Symposium Schedule

-Symposium At-a-Glance
-Schedule of Presentations and Speakers
-AEC/APC Symposium Asia 2009 Poster Session
-AEC/APC Symposium Asia 2009 Poster Session Layout

Symposium At-a-Glance

* The program is subject to change

Schedule of Presentations and Speakers

Monday, November 09, 2009

09:00 AM	Registration
09:30 AM	Opening Remarks Michio Honma NEC Electronics/Co-chair of AEC/APC Asia Organizing Committee Bradley Van Eck ISMI/Co-chair of AEC/APC Asia Organizing Committee
09:35 AM	Program Outline Masafumi Shishino Panasonic/Co-chair of AEC/APC Asia Program Committee
09:40 AM	Tutorial: Solving Quality Problems with Multivariate Data Analysis: Basics and Applications Presenter: Dr. Manabu Kano, Kyoto University View Abstract
11:05 AM	Keynote: Strategic Approach through Equipment Engineering System (EES) at Sony Semiconductor Kyushu Presenter: Mr. Masanori Okayama, Sony Semiconductor Kyushu View Abstract
11:35 AM	Best paper: Prediction of Gate Oxide Thickness using Virtual Metrology Technology Presenter: Satoshi Yasuda, Panasonic View Abstract
12:00 PM	Lunch
	Equipment and Process Fault Detection, Classification and Prediction (FD)
13:00 PM	The way to improve the effectiveness of a comprehensive FD system Presenter: Katsuhisa Sakai, Renesas Technology View Abstract
13:25 PM	Anomaly Detection Using Average Normal Profile of Time-Series Process Data Presenter: Toru Kashima, Yamatake Corporation View Abstract
13:50 PM	Full-line FDC Diagnosis System via Signals Similarity Measure Presenter: Tzu-Cheng Lin, Dept. of Electrical and Control Engineering. National Chiao Tung University View Abstract
14:15 PM	Predictive Modeling for Intelligent Maintenance in Complex Semiconductor Manufacturing Process Presenter: Jun Ni, University of Michigan-Ann Arbor View Abstract
14:40 PM	Online Deployment of Robust Metrology Prediction Model Presenter: Hideki Matsuhashi, PDF Solutions View Abstract
15:05 PM	Coffee Break, Author's Interview, Poster Session, Supplier Exhibition
	Data Management and Process Control (DM)
15:35 PM	Development of gate length feedforward technology for Vtp fluctuation reduction Presenter: Fumitoshi Kawase, Panasonic View Abstract
16:00 PM	A Study of the CMP(Chemical Mechanical Process) Simulation using FEM(Finite Element Method) and the non-linear Run-to-Run Control Algorithm Presenter: Cheong-Sool Park, Korea University View Abstract
	Metrology, Sensors and Analytics (MS)
16:25 PM	Abnormal plasma detection by non-linear time series analysis Presenter: Tsuyoshi Moriya, Tokyo Electron View Abstract
16:50 PM	VM Capability Evaluation on Neural Network and PLS Presenter: Tomonori Kishimoto, Micron Technology View Abstract
17:15 PM	Characterization Algorithm of Equipment-caused Particle Trends for LSI Yield Improvement Presenter: Masaaki Sugimoto, NEC Electronics View Abstract
	Fab-wide AEC, APC, Yield and "Multi-fab" Approaches (FW)
17:40 PM	EES Analysis of Candidate Apparatus with Trouble Extracted by MapSSA Presenter: Hiroshi Matsushita, Toshiba View Abstract
18:05 PM	Closing Remark
	Author's Interview, Poster Session, Supplier Exhibition
18:20 PM	Reception
20:00 PM	Program End

AEC/APC Symposium Asia 2009 Poster Session

Title	Author	Affiliation
Case Studies in Run-to-Run Control and Fault Detection for Flat Panel Display Manufacturing View Abstract	Scott Bushman	Applied Materials
Fault Detection and R2R Control Solutions Applied to Large Flat Panel Display Manufacturing View Abstract	Kyoung Shik Jun	Applied Materials
Study of adaptive model predictive control algorithm for efficient control of semiconductor process View Abstract	Sang-Hoon Park	BISTEL INC
Vibration management effects on productivity View Abstract	Yukinobu Hayashi	CyberOptics Semiconductor Inc
Hermeticity inspection for wafer bonding process of MEMS Device View Abstract	Hiromi Shima	Freescale Semiconductor
Use of Graphical Model to Analyze Cause of Faults in Plasma Processes View Abstract	Takehisa Iwakoshi	Hitachi, Ltd.
Development of fully automated in-line VPD-ICP-MS View Abstract	Sungjae Lee	IAS Inc.
Sense and Respond Framework for AEC/APC View Abstract	Masahide Hirouchi	IBM
Building factory level data collection framework for APC/FDC applications View Abstract	Chikafumi Tsuchiya	IBM Japan Services Company Ltd.
A NOVEL APPROACH TO VISUALIZING MANUFACTURING DATA: FROM ANALYSIS TO DIAGNOSTIC View Abstract	Franck Gasnier	KLA-Tencor Japan Ltd.
Hierarchical Sequential Partial Least Square Modeling for Determining Yield and Critical Process Steps in Device Manufacture View Abstract	Hideaki Ogihara	MKS Japan, Inc.
Virtual yield indicator using in situ particle monito View Abstract	Masahiro Shioya	Renesas Technology Corp.
A study of efficient data processing method for full scale equipment log data usage in various analysis activities View Abstract	Masahiko Minamide	Selete
Equipment internal action and productivity analysis (Loss analysis concerning 1st Wafer Delay using log file of photolithography machine) View Abstract	Tatsuo Sakai	Selete
Multiscale-Multiway PCA for time-series-data in production process View Abstract	Keisuke Nogami	Toshiba
Organized DFM for total optimization in semiconductor manufacturing View Abstract	Takashi Sato	Toshiba
Skewness and Kurtosis Risks of Lot Acceptance Sampling Inspection for Semiconductor Manufacturing View Abstract	Takahiro Ikeda	Toshiba
Optimal Process Parameter Extraction with Quality Engineering View Abstract	Nobuichi Kuramochi	Toshiba Corporation Semiconductor Company
Interactive Operation Cost Monitoring and Analysing Tool View Abstract	Ian Kree Anak Ensalie @ Mambak	X-FAB Sarawak Sdn Bhd