 01
- NEC supplies Greek Digital Network Operator Digea with DVB-T Transmitters
- Feb 01
- NEC to Exhibit LTE Concept Terminal at Mobile World Congress 2010
- Feb 01
- NEC Electronics and Renesas Announce the New Executive Team Following Merger
- Feb 01
- Renesas Technology: NEC Electronics and Renesas Announce the New Executive Team Following Merger
- Feb 01
- TDK Receives the Decision by the National Tax Tribunal on the Request for Reconsideration of Transfer Pricing Taxation
- Feb 01
- Tokyo Electron (TEL) Introduces "Trias e+" a New Cluster-Tool Platform for Single Wafer CVD Processes
- Feb 01
- Toshiba, JSW and Toshiba JSW Celebrate Cornerstone Laying Ceremony
