Companies - December 2009
- Dec 29
- Sumitomo Chemical: Proposed Agreement Regarding Comprehensive Business Tie-up with Nufarm
- Dec 28
- Fujitsu Launches Cloud-based Services to Support End-User ICT
- Dec 28
- Pioneer Announces Status of Postponement of Issuance of New Shares Through Third-Party Allotment
- Dec 28
- Sharp Establishes Consumer Electronics and Office Equipment Sales Subsidiary in Mexico
- Dec 28
- Sharp Establishes Consumer Electronics and Office Equipment Sales Subsidiary in Mexico
- Dec 25
- Canon: Notice regarding final agreement for transfer of Canon's semiconductor equipment business operations
- Dec 25
- DISCO: Results of 2009 DISCO Customer Satisfaction Survey has been updated.
- Dec 25
- Elpida Memory Announces Management Personnel and Organizational Changes
- Dec 25
- JEITA: Domestic Shipments of Major Consumer Electronic Equipment (November 2009)
- Dec 25
- JEITA: Production by the Japanese Electronics Industry(October 2009)
- Dec 25
- NEC Announces Adjustment of Conversion Prices of 1.0% Unsecured Yen Convertible Bonds due 2011 and Zero Coupon Unsecured Euro Yen Convertible Bonds due 2010
- Dec 25
- NTT Com: New Cable Route Links Japan to Trans-Pacific Express
- Dec 25
- NTT DATA Issues Group CSR Report 2009
- Dec 25
- Panasonic Develops Direct Methanol Fuel Cell System With High Power Output and Durability
- Dec 25
- Panasonic Develops High-Capacity Lithium-Ion Battery Cells That Can Power Laptops and Electric Vehicles
- Dec 25
- RIKEN: New fluorescent proteins report electrical signals of brain cells
- Dec 25
- SANYO Announces 'eneloop music booster' Rechargeable DC9V Battery Unit for Music Devices
- Dec 25
- Sharp and Toyoda Gosei enter into LED and Laser Diode Patent Cross-Licensing Agreement
- Dec 25
- Tokyo Ohka Kogyo Co., Ltd. Will Exhibit at 11th IC PACKAGING TECHNOLOGY EXPO
- Dec 24
- Asahi Kasei: Integration of Bioprocess Businesses in North America
- Dec 24
- Asahi Kasei: Result of arbitration with CoTherix, Inc. of the US
- Dec 24
- Canon receives clearance from European Commission and Taiwanese competition authorities
- Dec 24
- NEC Electronics to Change Accounting Principles for Consolidated Financial Statements
- Dec 24
- NEC Electronics Revises Full-Year Forecasts In Accordance with Change in Accounting Principles
- Dec 24
- NEC Electronics Reports Quarterly Financial Results for the First Quarter Ended June 30, 2009 and the Second Quarter Ended September 30, 2009 Prepared in Accordance with Japanese GAAP
- Dec 24
- Panasonic: Announcement of the conclusion of a Business Transfer Agreement between Minebea Co., Ltd. and Panasonic Corporation regarding the transfer of Information Equipment Motor Business
- Dec 24
- RIKEN: The molecular origins of morphological diversity
- Dec 24
- Toshiba: Notice on appeal against a decision adopted by the European Commission
- Dec 22
- Canon Inc. to make OPTOPOL Technology S.A. of Poland a subsidiary
- Dec 22
- Canon receives clearance from the Swiss competition authorities
- Dec 22
- Elpida Begins Mass Production of 40nm 2-Gigabit DDR3 SDRAM
- Dec 22
- Honda Sets All-Time November Record for Auto Production in Asia and China
- Dec 22
- Mitsubishi Electric to Ship InGaP HBT Power Amplifier for WiMAX Terminals.
- Dec 22
- Renesas Technology: Conclusion of Absorption-type Company Split Agreement
- Dec 21
- Canon: U.S. waiting period expired without second request
- Dec 21
- Mitsubishi Electric to Repurchase Own Shares.
- Dec 21
- Mitsubishi Electric: SPC Electronics to Become Wholly-owned Subsidiary of Mitsubishi Electric through Share Exchange.
- Dec 21
- NEC: Regarding the Establishment of NEC CASIO Mobile Communications, Ltd.
- Dec 21
- Nikon: NASA Orders D3S Digital SLR Cameras and Interchangeable Lenses from Nikon
- Dec 21
- NTT DATA: Notice Regarding Capital and Business Alliance Agreement with NJK Corporation and Commencement of Tender Offer for Shares of NJK Corporation
- Dec 21
- Panasonic Announces Proposed Management Changes
- Dec 21
- Panasonic: SANYO Becomes A Panasonic Company
- Dec 21
- SANYO Becomes A Panasonic Company
- Dec 21
- SANYO: Notice Concerning Change of Parent Company
- Dec 21
- SANYO Completes All Series 1 Class A and Series 1 Class B Preferred Share Conversions
- Dec 21
- SANYO Announces Personnel Changes
- Dec 21
- Selete: Verification of Threshold Voltage Variation ofn Scaled Transistors with Ultralarge-Scale Device Matrix Array Test Element Group
- Dec 18
- Fujitsu Launches SaaS-based Hotel Management and Reservations Service
- Dec 18
- Mitsui Chemical: Fundamental Agreement to Integrate Film/Sheet Business
- Dec 18
- NEC Announces Final Number of New Shares to Be Issued by Way of Third-Party Allotment
- Dec 18
- NEC Electronics Introduces Eight New 8-bit Body Control MCUs with Industry's Leading Low Standby Power Consumption for Low-End Automotive Applications
- Dec 18
- NEC Electronics: WD and NEC Electronics Collaborate to Promote SuperSpeed USB 3.0 Standard with New Storage Interface Technology
- Dec 18
- Panasonic Starts Mass-Production of High-Capacity 3.1 Ah Lithium-ion Battery
- Dec 18
- Pioneer Announces it has Reached Agreement with Honeywell
- Dec 18
- SDK Concludes License Agreement with UDC Concerning Organic EL Technology for White Lighting Applications
- Dec 18
- Sharp Introduces New Lineup of Nine High Color Rendering LED Lighting Devices in Two Package Styles
- Dec 18
- Sharp: An Alliance of Global Companies to participate in the Smart City Project Opening at the Kashiwanoha Campus, working to become a Next-generation Environmental City
- Dec 18
- Sony and PGA TOUR Partnering to Bring Golf Entertainment Experiences to Consumers in 3D
- Dec 18
- SONY and RealD PARTNER TO BRING 3D TO THE HOME
- Dec 18
- Shin-Etsu Chemical: Uploaded Environment and Social Report 2009
- Dec 17
- Asahi Glass: Changes in the Representative Directors
- Dec 17
- Asahi Glass: Changes in the Members of the Board of Directors,Corporate Auditors and Executive Officers
- Dec 17
- Canon: Settlement of patent infringement lawsuit for inkjet printer cartridges
- Dec 17
- Elpida Completes Development of 65nm XS Version 1-Gigabit DDR3 SDRAM
- Dec 17
- Fujitsu: Notice on Dissolution of Subsidiary
- Dec 17
- Hitachi: Determination of Number of New Shares to Be Issued by Way of Third-Party Allotment
- Dec 17
- JEITA: Electronics and Information Technology Industries in Japan 2009 Edition
- Dec 17
- KYOCERA Solar Modules Supply Approx. 40 MW at Large-Scale Solar Power Plants in Spain
- Dec 17
- NTT Com to Launch Online Sales-Recommendation Service
- Dec 17
- DOCOMO Introducing Remote Radio Equipment for LTE Base Stations
- Dec 17
- TDK: Sample kit for combined ESD and RFI protection (TDK-EPC Corporation)
- Dec 16
- Alps Electric: Development and Mass Production of the HSPPA Series Piezoresistive Type Waterproof MEMS Pressure Sensor (to Detect Absolute Pressure)
- Dec 16
- Fujitsu: DOCOMO & Fujitsu Develop Counter-Failure Technologies for IP Networks
- Dec 16
- Fujitsu Upgrades 3D Mechanical CAD Software
- Dec 16
- JEITA: 2010 Production Forecasts for the Global Electronics and Information Technology Industries (December 2009)
- Dec 16
- NTT Com to Establish Global IP-VPN POP in India and Enhance Service in New Zealand
- Dec 16
- DOCOMO & Fujitsu Develop Counter-Failure Technologies for IP Networks
- Dec 16
- RIKEN: Global Alliance for Pharmacogenomics Adds Five New Projects
- Dec 15
- Asahi Glass: Change of Successor of Equity in Hunan HEG Electronic Glass Co., Ltd. and Signing of the Equity Transfer Agreement
- Dec 15
- Fujitsu Joins United Nations Global Compact
- Dec 15
- KYOCERA to Provide 13 Megawatts of Solar Modules for One of Japan's Largest Solar Installations
- Dec 15
- NEC Electronics and Renesas Sign Merger Agreement
- Dec 15
- Renesas Technology: NEC Electronics and Renesas Sign Merger Agreement
- Dec 15
- SDK to Merge with Showa Highpolymer
- Dec 15
- Toppan Demonstrates Electronic Paper Driven by Solution-processed Oxide Semiconductor TFT
- Dec 15
- Toshiba Launches Highest Density Embedded NAND Flash Memory Modules
- Dec 14
- Canon: Good progress on the preparations of the public offer for Océ
- Dec 14
- CRIEPI: The homepage of Energy Engineering Research Laboratory opens
- Dec 14
- DISCO responds to the new-type influenza (swine influenza) occurrence (update)
- Dec 14
- Mitsubishi Electric Receives 2nd Diamond Vision Display Order from Hakodate Racecourse.
- Dec 11
- Epson's Environmental Story Continues at the Eco Products Exhibition 2009
- Dec 11
- Fujitsu Succeeds in World's First Operation of 100W-Class Amplifiers Employing Carbon Nanotubes for Next-Generation Mobile Base Stations
- Dec 11
- Hitachi: Determination of Number of New Shares to Be Issued in an Offering of New Shares
- Dec 11
- NEC Successfully Integrates NanoBridge in the Cu Interconnects of Si LSI
- Dec 11
- NEC Electronics Introduces Four New 8-bit LCD Microcontrollers with Integrated Metrology Engine for Smart Electricity Meters
- Dec 11
- Sumitomo Chemical: The R&D Rerpot "SUMITOMO KAGAKU 2009-II" has been published
- Dec 10
- ALPS ELECTRIC: Development and Mass Production of the HSCD Series 3-axis Geomagnetic Sensor with Angular Velocity Detection
- Dec 10
- NEC and NEC Electronics Develop High Threshold Voltage Control Gallium Nitride (GaN) Power Transistor on a Silicon (Si) Substrate
- Dec 10
- NEC Deploys New Digital Terrestrial TV Transmitters for One of the UK's Leading Broadcasting Companies
- Dec 10
- NEC Electronics: NEC and NEC Electronics Develop High Threshold Voltage Control Gallium Nitride (GaN) Power Transistor on a Silicon (Si) Substrate
- Dec 10
- NEC Electronics Announces Development of a New Low-Resistance Cu Interconnects Technology for High-Frequency Operations in Low-Power 40nm CMOS Devices
- Dec 10
- NEC Electronics Introduces 6 New 8-bit All FlashTM Microcontrollers for Interdependent Control of Digital AV Applications
- Dec 10
- Nikon: AF-S NIKKOR 300mm f/2.8G ED VR II and AF-S Teleconverter TC-20E III
- Dec 10
- NTT Com MUSICO Joins UNICEF Charity Project- Saving Children through "HAPPY BIRTHDAY DOWNLOAD for children"
- Dec 10
- Panasonic Announces the Result of Tender Offer for SANYO Shares
- Dec 10
- Renesas Technology Introduces Industry's Highest Level Performance Ternary Content Addressable Memory (TCAM) Family Designed for Multi-Layer Packet Processing in Networking Equipment such as Routers and Switches
- Dec 10
- SANYO: Notice Concerning Change Regarding "Other Related Companies," Top Stockholder that is a Major Stockholder, and Major Stockholders
- Dec 10
- SANYO's Project to Transform its Kasai Plant into an Eco-friendly Plant Selected as One of "Model Projects Promoting Low CO2 Emissions" by MLIT
- Dec 09
- Canon Toner Cartridge Recycling Program approaches 20 year milestone
- Dec 09
- Hitachi Acquires Software Assets Related to Next-Generation Mobile Communication Systems From Nortel Networks
- Dec 09
- NEC Selected by NTT DOCOMO to Provide Operations Support Systems (OSS)
- Dec 09
- Panasonic to Showcase Ecological Lifestyle At Eco-Products 2009
- Dec 09
- ROHM ECOMOS(TM) Efficiently Handles Reduced Supply Voltages in Portables
- Dec 09
- Toshiba Develops High Performance CMOS Device Technology for 20nm Generation LSI
- Dec 08
- Pioneer Establishes Joint Venture with Shanghai Automotive Industry Corporation (Group)
- Dec 08
- SDK Announces Revised Performance Forecast for 2009
- Dec 08
- SDK Achieves Very High Surface Smoothness in SiC Epitaxial Wafers
- Dec 08
- Toshiba develops essential technology for spintronics-based MOS field-effect transistor
- Dec 07
- Asahi Kasei: Home Order Trends – November 2009
- Dec 07
- Fujitsu Expands Green IT Initiative Globally
- Dec 07
- Hitachi: Determination of Offer Price and Selling Price for Issuance and Sale of Shares and Conversion Price and Other Conditions for Issuance of Convertible Bond Type Bonds with Stock Acquisition Rights
- Dec 07
- JEITA: Imports of Electronics into Japan(September 2009)
- Dec 07
- JEITA: Exports of Electronics from Japan(October 2009)
- Dec 07
- Panasonic Develops A Gallium Nitride (GaN) Inverter IC for Motor Drive with High Efficiency
- Dec 07
- Renesas Technology to Release DrMOS-Compliant R2J20653ANP for Notebook PC CPU Power Supplies with Industry's Top Power Supply Efficiency of 91%
- Dec 07
- TEL Announces Organizational Changes
- Dec 07
- ULVAC: INITIUM to launch a novel QCM Molecular Interaction Analyzer, AFFINIX QN Pro for properties change evaluation
- Dec 04
- Asahi Kasei: Issuance of unsecured straight bonds
- Dec 04
- Fujitsu's SAP System Solution First in Japan to Pass Compliance Test
- Dec 04
- Sharp to Exhibit Leading Environmental Technologies at Eco-Products 2009
- Dec 04
- Toshiba Opens Honorary Consulate of the Republic of Kazakhstan in Osaka
- Dec 03
- DOCOMO Secures 79.59 Percent of net mobile Shares
- Dec 03
- Mitsubishi Electric to Sell New-MPD Series of IGBT Modules
- Dec 03
- NEC rolls out the first commercial Femtocell Service for SFR in France
- Dec 03
- Nikon Introduces New Super Resolution Microscopes N-SIM/N-STORM
- Dec 03
- Pioneer and Suning Conclude a Strategic Alliance Pioneer and Suning Conclude a Strategic Alliance Agreement for the Home Electronics Business A new strategy for accelerating growth in the Chinese market
- Dec 03
- Sony and FIFA Announce the World's First 3D FIFA World Cup(TM)
- Dec 03
- Sony Introduces 3D, Network, CSR Activities Connected to the 2010 FIFA World Cup(TM)
- Dec 03
- TDK: Sample kit with SAW filters for advanced metering applications (TDK-EPC Corporation)
- Dec 03
- TEL Joins SEMATECH's Front End Processes Program at UAlbany NanoCollege
- Dec 02
- DISCO: Introducing the DFG8340, a grinder for processing ¦Õ8" wafers to an extremely precise degree of flatness
- Dec 02
- DISCO: Introducing the DAD342 for ¦Õ8" Wafers: Compact Dicing Saw with a Width of only 650 mm
- Dec 02
- DISCO: New products catalogs has been added.
- Dec 02
- Elpida Receives "2009 Global Warming Prevention Activity Award" from Japan's Ministry of the Environment
- Dec 02
- NEC Electronics and Soundpower Corp. Unveil Battery-Free Remote Control For Home Electric Appliances
- Dec 02
- OMRON Releases Vision Sensor Software for Glue Bead Inspection
- Dec 02
- SANYO: World First : SANYO Develops Inverter driven Commercial Freezer with CO2 Refrigerant
- Dec 01
- ALPS ELECTRIC: Basic Agreement on a Joint Feasibility Study for Magnetic Material and Thin-Film Process Technologies Business
- Dec 01
- Canon gives Notice to AFM of Acquired Shareholding in Océ
- Dec 01
- CRIEPI: Updated the pamphlet of Central Research Institute of Electric Power Industry
- Dec 01
- Fujitsu Introduces docomo SMART Series F-03B
- Dec 01
- Fujitsu Ladies Golf Tournament Supports Malaysia Reforestation Activities
- Dec 01
- Mitsubishi Materials: Execution of Share Exchange Agreement and Conversion of Mitsubishi Cable Industries into a Wholly Owned Subsidiary of Mitsubishi Materials Corporation
- Dec 01
- SUMCO: Results for the Third Quarter of Fiscal Year 2009 (ending January 31, 2010) Supplementary Explanation Materials
- Dec 01
- SUMCO: Brief Statement on Consolidated Financial Results for the Third Quarter (ended October 31, 2009) of Fiscal Year 2009 (ending Janualy 31, 2010)
