Symposium Schedule
| 9:15 | Registration Starts / Door Open |
| Session Chair: Toshiya Hirai, Murata Manufacturing | |
| 9:45 | Opening Remarks from AEC/APC Asia Hidetaka Nishimura Renesas Electronics |
| 9:50 | Program Outline Hidenori Kakinuma Kioxia |
| 9:55 | Tutorial-1 Semantic Web Technologies for data Interoperability: Ontology, Schema, and Linked DataProf. Hideaki Takeda, Dr.,Eng. National Institute of Informatics View Abstract |
| Session Co-chairs: Takahiro Tsuchiya, United Semiconductor Japan / Senichi Nishibe, KLA-Tencor Japan | |
| 10:40 | [TDA-O-13] Precise In-situ Detection of Wafer Film Thickness by Tilting Light Irradiation Soichiro Eto Hitachi View Abstract |
| 11:00 | [TDA-O-14] RIE Equipment Control by Cross-sectional Trench Area Prediction Xueting Wang TOSHIBA ELECTRONIC DEVICES & STORAGE View Abstract |
| 11:20 | [TDA-O-15] Wafer warpage classification adapted to pragmatic equipment operation Motoi Okada Tokyo Electron View Abstract |
| 11:40 | [TDA-O-20] FDC of Wafer Handling Robot Based on Neural Network with Harmonic Sensor Kenta Kamizono Panasonic View Abstract |
| 12:00 | Lunch Break & Supplier Exhibition |
| Session Chair: Takashi Kurosawa, Azbil | |
| 12:55 | Introduction for Posters (3mins Summary Presentation) |
| [TDA-P-12] Improving Root Cause Analysis Accuracy Using Advanced Sensor Trace Analytics Tom Ho BISTel America View Abstract |
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| [TDA-P-24] Performance Evaluations of VM models of Multi-dimensional quality: Open data applications Huizhen Bu Tsukuba Univ. |
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| [TDA-P-25] Digitalization of Factory utilized embedded Artificial Intelligence (e-AI) Toshiki Ono Renesas Electronics |
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| Session Chair: Shunichi Shibuki, Sony Semiconductor Manufacturing | |
| 13:10 | Keynote The manufacturing and future of Sony CMOS Image SensorMr.Shingo Kadomura Sony Semiconductor Manufacturing View Abstract |
| Session Co-chairs: Hisato Tanaka, Tokyo Electron / Tomoya Tanaka, TowerJazz Panasonic Semiconductor | |
| 13:55 | [TDA-O-11] Optimizing Production Performance Through Trace-level Chamber Analysis Tom Ho BISTel America View Abstract |
| 14:15 | [TDA-O-22] Robust Estimation of Mixed-Type Wafer Map Similarity Utilizing Non-negative Matrix Factorization Yukako Tanaka Kioxia View Abstract |
| 14:35 | [TDA-O-23] Integrated 2D quality VM modeling: Upscaling and evaluations of High-dimension Low-samples Huizhen Bu Tsukuba Univ. |
| 14:55 | [MPC-O-17] Endpoint Prediction for ICP Etching Process with Smart VM Method Junya Nishiguchi Azbil View Abstract |
| 15:15 | Supplier Exhibition / Coffee Break |
| Session Chair: Koh Horimoto, IBM Japan Services | |
| 15:40 | Tutorial-2 Secured and Operation Oriented Recipe Management on SEMI StandardOsamu Ohishi IBM Japan Services View Abstract |
| Session Co-chairs: Koichi Sakamoto, Tokyo Electron / Kazutaka Nagashima, Toshiba Electronic Devices & Storage | |
| 16:25 | [EPC-O-18] Adaptive Re-tuning of PID Parameters by Health Indexes Naotoshi Taniguchi Azbil View Abstract |
| 16:45 | [EPC-O-19] Implementation of VM-APC Automated Execution System for Cu-CMP Process Masatoshi Ikeda Sony Semiconductor Manufacturing View Abstract |
| 17:05 | [EPC-O-21] In-house development of Lithography Metrology Tools Recipe Validation System to ensure Recipe Integrity and Data feedforward to Process APC Systems Yap Hoon Lian Global Foundries View Abstract |
| 17:25 | [APC-O-16] All roads leads to the Environment George Hoshi Tokyo Electron View Abstract |
| 17:45 | Closing |
| Session Chair: Koichi Sakamoto, Tokyo Electron | |
| 18:00 | Poster Session / Author??s Interview / Supplier Exhibition |
| 18:30 | Reception Award (Best Paper, Best Poster, Student) Hidenori Kakinuma, Kioxia |
| 19:30 | Closing |
