Call for paper
Abstract submission has been closed on June 30, 2009.
CFP English Version
CFP 日本語版
Abstract Template
Scope of the Symposium
This Call for Paper is directed to the semiconductor community. Other relevant industries employing AEC/APC, semiconductor equipment suppliers, software suppliers, sensors and metrology suppliers may also submit abstracts.
Important Dates
| Abstract Submission Start: | May 15, 2009 |
| Abstract Submission Due: | June 30, 2009 |
| Notification of Acceptance: | August 21, 2009 |
| Selected Final Presentation Due: | October 15, 2009 |
Areas of Interest
- Equipment and Process Fault Detection, Classification and Prediction
- Data Management and Process Control
- Metrology, Sensors, and Analytics
- Fab-wide APC, Yield and APC, Yield and "Multi-fab" Approaches
- Standard and Roadmaps
- Future Needs and Opportunities
Online Submission
Abstract Submission Procedure:
- Prospective authors are requested to submit the abstract through web browser, consisting of exactly two pages of A4-paper size.
- The first page consists of the text (max of 1,000 words) and the second page consists of figures, supporting data, charts, photos and drawings.
- Only MS Word and JPEG/GIF files are compatible.
- The abstract must be written in English, using online abstract submission form.
-
Submit electronically before June 30, 2009.
Submission information, templates, and other details are available on the website:
http://www.semiconportal.com/AECAPC/cfp.html
Additional Details for the Areas of Interest
FD: Equipment and Process Fault Detection, Classification and Prediction
- Fault detection and classification
- Statistical process control
- Analysis and prediction
- Fault models
- Defect management
- Environmental impacts
DM: Data Management and Process Control
- Data mining
- Real-time data
- Data compression
- Data collection frequency
- Run-to-run/wafer-to-wafer control
- Process models
- Model-based control
- e-diagnostics
MS: Metrology, Sensors, and Analytics
- Integrated metrology
- In-situ monitoring
- Sensors and measurement tools
- Virtual metrology
- Sensor calibration and matching
- Calibration materials and procedures
- Hardware solutions
- Software
- Standard interfaces integration of metrology
- Sampling plan and analytics in production
FW: Fab-wide APC, Yield and APC, Yield and "Multi-fab" Approaches
- High volume vs. modular fabs,
- Cost modeling and cost reduction,
- OEE,
- Productivity analysis
- e-manufacturing
- Data mining of defect densities and PCM
- Yield improvement
- Yield models and usage in APC environment
- Usage of APC data for yield prediction and correlation
- Technology & process transfer incl. APC
- Systems communality
- Fab clusters & foundry business aspects
- IP considerations and recipe management
SR: Standard and Roadmaps
- Roadmaps (e.g., ITRS)
- Application of standards (e.g., DDA, PCS)
- Process control capabilities
- Interface A and Tool Data Interface (TDI)
FN: Future Needs and Opportunities
- Linking APC with design-for-manufacturability (DFM)
- Use of inputs about process variability for the design process
- Use of inputs from the design process for acceptable process variability
- Utilization of APC infrastructure for supply chain management
- Opportunities for APC for incoming material control
